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Journal Articles

Process Development for Printed Copper With Surface Mount Devices on Inkjet Metallization

Pradeep Lall, Kartik Goyal, Curtis Hill

J. Electron. Packag. June 2023, 145(2): 021011.

Paper No: EP-22-1029

DOI: https://doi.org/10.1115/1.4055986

Published Online: November 23, 2022

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Topics: Copper, Sintering, Surface mount devices, Electrical resistivity, Printing, Drops, Electronics

Journal Articles

Effective Constitutive Relations for Sintered Nano Copper Joints

Sanoop Thekkut, Rajesh Sharma Sivasubramony, Arun Raj, Yuki Kawana, Jones Assiedu, Kabir Mirpuri, Ninad Shahane, Patrick Thompson, Peter Borgesen

J. Electron. Packag. June 2023, 145(2): 021010.

Paper No: EP-22-1043

DOI: https://doi.org/10.1115/1.4056113

Published Online: November 11, 2022

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Topics: Constitutive equations, Copper, Creep, Deformation, Diffusion (Physics), Oxidation, Stress, Temperature, Transients (Dynamics), Sintering

Journal Articles

Performance Analysis of Corrosion Resistant Electroless Nickel-Plated Impinging Computer Numerical Control Manufactured Liquid Cooling Cold Plate

Vahideh Radmard, Ahmad R. Gharaibeh, Mohammad I. Tradat, Cong. H. Hoang, Yaman Yaseen Manaserh, Kourosh Nemati, Scott N. Schiffres, Bahgat G. Sammakia

J. Electron. Packag. June 2023, 145(2): 021001.

Paper No: EP-22-1003

DOI: https://doi.org/10.1115/1.4054972

Published Online: August 8, 2022

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Topics: Computers, Cooling, Copper, Corrosion, Nickel plating, Plates (structures), Pressure drop, Temperature, Thermal resistance, Flow (Dynamics)

Journal Articles

Accelerated Solder Interconnect Testing Under Electromigratory and Mechanical Strain Conditions

Mahsa Montazeri, Whit M. Vinson, David R. Huitink

J. Electron. Packag. June 2023, 145(2): 021002.

Paper No: EP-22-1037

DOI: https://doi.org/10.1115/1.4055024

Published Online: August 8, 2022

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Topics: Electrodiffusion, Failure, Solder joints, Solders, Stress, Temperature, Tension, Testing, Current density, Tin

Journal Articles

Phase Change Material Behavior in Finite Thickness Slabs Under a Step Response Heat

Michael Deckard, Darin J. Sharar, Michael Fish, Patrick J. Shamberger

J. Electron. Packag. March 2023, 145(1): 011201.

Paper No: EP-21-1153

DOI: https://doi.org/10.1115/1.4054651

Published Online: July 7, 2022

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Topics: Heat, Phase change materials, Steady state, Temperature, Transients (Dynamics), Melting, Copper, Heat sinks, Tradeoffs, Simulation

Journal Articles

Research on Reliability of Ni/Sn/Cu(Ni) Copper Pillar Bump Under Thermoelectric Loading

Junjie Dai, Yuexin Zhang, Zhankun Li, Mingming Chen, Yuhua Guo, Zhekun Fan, Junhui Li

J. Electron. Packag. September 2022, 144(3): 031014.

Paper No: EP-21-1121

DOI: https://doi.org/10.1115/1.4053889

Published Online: March 8, 2022

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Topics: Columns (Structural), Copper, Current density, Flip-chip devices, Solder joints, Solders, Temperature, Tin, Joules, Reliability

Journal Articles

Microflow-Enhanced Bubble Dynamics Along With Gradient Porous Surfaces

Cheng-Hui Lin, Yoonjin Won

J. Electron. Packag. December 2021, 143(4): 041112.

Paper No: EP-21-1105

DOI: https://doi.org/10.1115/1.4052790

Published Online: November 9, 2021

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Topics: Boiling, Bubbles, Critical heat flux, Electrodeposition, Heat transfer, Copper, Dynamics (Mechanics), Microscale devices, Fins, Flow (Dynamics)

Includes: Supplementary data

Journal Articles

Effect of Phase Change Material on Dynamic Thermal Management Performance for Power Electronics Packages

Justin Hollis, Darin J. Sharar, Todd Bandhauer

J. Electron. Packag. December 2021, 143(4): 041111.

Paper No: EP-21-1103

DOI: https://doi.org/10.1115/1.4052669

Published Online: November 5, 2021

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Topics: Copper, Cycles, Junctions, Phase change materials, Temperature, Heat, Composite materials, Transients (Dynamics), Thermal management, Cities

