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Journal Articles

Liquid-to-Air Coolant Distribution Units Performance and Considerations for Server Rooms Upgrade With Conventional Air Conditioning

Ali Heydari, Qusai Soud, Mohammad Tradat, Ahmad R. Gharaibeh, Najmeh Fallahtafti, Jeremy Rodriguez, Bahgat Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041106.
Paper No: EP-24-1021
https://doi.org/10.1115/1.4065942
Published Online: July 26, 2024
View Article titled, Liquid-to-Air Coolant Distribution Units Performance and Considerations for Server Rooms Upgrade With Conventional Air Conditioning
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Topics: Air conditioning, Coolants, Cooling, Temperature, Vehicles, Stress, Heat, HVAC equipment, Noise (Sound), Flow (Dynamics)
Journal Articles

Special Section on InterPACK 2013

Satish Chaparala, Ashish Gupta, Nils Hoivik, Y. C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Editorial
J. Electron. Packag. December 2014, 136(4): 040201.
Paper No: EP-14-1070
https://doi.org/10.1115/1.4028390
Published Online: September 19, 2014
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Topics: Copper, Design, Electronic packaging, Engineering mechanics, Manufacturing, Packaging, Reliability, Sensors, Silicon, Thermal management
Journal Articles

Analytical Modeling for Thermodynamic Characterization of Data Center Cooling Systems

Madhusudan Iyengar, Roger Schmidt
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021009.
https://doi.org/10.1115/1.3103952
Published Online: April 2, 2009
View Article titled, Analytical Modeling for Thermodynamic Characterization of Data Center Cooling Systems
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Topics: Cooling, Data centers, Flow (Dynamics), Heat, Temperature, Water, Energy consumption, Heat transfer, Coolants, Cooling towers