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Journal Articles

A Time Frequency Domain Based Approach for Ball Grid Array Solder Joint Fatigue Analysis Using Global Local Modeling Technique

Sushil Doranga, Dongji Xie, Jeffrey Lee, Andy Zhang, Xue Shi, Valeriy Khaldarov

J. Electron. Packag. September 2023, 145(3): 031007.

Paper No: EP-22-1070

DOI: https://doi.org/10.1115/1.4056886

Published Online: March 7, 2023

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Topics: Excitation, Fatigue life, Fatigue testing, Finite element analysis, Finite element model, Modeling, Resonance, Simulation, Solder joints, Stress

Journal Articles

An Automatic Finite Element Method-Boundary Element Method Coupling Method for Elastic–Plastic Problems of Multiscale Structures in Electronic Packaging

Fei Qin, Qi He, Yanpeng Gong, Chuantao Hou, Hao Cheng, Tong An, Yanwei Dai, Pei Chen

J. Electron. Packag. June 2023, 145(2): 021003.

Paper No: EP-22-1036

DOI: https://doi.org/10.1115/1.4055125

Published Online: August 18, 2022

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Topics: Boundary element methods, Finite element methods, Finite element model, Stiffness, Electronic packaging, Finite element analysis, Displacement, Traction

Journal Articles

Design, Fabrication, and Testing of a Novel Design for Flexible Light-Emitting Diode Signage Modules

Ram C. Adhikari, Dawood S. Beyragh, Majid Pahlevani

J. Electron. Packag. September 2021, 143(3): 031008.

Paper No: EP-20-1100

DOI: https://doi.org/10.1115/1.4049577

Published Online: February 19, 2021

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Topics: Deflection, Design, Finite element analysis, Light-emitting diodes, Manufacturing, Stress, Testing, Simulation, Finite element model, Engineering prototypes

Journal Articles

A Hybrid Finite Element Modeling: Artificial Neural Network Approach for Predicting Solder Joint Fatigue Life in Wafer-Level Chip Scale Packages

Zhiwen Chen, Zhao Zhang, Fang Dong, Sheng Liu, Li Liu

J. Electron. Packag. March 2021, 143(1): 011001.

Paper No: EP-19-1055

DOI: https://doi.org/10.1115/1.4047227

Published Online: June 4, 2020

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Topics: Artificial neural networks, Fatigue life, Finite element analysis, Modeling, Solder joints, Creep, Finite element model

Journal Articles

Accelerated Vibration Reliability Testing of Electronic Assemblies Using Sine Dwell With Resonance Tracking

Quang T. Su, Mohammad A. Gharaibeh, Aaron J. Stewart, James M. Pitarresi, Martin K. Anselm

J. Electron. Packag. December 2018, 140(4): 041004.

Paper No: EP-17-1062

DOI: https://doi.org/10.1115/1.4040923

Published Online: August 20, 2018

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Topics: Deflection, Failure, Failure analysis, Finite element analysis, Finite element model, Manufacturing, Reliability, Resonance, Solder joints, Solders

Journal Articles

Improvement of Thermo-Mechanical Reliability of Wafer-Level Chip Scale Packaging

Lei Shi, Lin Chen, David Wei Zhang, Evan Liu, Qiang Liu, Ching-I Chen

J. Electron. Packag. March 2018, 140(1): 011002.

Paper No: EP-17-1035

DOI: https://doi.org/10.1115/1.4038245

Published Online: March 2, 2018

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Topics: Density, Design, Finite element model, Packaging, Reliability, Semiconductor wafers, Solder joints, Solders, Stress, Fatigue life

Journal Articles

Modeling Thermal Microspreading Resistance in Via Arrays

Michael Fish, Patrick McCluskey, Avram Bar-Cohen

J. Electron. Packag. March 2016, 138(1): 010909.

Paper No: EP-15-1097

DOI: https://doi.org/10.1115/1.4032348

Published Online: March 11, 2016

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Topics: Boundary-value problems, Convection, Electrical conductivity, Modeling, Thermal conductivity, Heat, Flow (Dynamics), Finite element model

