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Journal Articles

Dynamic Modeling Framework for Evaluating Electromagnetic-Electro-Thermal Behavior of Power Conversion System During Load Operation

Hsien-Chie Cheng, Yan-Cheng Liu

J. Electron. Packag. June 2023, 145(2): 021005.

Paper No: EP-22-1012

DOI: https://doi.org/10.1115/1.4055591

Published Online: September 28, 2022

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Topics: Capacitance, Circuits, Computational fluid dynamics, Energy dissipation, Heat conduction, Junctions, Modeling, MOSFET transistors, Network models, Power conversion systems

Journal Articles

Hybrid Monte Carlo-Diffusion Studies of Modeling Self-Heating in Ballistic-Diffusive Regime for Gallium Nitride HEMTs

Han-Ling Li, Yang Shen, Yu-Chao Hua, S. L. Sobolev, Bing-Yang Cao

J. Electron. Packag. March 2023, 145(1): 011203.

Paper No: EP-22-1007

DOI: https://doi.org/10.1115/1.4054698

Published Online: July 13, 2022

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Topics: Diffusion (Physics), Gallium nitride, Heat, Heating, Modeling, Phonons, Simulation, Temperature, Heat conduction, Junctions

Journal Articles

Guidelines for Designing Micropillar Structures for Enhanced Evaporative Heat Transfer

Kidus Guye, De Dong, Yunseo Kim, Hyoungsoon Lee, Baris Dogruoz, Damena Agonafer

J. Electron. Packag. December 2021, 143(4): 041106.

Paper No: EP-21-1120

DOI: https://doi.org/10.1115/1.4052465

Published Online: October 13, 2021

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Topics: Design, Drops, Evaporation, Heat conduction, Heat transfer, Heat transfer coefficients, Optimization, Particle swarm optimization, Shapes, Vapors

Journal Articles

Sensitivity Coefficient-Based Inverse Heat Conduction Method for Identifying Hot Spots in Electronics Packages: A Comparison of Grid-Refinement Methods

Patrick Krane, David Gonzalez Cuadrado, Francisco Lozano, Guillermo Paniagua, Amy Marconnet

J. Electron. Packag. March 2022, 144(1): 011008.

Paper No: EP-20-1121

DOI: https://doi.org/10.1115/1.4050200

Published Online: August 6, 2021

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Topics: Electronic packages, Heat, Temperature, Errors, Heat conduction

Journal Articles

Experimental Study of Flexible Electrohydrodynamic Conduction Pumping for Electronics Cooling

Nathaniel J. O'Connor, Alexander J. Castaneda, Pavolas N. Christidis, Nicolas Vayas Tobar, Michal Talmor, Jamal Yagoobi

J. Electron. Packag. December 2020, 142(4): 041105.

Paper No: EP-20-1021

DOI: https://doi.org/10.1115/1.4047459

Published Online: June 23, 2020

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Topics: Computer cooling, Electrohydrodynamics, Flow (Dynamics), Fluids, Heat conduction, Pumps, Electrodes, Design, Electric fields

Journal Articles

Inverse Conduction Heat Transfer and Kriging Interpolation Applied to Temperature Sensor Location in Microchips

David Gonzalez Cuadrado, Amy Marconnet, Guillermo Paniagua

J. Electron. Packag. March 2018, 140(1): 010905.

Paper No: EP-17-1099

DOI: https://doi.org/10.1115/1.4039026

Published Online: March 2, 2018

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Topics: Heat conduction, Heat flux, Heat transfer, Integrated circuits, Interpolation, Optimization, Sensors, Temperature, Temperature sensors, Genetic algorithms

Journal Articles

Transient Data Processing of Flow Boiling Local Heat Transfer in a Multi-Microchannel Evaporator Under a Heat Flux Disturbance

Houxue Huang, Nicolas Lamaison, John R. Thome

J. Electron. Packag. March 2017, 139(1): 011005.

Paper No: EP-16-1083

DOI: https://doi.org/10.1115/1.4035386

Published Online: January 5, 2017

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Topics: Boiling, Flow (Dynamics), Fluids, Heat conduction, Heat flux, Heat transfer, Heat transfer coefficients, Microchannels, Pressure drop, Temperature

Journal Articles

A Finite Difference Lattice Boltzmann Method to Simulate Multidimensional Subcontinuum Heat Conduction

