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Journal Articles

Transient Nature of Flight and Its Impact on Thermal Management for All Electric Aircraft

Joshua Kasitz, Aniket Ajay Lad, Muhammad Jahidul Hoque, Nenad Miljkovic, David Huitink
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011101.
Paper No: EP-22-1023
https://doi.org/10.1115/1.4055464
Published Online: September 27, 2022
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Topics: Aircraft, Cooling, Cooling systems, Flight, Heat exchangers, Stress, Temperature, Thermal management, Transients (Dynamics), Motors
Journal Articles

Study of an Air Cooling Scheme for 3-D Packaging

H. Xie, Y. C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1994, 116(1): 30–36.
https://doi.org/10.1115/1.2905490
Published Online: March 1, 1994
View Article titled, Study of an Air Cooling Scheme for 3-D Packaging
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Topics: Cooling, Packaging, Energy dissipation, Flow (Dynamics), Temperature, Circuits, Electrical measurement, Computer simulation, Flight, Heat sinks
Journal Articles

A Systems Approach to Solder Joint Fatigue in Spacecraft Electronic Packaging

R. G. Ross, Jr.
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1991, 113(2): 121–128.
https://doi.org/10.1115/1.2905377
Published Online: June 1, 1991
View Article titled, A Systems Approach to Solder Joint Fatigue in Spacecraft Electronic Packaging
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Topics: Electronic packaging, Fatigue, Solder joints, Space vehicles, Cycles, Hardware, Failure, Flight, Solders, Design