Journal Articles

Stress–Strain Behavior of SAC305 at High Strain Rates

Pradeep Lall, Sandeep Shantaram, Jeff Suhling, David Locker

J. Electron. Packag. March 2015, 137(1): 011010.

Paper No: EP-14-1001

DOI: https://doi.org/10.1115/1.4028641

Published Online: March 1, 2015

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Topics: Deformation, Displacement, Failure, Finite element analysis, Finite element model, Lead-free solders, Manufacturing, Solders, Stress, Trusses (Building)

Journal Articles

Experimental and Modeling Studies of Looping Process for Wire Bonding

Fuliang Wang, Yun Chen

J. Electron. Packag. December 2013, 135(4): 041009.

Paper No: EP-13-1070

DOI: https://doi.org/10.1115/1.4025667

Published Online: November 18, 2013

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Topics: Wire, Materials properties, Finite element model

Journal Articles

Reliability Design of Multirow Quad Flat Nonlead Packages Based on Numerical Design of Experiment Method

Guofeng Xia, Fei Qin, Cha Gao, Tong An, Wenhui Zhu

J. Electron. Packag. December 2013, 135(4): 041007.

Paper No: EP-13-1018

DOI: https://doi.org/10.1115/1.4025597

Published Online: November 5, 2013

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Topics: Cycles, Design, Fatigue, Fatigue life, Reliability, Solder joints, Temperature, Materials properties, Stress, Taguchi methods

Journal Articles

Finite Element Analysis for Shock Resistance Evaluation of Cushion-Packaged Multifunction Printer Considering Internal Modules

Se-Chang Kim, Dae-Geun Cho, Tae-Gyu Kim, Se-Hun Jung, Ja-Choon Koo, Moon-Ki Kim, Jae-Boong Choi

J. Electron. Packag. December 2013, 135(4): 041001.

Paper No: EP-13-1004

DOI: https://doi.org/10.1115/1.4024748

Published Online: August 7, 2013

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Topics: Finite element analysis, Finite element model, Shock (Mechanics), Impact testing, Packaging

Journal Articles

Thermal-Structural Performance of Orthotropic Pin Fin in Electronics Cooling Applications

A. F. M. Arif, Syed M. Zubair, S. Pashah

J. Electron. Packag. December 2012, 134(4): 041005.

DOI: https://doi.org/10.1115/1.4007258

Published Online: October 30, 2012

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Topics: Composite materials, Computer cooling, Flow (Dynamics), Geometry, Heat, Heat sinks, Stress, Temperature, Thermal analysis, Epoxy adhesives

Journal Articles

Effect of Shield-Can on Dynamic Response of Board-Level Assembly

Da Yu, Jae Kwak, Seungbae Park, Soonwan Chung, Ji-Young Yoon

J. Electron. Packag. September 2012, 134(3): 031010.

DOI: https://doi.org/10.1115/1.4007118

Published Online: July 23, 2012

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Topics: Deformation, Dynamic response, Failure, Finite element model, Shapes, Solder joints, Stress, Displacement, Stress analysis (Engineering), Manufacturing

Journal Articles

Interconnect Joule Heating under Transient Currents using the Transmission Line Matrix Method

Banafsheh Barabadi, Yogendra K. Joshi, Satish Kumar, Gamal Refai-Ahmed

J. Electron. Packag. March 2012, 134(1): 011009.

DOI: https://doi.org/10.1115/1.4006137

Published Online: March 21, 2012

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Topics: Heat, Heating, Joules, Temperature, Transients (Dynamics), Transmission lines, Steady state, Resistors, Currents, Simulation

Journal Articles

A Multiphysics Finite Element Model of a 35A Automotive Connector Including Multiscale Rough Surface Contact

Santosh V. Angadi, Robert L. Jackson, Song-yul Choe, George T. Flowers, Bong-Yi Lee, Liang Zhong

J. Electron. Packag. March 2012, 134(1): 011001.

DOI: https://doi.org/10.1115/1.4005955

Published Online: March 19, 2012

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Topics: Cables, Contact resistance, Finite element model, Heating, Surface roughness, Temperature, Joules, Current density, Stress, Flow (Dynamics)

Journal Articles

Modeling Simplification for Thermal Mechanical Analysis of High Density Chip-to-Substrate Connections

Ping Nicole An, Paul A. Kohl

J. Electron. Packag. December 2011, 133(4): 041004.

DOI: https://doi.org/10.1115/1.4005289

Published Online: December 9, 2011

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Topics: Boundary-value problems, Columns (Structural), Copper, Deformation, Density, Displacement, Errors, Finite element analysis, Finite element model, Modeling

