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Journal Articles

The Discussion About the Identification of the Anand Model Parameters and Two Alternative Identification Methods

Yuqian Xu, Qiwen Zeng, Yuexing Wang, Mingyong Wu, Xiangyu Chen, Gang Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011205.
Paper No: EP-22-1001
https://doi.org/10.1115/1.4054821
Published Online: August 3, 2022
View Article titled, The Discussion About the Identification of the Anand Model Parameters and Two Alternative Identification Methods
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Topics: Algebra, Deformation, Differential equations, Genetic algorithms, Stress, Errors, Solders
Journal Articles

Minimizing Temperature Nonuniformity by Optimal Arrangement of Hotspots in Vertically Stacked Three-Dimensional Integrated Circuits

Srikanth Rangarajan, Yaser Hadad, Leila Choobineh, Bahgat Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041109.
Paper No: EP-19-1123
https://doi.org/10.1115/1.4047471
Published Online: June 29, 2020
View Article titled, Minimizing Temperature Nonuniformity by Optimal Arrangement of Hotspots in Vertically Stacked Three-Dimensional Integrated Circuits
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Topics: Genetic algorithms, Heat, Optimization, Temperature, Artificial neural networks, Heat transfer, Integrated circuits, Algorithms, Boundary-value problems
Journal Articles

Thermal-Hydraulic Performance and Optimization of Tube Ellipticity in a Plate Fin-And-Tube Heat Exchanger

Hua Zhu, Zhuo Yang, Tariq Amin Khan, Wei Li, Zhijian Sun, Jincai Du, Zhengjiang Zhang, Jianxin Zhou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031008.
Paper No: EP-18-1108
https://doi.org/10.1115/1.4043482
Published Online: May 17, 2019
View Article titled, Thermal-Hydraulic Performance and Optimization of Tube Ellipticity in a Plate Fin-And-Tube Heat Exchanger
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Topics: Artificial neural networks, Computational fluid dynamics, Computer simulation, Flow (Dynamics), Heat exchangers, Heat transfer, Optimization, Friction, Reynolds number, Genetic algorithms
Journal Articles

Inverse Conduction Heat Transfer and Kriging Interpolation Applied to Temperature Sensor Location in Microchips

David Gonzalez Cuadrado, Amy Marconnet, Guillermo Paniagua
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010905.
Paper No: EP-17-1099
https://doi.org/10.1115/1.4039026
Published Online: March 2, 2018
View Article titled, Inverse Conduction Heat Transfer and Kriging Interpolation Applied to Temperature Sensor Location in Microchips
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Topics: Heat conduction, Heat flux, Heat transfer, Integrated circuits, Interpolation, Optimization, Sensors, Temperature, Temperature sensors, Genetic algorithms
Journal Articles

Genetic Algorithm Applied to Geometric Optimization of Isothermal Y-Shaped Cavities

Giulio Lorenzini, Cesare Biserni, Emanuel da Silva Diaz Estrada, Elizaldo Domingues Dos Santos, Liércio André Isoldi, Luiz Alberto Oliveira Rocha
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2014, 136(3): 031011.
Paper No: EP-14-1022
https://doi.org/10.1115/1.4027421
Published Online: May 12, 2014
View Article titled, Genetic Algorithm Applied to Geometric Optimization of Isothermal Y-Shaped Cavities
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Topics: Cavities, Degrees of freedom, Design, Genetic algorithms, Optimization, Shapes, Temperature, Simulation, Geometry
Journal Articles

Impact of Printed Circuit Board Via and Micro-Via Structures on Component Thermal Performances

Valentin Bissuel, Michel Brizoux, Arnaud Grivon, Eric Monier-Vinard, Fabrice Pires
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031013.
https://doi.org/10.1115/1.4004830
Published Online: September 30, 2011
View Article titled, Impact of Printed Circuit Board Via and Micro-Via Structures on Component Thermal Performances
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Topics: Boundary-value problems, Cooling, Density, Design, Genetic algorithms, Heat, Junctions, Modeling, Printed circuit boards, Temperature
Journal Articles

