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Journal Articles

Numerical Study of Two-Stage Temperature Control Strategy for High Temperature Stability of Satellite-Borne Fiber Optic Gyroscope

Kaifeng Chang, Yunze Li, Weishu Wang

J. Electron. Packag.

Paper No: EP-22-1097

DOI: https://doi.org/10.1115/1.4062108

Published Online: March 11, 2023

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Topics: Fibers, High temperature, Satellites, Stability, Temperature control, Temperature, Control systems, Engineering systems and industry applications, Errors, Space vehicles

Journal Articles

Study on the Microstructure Evolution and Mechanical Properties of Cu/Cu 41 Sn 11 /Cu Solder Joint During High-Temperature Aging

Gangli Yang, Xiaoyan Li, Xu Han, Hu Zhang, Linjie Wen, Shanshan Li

J. Electron. Packag. September 2023, 145(3): 031001.

Paper No: EP-22-1057

DOI: https://doi.org/10.1115/1.4056329

Published Online: December 9, 2022

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Topics: Mechanical properties, Solder joints, Tin, High temperature, Shear strength

Journal Articles

Solderability and Reliability of Sintered Nano-Ag Bond Pads of Printed Re-Distribution Layer

J. C. C. Lo, Q. Jiang, X. Qiu, N. Tu

J. Electron. Packag. March 2023, 145(1): 011103.

Paper No: EP-22-1013

DOI: https://doi.org/10.1115/1.4055840

Published Online: October 22, 2022

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Topics: High temperature, Inks, Reliability, Shear (Mechanics), Sintering, Storage, Solders, Additive manufacturing, Solder joints

Journal Articles

High Temperature Degradation Modes Observed in Gallium Nitride-Based Hall-Effect Sensors

Alexis Krone, Josh Kasitz, David Huitink, Hannah Alpert, Debbie G. Senesky, Satish Shetty, Gregory Salamo

J. Electron. Packag. June 2022, 144(2): 021115.

Paper No: EP-21-1064

DOI: https://doi.org/10.1115/1.4053765

Published Online: March 7, 2022

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Topics: Gallium, Gallium nitride, Hall effect, High temperature, Sensors, Temperature, Alloys, Reliability

Journal Articles

Microstructural Evolution of Viscoelastic Properties of Underfills Under Sustained High Temperature Operation

Pradeep Lall, Madhu Kasturi, Haotian Wu, Jeff Suhling, Edward Davis

J. Electron. Packag. June 2022, 144(2): 021113.

Paper No: EP-21-1059

DOI: https://doi.org/10.1115/1.4052715

Published Online: January 4, 2022

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Topics: Flip-chip, Glass transition, High temperature, Mechanical properties, Oxidation, Solders, Storage, Temperature, Viscoelasticity, Optical microscopes

Journal Articles

High Strain Rate Mechanical Properties of SAC-Q Solder for Extreme Temperatures After Exposure to Isothermal Aging Up to 90 Days

Pradeep Lall, Vishal Mehta, Jeff Suhling, Ken Blecker

J. Electron. Packag. June 2022, 144(2): 021108.

Paper No: EP-21-1060

DOI: https://doi.org/10.1115/1.4052073

Published Online: October 6, 2021

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Topics: Elastic moduli, Mechanical properties, Solders, Stress, Stress-strain curves, Temperature, Tensile strength, Testing, Operating temperature, High temperature

Journal Articles

Fatigue Testing of Copper Nanoparticle-Based Joints and Bonds

Rajesh Sharma Sivasubramony, Maan Zaid Kokash, Sanoop Thekkut, Ninad Shahane, Patrick Thompson, Kabir Mirpuri, Yuki Kawana, Christopher M. Greene, Peter Borgesen

J. Electron. Packag. March 2022, 144(1): 011007.

Paper No: EP-20-1120

DOI: https://doi.org/10.1115/1.4050871

Published Online: August 6, 2021

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Topics: Annealing, Cycles, Damage, Deformation, Dislocations, Fatigue, Fatigue life, Nanoparticles, Particulate matter, Shear strength

Journal Articles

Application of Alumina-Based Ceramic Paste for High-Temperature Electronics Packaging

Ardalan Nasiri, Simon Ang

J. Electron. Packag. June 2021, 143(2): 020902.

Paper No: EP-20-1060

DOI: https://doi.org/10.1115/1.4049292

Published Online: February 22, 2021

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Topics: Bonding, Ceramics, Electronic packaging, Hardening (Curing), High temperature, Shear strength, Temperature, Fracture (Materials), Fourier transform infrared spectroscopy, Aluminum

Journal Articles

Influence of Carbon Nanoparticles Additives on Nanosilver Joints in LTJT Technology

Jerzy Szałapak, Konrad Kiełbasiński, Łucja Dybowska-Sarapuk, Jakub Krzeminski, Marian Teodorczyk, Tomasz Kowaluk, Małgorzata Jakubowska

J. Electron. Packag. September 2021, 143(3): 034501.

Paper No: EP-20-1091

DOI: https://doi.org/10.1115/1.4049240

Published Online: January 19, 2021

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Topics: Carbon, Carbon nanotubes, Electrical resistivity, Graphene, Nanoparticles, Silver, Thermal conductivity, Temperature, Joining, High temperature

Journal Articles

Effects of High-Temperature Storage on the Glass Transition Temperature of Epoxy Molding Compound