Journal Articles

Thermo-Mechanical Response of Thru-Silicon Vias Under Local Thermal Transients Using Experimentally Validated Finite Element Models

Jamil A. Wakil, Patrick W. Dehaven, Nancy R. Klymko, Shaochen Chen

J. Electron. Packag. September 2011, 133(3): 031001.

DOI: https://doi.org/10.1115/1.4004656

Published Online: September 14, 2011

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Topics: Finite element model, Reliability, Silicon, Stress, Temperature, Thermomechanics, Transients (Dynamics), Warping, Laminates, Deformation

Journal Articles

Hygro-Thermo-Mechanical Reliability Assessment of a Thermal Interface Material for a Ball Grid Array Package Assembly

Xi Liu, Jiantao Zheng, Suresh K. Sitaraman

J. Electron. Packag. June 2010, 132(2): 021004.

DOI: https://doi.org/10.1115/1.4001746

Published Online: June 11, 2010

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Topics: Finite element analysis, Manufacturing, Model validation, Reliability, Temperature, Warping, Laminates, Weight (Mass), Lasers, Thermomechanics

Journal Articles

Finite Element Modeling of Simultaneous Ultrasonic Bumping With Au Balls

Wan Ho Song, Ali Karimi, Yan Huang, Michael Mayer, Norman Zhou, Jae Pil Jung

J. Electron. Packag. December 2009, 131(4): 041007.

DOI: https://doi.org/10.1115/1.4000281

Published Online: October 29, 2009

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Topics: Bonding, Displacement, Elastic moduli, Finite element analysis, Modeling, Sensitivity analysis, Simulation, Stress, Finite element model

Journal Articles

Novel Design of Thermal-Via Configurations for Collector-Up HBTs

Pei-Hsuan Lee, Hsien-Cheng Tseng, Jung-Hua Chou

J. Electron. Packag. December 2009, 131(4): 044501.

DOI: https://doi.org/10.1115/1.4000282

Published Online: October 21, 2009

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Topics: Design, Finite element model, Gallium arsenide, Temperature, Temperature distribution, Transistors, Finite element analysis, Packaging, Heat

2 3 4

Journal citation

NARROW

A Time Frequency Domain Based Approach for Ball Grid Array Solder Joint Fatigue Analysis Using Global Local Modeling Technique

An Automatic Finite Element Method-Boundary Element Method Coupling Method for Elastic–Plastic Problems of Multiscale Structures in Electronic Packaging

Design, Fabrication, and Testing of a Novel Design for Flexible Light-Emitting Diode Signage Modules

A Hybrid Finite Element Modeling: Artificial Neural Network Approach for Predicting Solder Joint Fatigue Life in Wafer-Level Chip Scale Packages

Accelerated Vibration Reliability Testing of Electronic Assemblies Using Sine Dwell With Resonance Tracking

Improvement of Thermo-Mechanical Reliability of Wafer-Level Chip Scale Packaging

Modeling Thermal Microspreading Resistance in Via Arrays

Stress–Strain Behavior of SAC305 at High Strain Rates

Experimental and Modeling Studies of Looping Process for Wire Bonding

Reliability Design of Multirow Quad Flat Nonlead Packages Based on Numerical Design of Experiment Method

Finite Element Analysis for Shock Resistance Evaluation of Cushion-Packaged Multifunction Printer Considering Internal Modules

Thermal-Structural Performance of Orthotropic Pin Fin in Electronics Cooling Applications

Effect of Shield-Can on Dynamic Response of Board-Level Assembly

Interconnect Joule Heating under Transient Currents using the Transmission Line Matrix Method

A Multiphysics Finite Element Model of a 35A Automotive Connector Including Multiscale Rough Surface Contact

Modeling Simplification for Thermal Mechanical Analysis of High Density Chip-to-Substrate Connections

Thermo-Mechanical Response of Thru-Silicon Vias Under Local Thermal Transients Using Experimentally Validated Finite Element Models

Hygro-Thermo-Mechanical Reliability Assessment of a Thermal Interface Material for a Ball Grid Array Package Assembly

Finite Element Modeling of Simultaneous Ultrasonic Bumping With Au Balls

Novel Design of Thermal-Via Configurations for Collector-Up HBTs

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