Improved Packaging Design for Maximizing the Thermal Performance of Multifinger Collector-Up HBTs

Hsien-Cheng Tseng
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2011, 133(1): 014501.
https://doi.org/10.1115/1.4003515
Published Online: March 9, 2011
View Article titled, Improved Packaging Design for Maximizing the Thermal Performance of Multifinger Collector-Up HBTs
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Topics: Design, Gallium arsenide, Genetic algorithms, Optimization, Packaging, Thermal resistance, Transistors, Thermal stability, Thermal management
Journal Articles

Design of Heat Conduction Panel: The Case of Multiple Heating Elements Cooled by a Displaced Heat Sink

Wataru Nakayama
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Thermal Issues In Emerging Technologies Theory And Applications, Theta
J. Electron. Packag. December 2008, 130(4): 041108.
https://doi.org/10.1115/1.2993137
Published Online: November 14, 2008
View Article titled, Design of Heat Conduction Panel: The Case of Multiple Heating Elements Cooled by a Displaced Heat Sink
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Topics: Design, Heat, Heat conduction, Heat sinks, Temperature, Tiles, Genetic algorithms
Journal Articles

Multidisciplinary Placement Optimization of Heat Generating Electronic Components on Printed Circuit Boards

Tohru Suwa, Hamid Hadim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 90–97.
https://doi.org/10.1115/1.2429715
Published Online: April 19, 2006
View Article titled, Multidisciplinary Placement Optimization of Heat Generating Electronic Components on Printed Circuit Boards
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Topics: Genetic algorithms, Heat, Junctions, Optimization, Temperature, Electrical wires, Density, Artificial neural networks, Electronic components
Journal Articles

Multiobjective Optimal Placement of Convectively and Conductively Cooled Electronic Components on Printed Wiring Boards

Nestor V. Queipo, Guy F. Gil
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 152–159.
https://doi.org/10.1115/1.483148
Published Online: October 20, 1999
View Article titled, Multiobjective Optimal Placement of Convectively and Conductively Cooled Electronic Components on Printed Wiring Boards
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Topics: Electrical wires, Electronic components, Failure, Genetic algorithms, Heat, Heat transfer, Optimization, Pareto optimization, Printed circuit boards, Design
Journal Articles

An Investigation of PWB Layout by Genetic Algorithms to Maximize Fatigue Life

A. J. Scholand, R. E. Fulton, B. Bras
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1999, 121(1): 31–36.
https://doi.org/10.1115/1.2792658
Published Online: March 1, 1999
View Article titled, An Investigation of PWB Layout by Genetic Algorithms to Maximize Fatigue Life
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Topics: Fatigue life, Genetic algorithms, Printed circuit boards, Algorithms, Approximation, Design, Energy consumption, Epoxy adhesives, Epoxy resins, Fatigue
Journal Articles

PCB Layout Design Using a Genetic Algorithm

Sakait Jain, Hae Chang Gea
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1996, 118(1): 11–15.
https://doi.org/10.1115/1.2792119
Published Online: March 1, 1996
View Article titled, PCB Layout Design Using a Genetic Algorithm
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Topics: Design, Genetic algorithms, Printed circuit boards, Heat
Journal Articles

Planning of Component Placement/Insertion Sequence and Feeder Setup in PCB Assembly Using Genetic Algorithm

M. C. Leu, H. Wong, Z. Ji
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1993, 115(4): 424–432.
https://doi.org/10.1115/1.2909352
Published Online: December 1, 1993
View Article titled, Planning of Component Placement/Insertion Sequence and Feeder Setup in PCB Assembly Using Genetic Algorithm
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Topics: Genetic algorithms, Printed circuit board assemblies, Algorithms, Manufacturing, Machinery