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Journal Articles

Guidelines for Designing Micropillar Structures for Enhanced Evaporative Heat Transfer

Kidus Guye, De Dong, Yunseo Kim, Hyoungsoon Lee, Baris Dogruoz, Damena Agonafer
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041106.
Paper No: EP-21-1120
DOI: https://doi.org/10.1115/1.4052465
Published Online: October 13, 2021
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Topics: Design, Drops, Evaporation, Heat conduction, Heat transfer, Heat transfer coefficients, Optimization, Particle swarm optimization, Shapes, Vapors
Journal Articles

Multiscale Evaporation Rate Measurement Using Microlaser-Induced Fluorescence

Youngjoon Suh, Cheng-Hui Lin, Hamsa Gowda, Yoonjin Won
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031105.
Paper No: EP-19-1137
DOI: https://doi.org/10.1115/1.4046767
Published Online: April 17, 2020
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Topics: Evaporation, Fluorescence, Temperature, Vapors, Microscale devices
Includes: Supplementary data
Journal Articles

Numerical Investigation of Shape Effect on Microdroplet Evaporation

Li Shan, Shuai Shuai, Binjian Ma, Zichen Du, Baris Dogruoz, Damena Agonafer
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2019, 141(4): 041008.
Paper No: EP-19-1038
DOI: https://doi.org/10.1115/1.4044962
Published Online: October 18, 2019
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Topics: Diffusion (Physics), Drops, Evaporation, Vapors, Shapes, Simulation
Journal Articles

A Novel Activated Carbon Enabled Steam Generation System Under Simulated Solar Light

Ashreet Mishra, Agwu A. G. Nnanna
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031015.
Paper No: EP-18-1090
DOI: https://doi.org/10.1115/1.4044716
Published Online: September 24, 2019
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Topics: Activated carbon, Evaporation, Nanofluids, Nanoparticles, Steam, Sunlight, Water, Solar energy
Journal Articles

Evaporative Wicking Phenomena on Nanotextured Surfaces

Duong Vy Le, Quang N. Pham, Jonggyu Lee, Shiwei Zhang, Yoonjin Won
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031013.
Paper No: EP-18-1104
DOI: https://doi.org/10.1115/1.4044373
Published Online: September 19, 2019
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Topics: Copper, Evaporation, Flux (Metallurgy), Heat, Heat flux, Permeability
Journal Articles

Effect of Meniscus Recession on the Effective Pore Radius and Capillary Pumping of Copper Metal Foams

Mahmood R. S. Shirazy, Luc G. Fréchette
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2014, 136(4): 041003.
Paper No: EP-13-1098
DOI: https://doi.org/10.1115/1.4026353
Published Online: September 19, 2014
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Topics: Containers, Copper, Evaporation, Flux (Metallurgy), Foams (Chemistry), Heat, Heat losses, Porosity, Temperature, Ethanol
Journal Articles

Experimental Study of Damage Mechanism of Carbon Nanotube as Nanocomponent of Electronic Devices Under High Current Density

Kazuhiko Sasagawa, Kazuhiro Fujisaki, Jun Unuma, Ryota Azuma
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2014, 136(4): 041011.
Paper No: EP-13-1125
DOI: https://doi.org/10.1115/1.4026878
Published Online: September 19, 2014
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Topics: Carbon nanotubes, Current density, Damage, Multi-walled carbon nanotubes, Oxidation, Density, Electrodes, Atoms, Carbon, Evaporation
Journal Articles

Enhanced Electrical and Thermal Interconnects by the Self-Assembly of Nanoparticle Necks Utilizing Capillary Bridging

Thomas Brunschwiler, Gerd Schlottig, Songbo Ni, Yu Liu, Javier V. Goicochea, Jonas Zürcher, Heiko Wolf
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2014, 136(4): 041012.
Paper No: EP-13-1130
DOI: https://doi.org/10.1115/1.4028332
Published Online: September 19, 2014
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Topics: Cavities, Columns (Structural), Copper, Evaporation, Fillers (Materials), Nanoparticles, Particulate matter, Self-assembly, Silver, Temperature
Journal Articles

An Experimental Investigation of a High Flux Heat Pipe Heat Sink

H. B. Ma, K. P. Lofgreen, G. P. Peterson
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. March 2006, 128(1): 18–22.
DOI: https://doi.org/10.1115/1.2159004
Published Online: May 10, 2005
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Topics: Air flow, Condensers (steam plant), Design, Heat, Heat pipes, Heat sinks, Heat transfer, Temperature, Particulate matter, Evaporation
Journal Articles

Experimental Study on Electric-Current Induced Damage Evolution at the Crack Tip in Thin Film Conductors

A.-F. Bastawros, K.-S. Kim
Journal: Journal of Electronic Packaging
Article Type: Special Section Technical Papers
J. Electron. Packag. December 1998, 120(4): 354–359.
DOI: https://doi.org/10.1115/1.2792646
Published Online: December 1, 1998
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Topics: Damage, Electric current, Fracture (Materials), Thin films, Electrodes, Temperature, Aluminum, Melting, Brittle fracture, Coating processes
Journal Articles

Two-Phase Electronic Cooling Using Mini-Channel and Micro-Channel Heat Sinks: Part 2—Flow Rate and Pressure Drop Constraints

M. B. Bowers, I. Mudawar
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. December 1994, 116(4): 298–305.
DOI: https://doi.org/10.1115/1.2905701
Published Online: December 1, 1994
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Topics: Computer cooling, Flow (Dynamics), Heat sinks, Microchannels, Pressure drop, Geometry, Compressibility, Energy dissipation, Heat, Boiling