Cheng Chen, James Geer, Bahgat Sammakia

J. Electron. Packag. December 2016, 138(4): 041008.

Paper No: EP-16-1053

DOI: https://doi.org/10.1115/1.4034856

Published Online: October 20, 2016

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Topics: Diffusion (Physics), Heat conduction, Lattice Boltzmann methods, Phonons, Silicon, Temperature, Thermal conductivity, Density, Heat, Equilibrium (Physics)

Journal Articles

Thermal Modeling of Extreme Heat Flux Microchannel Coolers for GaN-on-SiC Semiconductor Devices

Hyoungsoon Lee, Damena D. Agonafer, Yoonjin Won, Farzad Houshmand, Catherine Gorle, Mehdi Asheghi, Kenneth E. Goodson

J. Electron. Packag. March 2016, 138(1): 010907.

Paper No: EP-15-1104

DOI: https://doi.org/10.1115/1.4032655

Published Online: March 10, 2016

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Topics: Boiling, Computational fluid dynamics, Flow (Dynamics), Flux (Metallurgy), Gallium nitride, Heat conduction, Heat transfer coefficients, Microchannels, Microcoolers, Simulation

Journal Articles

Dynamic Numerical Microchannel Evaporator Model to Investigate Parallel Channel Instabilities

Tom Saenen, John R. Thome

J. Electron. Packag. March 2016, 138(1): 010901.

Paper No: EP-15-1091

DOI: https://doi.org/10.1115/1.4032490

Published Online: March 10, 2016

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Topics: Flow (Dynamics), Heat conduction, Microchannels, Algorithms, Simulation, Stability

Journal Articles

Natural Convection Immersion Cooling With Enhanced Optical Performance of Light-Emitting Diode Systems

Enes Tamdogan, Mehmet Arik

J. Electron. Packag. December 2015, 137(4): 041006.

Paper No: EP-14-1089

DOI: https://doi.org/10.1115/1.4031480

Published Online: October 15, 2015

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Topics: Cooling, Heat transfer, Light-emitting diodes, Natural convection, Silicones, Heat conduction, Convection, Fluids, Domes (Structural elements), Coolants

Journal Articles

Heat Conduction in Mobile Electronic Equipment: Study on the Effects of Some Key Parameters on Heat Source Temperature Based on a Three-Layer Model

Wataru Nakayama

J. Electron. Packag. September 2013, 135(3): 034501.

Paper No: EP-11-1100

DOI: https://doi.org/10.1115/1.4024367

Published Online: June 4, 2013

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Topics: Heat, Heat conduction, Temperature, Thermal conductivity, Electronic equipment

Journal Articles

Study on Heat Conduction in a Simulated Multicore Processor Chip—Part II: Case Studies

Wataru Nakayama

J. Electron. Packag. June 2013, 135(2): 021003.

Paper No: EP-12-1032

DOI: https://doi.org/10.1115/1.4023292

Published Online: March 28, 2013

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Topics: Cooling, Heat, Heat transfer coefficients, Temperature, Heat conduction, Heat sinks, Dimensions

Journal Articles

Study on Heat Conduction in a Simulated Multicore Processor Chip—Part I: Analytical Modeling

Wataru Nakayama

J. Electron. Packag. June 2013, 135(2): 021002.

Paper No: EP-12-1031

DOI: https://doi.org/10.1115/1.4023291

Published Online: March 28, 2013

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Topics: Heat, Temperature, Heat conduction

Journal Articles

Conjugate Thermal Analysis of Air-Cooled Discrete Flush-Mounted Heat Sources in a Horizontal Channel

Jing He, Liping Liu, Anthony M. Jacobi

J. Electron. Packag. December 2011, 133(4): 041001.

DOI: https://doi.org/10.1115/1.4005299

Published Online: November 17, 2011

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Topics: Convection, Emissivity, Heat, Radiation (Physics), Temperature, Thermal analysis, Thermal conductivity, Heat transfer, Heat conduction, Flow (Dynamics)

Journal Articles

Conjugate Thermal Transport in Gas Flow in Long Rectangular Microchannel

Zhanyu Sun, Yogesh Jaluria

J. Electron. Packag. June 2011, 133(2): 021008.

DOI: https://doi.org/10.1115/1.4004218

Published Online: June 23, 2011

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Topics: Bronze, Gas flow, Heat flux, Heat transfer, Microchannels, Nitrogen, Slip flow, Temperature, Thermal conductivity, Silicon nitride ceramics