Journal Articles

A Novel Package-Integrated Cyclone Cooler for the Thermal Management of Power Electronics

Rinaldo Miorini, Darin Sharar, Arun Gowda, Cathleen Hoel, Bryan Whalen, Peter de Bock

J. Electron. Packag. June 2022, 144(2): 021105.

Paper No: EP-21-1012

DOI: https://doi.org/10.1115/1.4052071

Published Online: September 24, 2021

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Topics: Additive manufacturing, Bubbles, Ceramics, Cooling, Critical heat flux, Design, Electronics, Flow (Dynamics), Fluids, Heat

Journal Articles

Inelastic Deformation of Copper Nanoparticle Based Joints and Bonds

Sanoop Thekkut, Maan Zaid Kokash, Rajesh Sharma Sivasubramony, Yuki Kawana, Kabir Mirpuri, Ninad Shahane, Patrick Thompson, Christopher M. Greene, Peter Borgesen

J. Electron. Packag. September 2022, 144(3): 031009.

Paper No: EP-21-1076

DOI: https://doi.org/10.1115/1.4051728

Published Online: September 15, 2021

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Topics: Creep, Deformation, Diffusion (Physics), Dislocations, Stress, Temperature, Annealing, Nanoparticles, Particulate matter, Copper

Journal Articles

High-Performance Planar Thermal Diode With Wickless Components

George Damoulakis, Mohamad Jafari Gukeh, Theodore P. Koukoravas, Constantine M. Megaridis

J. Electron. Packag. September 2022, 144(3): 031004.

Paper No: EP-21-1020

DOI: https://doi.org/10.1115/1.4051467

Published Online: September 15, 2021

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Topics: Heat, Vapors, Temperature, Thermal resistance, Heat transfer, Condensation, Copper

Journal Articles

Effects of Gaseous and Particulate Contaminants on Information Technology Equipment Reliability—A Review

Satyam Saini, Jimil M. Shah, Pardeep Shahi, Pratik Bansode, Dereje Agonafer, Prabjit Singh, Roger Schmidt, Mike Kaler

J. Electron. Packag. September 2022, 144(3): 030801.

Paper No: EP-20-1054

DOI: https://doi.org/10.1115/1.4051255

Published Online: September 15, 2021

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Topics: Contamination, Corrosion, Data centers, Particulate matter, Reliability, Temperature, Copper, Silver, Failure

Journal Articles

Experimental Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics

Omidreza Ghaffari, Wei Tong, Yaser Nabavi Larimi, Chady al Sayed, Alireza Ganjali, Jean-François Morissette, Francis Grenier, Simon Jasmin, Luc Fréchette, Julien Sylvestre

J. Electron. Packag. December 2021, 143(4): 041103.

Paper No: EP-21-1083

DOI: https://doi.org/10.1115/1.4051943

Published Online: August 27, 2021

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Topics: Boiling, Cooling, Dielectric liquids, Heat, Temperature, Copper, Flat heat pipes, Pool boiling, Critical heat flux, Subcooling

Journal Articles

Fatigue Testing of Copper Nanoparticle-Based Joints and Bonds

Rajesh Sharma Sivasubramony, Maan Zaid Kokash, Sanoop Thekkut, Ninad Shahane, Patrick Thompson, Kabir Mirpuri, Yuki Kawana, Christopher M. Greene, Peter Borgesen

J. Electron. Packag. March 2022, 144(1): 011007.

Paper No: EP-20-1120

DOI: https://doi.org/10.1115/1.4050871

Published Online: August 6, 2021

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Topics: Annealing, Cycles, Damage, Deformation, Dislocations, Fatigue, Fatigue life, Nanoparticles, Particulate matter, Shear strength

Journal Articles

Heat Transfer Enhancement Through Array Jet Impingement on Strategically Placed High Porosity High Pore-Density Thin Copper Foams

Varun Prasanna Rajamuthu, Sanskar S. Panse, Srinath Ekkad

J. Electron. Packag. September 2021, 143(3): 031003.

Paper No: EP-20-1090

DOI: https://doi.org/10.1115/1.4049173

Published Online: January 19, 2021

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Topics: Density, Foams (Chemistry), Heat transfer, Porosity, Reynolds number, Metal foams, Copper, Flow (Dynamics), Jets