Journal Articles

Heat Transfer of an IGBT Module Integrated With a Vapor Chamber

Xiaoling Yu, Lianghua Zhang, Enming Zhou, Quanke Feng

J. Electron. Packag. March 2011, 133(1): 011008.

DOI: https://doi.org/10.1115/1.4003214

Published Online: March 10, 2011

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Topics: Circuits, Copper, Heat, Heat transfer, Junctions, Stress, Temperature, Thermal conductivity, Thermal resistance, Transients (Dynamics)

Journal Articles

The Effect of Thermal Contact Resistance at Porous-Solid Interfaces in Finned Metal Foam Heat Sinks

Christopher T. DeGroot, Derek Gateman, Anthony G. Straatman

J. Electron. Packag. December 2010, 132(4): 041007.

DOI: https://doi.org/10.1115/1.4002724

Published Online: November 24, 2010

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Topics: Contact resistance, Heat sinks, Heat transfer, Metal foams, Fluids, Fins, Aluminum, Convection, Heat conduction, Epoxy adhesives

Journal Articles

An Inverse Problem in Estimating the Volumetric Heat Generation for a Three-Dimensional Encapsulated Chip

Cheng-Hung Huang, Wei-Lun Chang

J. Electron. Packag. March 2010, 132(1): 011004.

DOI: https://doi.org/10.1115/1.4000720

Published Online: March 4, 2010

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Topics: Heat, Inverse problems, Temperature, Heat conduction, Errors

Journal Articles

An Engineering Estimate for Plug-Flow Convection in Porous Media Discarding Fluid Conduction

Nihad Dukhan

J. Electron. Packag. September 2009, 131(3): 034501.

DOI: https://doi.org/10.1115/1.3143947

Published Online: June 12, 2009

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Topics: Convection, Flow (Dynamics), Fluids, Heat conduction, Porous materials, Temperature, Graphite, Metal foams, Thermal conductivity

2 3 4

Journal citation

NARROW

Dynamic Modeling Framework for Evaluating Electromagnetic-Electro-Thermal Behavior of Power Conversion System During Load Operation

Hybrid Monte Carlo-Diffusion Studies of Modeling Self-Heating in Ballistic-Diffusive Regime for Gallium Nitride HEMTs

Guidelines for Designing Micropillar Structures for Enhanced Evaporative Heat Transfer

Sensitivity Coefficient-Based Inverse Heat Conduction Method for Identifying Hot Spots in Electronics Packages: A Comparison of Grid-Refinement Methods

Experimental Study of Flexible Electrohydrodynamic Conduction Pumping for Electronics Cooling

Inverse Conduction Heat Transfer and Kriging Interpolation Applied to Temperature Sensor Location in Microchips

Transient Data Processing of Flow Boiling Local Heat Transfer in a Multi-Microchannel Evaporator Under a Heat Flux Disturbance

A Finite Difference Lattice Boltzmann Method to Simulate Multidimensional Subcontinuum Heat Conduction

Thermal Modeling of Extreme Heat Flux Microchannel Coolers for GaN-on-SiC Semiconductor Devices

Dynamic Numerical Microchannel Evaporator Model to Investigate Parallel Channel Instabilities

Natural Convection Immersion Cooling With Enhanced Optical Performance of Light-Emitting Diode Systems

Heat Conduction in Mobile Electronic Equipment: Study on the Effects of Some Key Parameters on Heat Source Temperature Based on a Three-Layer Model

Study on Heat Conduction in a Simulated Multicore Processor Chip—Part II: Case Studies

Study on Heat Conduction in a Simulated Multicore Processor Chip—Part I: Analytical Modeling

Conjugate Thermal Analysis of Air-Cooled Discrete Flush-Mounted Heat Sources in a Horizontal Channel

Conjugate Thermal Transport in Gas Flow in Long Rectangular Microchannel

Heat Transfer of an IGBT Module Integrated With a Vapor Chamber

The Effect of Thermal Contact Resistance at Porous-Solid Interfaces in Finned Metal Foam Heat Sinks

An Inverse Problem in Estimating the Volumetric Heat Generation for a Three-Dimensional Encapsulated Chip

An Engineering Estimate for Plug-Flow Convection in Porous Media Discarding Fluid Conduction

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