Journal Articles

Design, Analysis, Comparison, and Experimental Validation of Insulated Metal Substrates for High-Power Wide-Bandgap Power Modules

Emre Gurpinar, Burak Ozpineci, Shajjad Chowdhury

J. Electron. Packag. December 2020, 142(4): 041107.

Paper No: EP-19-1131

DOI: https://doi.org/10.1115/1.4047409

Published Online: June 26, 2020

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Topics: Design, Energy gap, Heat, Junctions, Metals, MOSFET transistors, Steady state, Temperature, Thermal analysis, Transients (Dynamics)

Journal Articles

Interfacial Behavior of Flux Residues and Its Impact on Copper/Underfill Adhesion in Microelectronic Packaging

John S. Andre, Nathan Ulrich, Karen Ji, Zhan Chen

J. Electron. Packag. March 2021, 143(1): 011004.

Paper No: EP-19-1095

DOI: https://doi.org/10.1115/1.4047338

Published Online: June 4, 2020

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Topics: Adhesion, Copper, Flux (Metallurgy), Shear (Mechanics)

Journal Articles

Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA) With Through Silicon Via and Copper Pillar Bonding Approach

Leila Choobineh, Robert Carrol, Carlos Gutierrez, Robert Geer

J. Electron. Packag. September 2020, 142(3): 031106.

Paper No: EP-19-1098

DOI: https://doi.org/10.1115/1.4046848

Published Online: April 24, 2020

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Topics: Bonding, Columns (Structural), Copper, Design, Gates (Closures), Manufacturing, Modeling, Semiconductor wafers, Silicon, Tiles

Journal Articles

Atomic Study on Copper–Copper Bonding Using Nanoparticles

Xiaohui Song, Rui Zhang, Huadong Zhao

J. Electron. Packag. June 2020, 142(2): 021005.

Paper No: EP-19-1105

DOI: https://doi.org/10.1115/1.4046164

Published Online: February 19, 2020

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Topics: Atoms, Bonding, Copper, Metals, Nanoparticles, Pressure, Temperature, Deformation, External pressure

Journal Articles

Microstructural Evolution and Protrusion Simulations of Cu-TSVs Under Different Loading Conditions

Jinxin Liu, Zhiheng Huang, Paul P. Conway, Yang Liu

J. Electron. Packag. March 2020, 142(1): 011009.

Paper No: EP-19-1058

DOI: https://doi.org/10.1115/1.4044648

Published Online: October 10, 2019

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Topics: Grain size, Shear (Mechanics), Simulation, Deformation, Reliability, Atoms, Simulation results, Copper

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Journal citation

NARROW

Supplemental Material

Process Development for Printed Copper With Surface Mount Devices on Inkjet Metallization

Effective Constitutive Relations for Sintered Nano Copper Joints

Performance Analysis of Corrosion Resistant Electroless Nickel-Plated Impinging Computer Numerical Control Manufactured Liquid Cooling Cold Plate

Accelerated Solder Interconnect Testing Under Electromigratory and Mechanical Strain Conditions

Phase Change Material Behavior in Finite Thickness Slabs Under a Step Response Heat

Research on Reliability of Ni/Sn/Cu(Ni) Copper Pillar Bump Under Thermoelectric Loading

Microflow-Enhanced Bubble Dynamics Along With Gradient Porous Surfaces

Effect of Phase Change Material on Dynamic Thermal Management Performance for Power Electronics Packages

A Novel Package-Integrated Cyclone Cooler for the Thermal Management of Power Electronics

Inelastic Deformation of Copper Nanoparticle Based Joints and Bonds

High-Performance Planar Thermal Diode With Wickless Components

Effects of Gaseous and Particulate Contaminants on Information Technology Equipment Reliability—A Review

Experimental Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics

Fatigue Testing of Copper Nanoparticle-Based Joints and Bonds

Heat Transfer Enhancement Through Array Jet Impingement on Strategically Placed High Porosity High Pore-Density Thin Copper Foams

Design, Analysis, Comparison, and Experimental Validation of Insulated Metal Substrates for High-Power Wide-Bandgap Power Modules

Interfacial Behavior of Flux Residues and Its Impact on Copper/Underfill Adhesion in Microelectronic Packaging

Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA) With Through Silicon Via and Copper Pillar Bonding Approach

Atomic Study on Copper–Copper Bonding Using Nanoparticles

Microstructural Evolution and Protrusion Simulations of Cu-TSVs Under Different Loading Conditions

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