Ruifeng Li, Daoguo Yang, Ping Zhang, Fanfan Niu, Miao Cai, G. Q. Zhang

J. Electron. Packag. March 2021, 143(1): 011009.

Paper No: EP-18-1065

DOI: https://doi.org/10.1115/1.4047475

Published Online: June 26, 2020

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Topics: Epoxy resins, Glass transition, High temperature, Molding, Storage, Temperature, Epoxy adhesives

Journal Articles

High Temperature Performance Evaluation and Life Prediction for Titanium Modified Silicone Used in Light-Emitting Diodes Chip Scale Packages

Si Yu, Zhen Wang, Jiajie Fan, Cheng Qian, Zhentao Deng, Dayong Gui

J. Electron. Packag. June 2020, 142(2): 021003.

Paper No: EP-19-1081

DOI: https://doi.org/10.1115/1.4045568

Published Online: February 3, 2020

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Topics: High temperature, Silicones, Titanium

Journal Articles

Impact of Aging on Mechanical Properties of Thermally Conductive Gap Fillers

Abel Misrak, Tushar Chauhan, Pavan Rajmane, Rabin Bhandari, Dereje Agonafer

J. Electron. Packag. March 2020, 142(1): 011011.

Paper No: EP-19-1064

DOI: https://doi.org/10.1115/1.4045157

Published Online: November 8, 2019

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Topics: Fillers (Materials), Fourier transform infrared spectroscopy, Infrared spectroscopy, Mechanical properties, Stress, Temperature, Testing, Thermomechanics, High temperature, Reliability

Journal Articles

Novel Transient Liquid Phase Bonding for High-Temperature Automotive Power Electronics Systems

Yanghe Liu, Shailesh N. Joshi, Ercan M. Dede

J. Electron. Packag. March 2020, 142(1): 011003.

Paper No: EP-19-1014

DOI: https://doi.org/10.1115/1.4044476

Published Online: September 19, 2019

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Topics: Bonding, Electronics, High temperature, Manufacturing, Stress, Tension-leg platforms, Thermal stresses, Tin, Transients (Dynamics), Temperature

Journal Articles

Review of Thermal Packaging Technologies for Automotive Power Electronics for Traction Purposes

Justin Broughton, Vanessa Smet, Rao R. Tummala, Yogendra K. Joshi

J. Electron. Packag. December 2018, 140(4): 040801.

Paper No: EP-17-1128

DOI: https://doi.org/10.1115/1.4040828

Published Online: August 20, 2018

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Topics: Cooling, Electronics, Packaging, Temperature, Silicon, High temperature, Heat

Journal Articles

Lead-Free Alternatives for Interconnects in High-Temperature Electronics

Sandeep Mallampati, Liang Yin, David Shaddock, Harry Schoeller, Junghyun Cho

J. Electron. Packag. March 2018, 140(1): 010906.

Paper No: EP-17-1101

DOI: https://doi.org/10.1115/1.4039027

Published Online: March 2, 2018

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Topics: Alloys, Electronics, High temperature, Solders, Temperature, Testing, Thermal conductivity, Failure, Melting, Tensile testing

Journal Articles

High-Temperature Interfacial Adhesion Strength Measurement in Electronic Packaging Using the Double Cantilever Beam Method

Santosh Sankarasubramanian, Jaime Cruz, Kyle Yazzie, Vaasavi Sundar, Vijay Subramanian, Tsgereda Alazar, Sivakumar Yagnamurthy, Edvin Cetegen, David McCoy, Pramod Malatkar

J. Electron. Packag. June 2017, 139(2): 020902.

Paper No: EP-16-1149

DOI: https://doi.org/10.1115/1.4036356

Published Online: April 24, 2017

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Topics: Adhesion, Cantilever beams, Silicon, Solder masks, Temperature, Testing, High temperature, Adhesives

Journal Articles

The Strength of High-Temperature Ag–In Joints Produced Between Copper by Fluxless Low-Temperature Processes

Yuan-Yun Wu, Chin C. Lee

J. Electron. Packag. March 2014, 136(1): 011006.

Paper No: EP-13-1063

DOI: https://doi.org/10.1115/1.4026171

Published Online: January 8, 2014

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Topics: Alloys, Bonding, Copper, Design, High temperature, Low temperature, Shear (Mechanics), Silver, Solid solutions, Temperature

Journal Articles

Reliability Assessment and Activation Energy Study of Au and Pd-Coated Cu Wires Post High Temperature Aging in Nanoscale Semiconductor Packaging

C. L. Gan, U. Hashim

J. Electron. Packag. June 2013, 135(2): 021010.

Paper No: EP-12-1099

DOI: https://doi.org/10.1115/1.4024013

Published Online: April 12, 2013

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Topics: High temperature, Packaging, Reliability, Stress, Wire, Failure mechanisms, Temperature, Semiconductors (Materials), Nanoscale phenomena, Nanoelectronics

Journal Articles

Effects of the Thermocompression Bonding on the Microstructure and Contact Resistance for the Ultrafine Pitch Chip-on-Glass Packaging With Nonconductive Film

Jianhua Zhang, Jinsong Zhang, Lianqiao Yang

J. Electron. Packag. December 2010, 132(4): 044501.

DOI: https://doi.org/10.1115/1.4002898

Published Online: December 3, 2010

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Topics: Bonding, Contact resistance, Packaging, Tin, Temperature, Pressure, Glass, High temperature, Melting point

Journal Articles

Tungsten Carbide as a Diffusion Barrier on Silicon Nitride Active- Metal-Brazed Substrates for Silicon Carbide Power Devices

H. A. Mustain, William D. Brown, Simon S. Ang

J. Electron. Packag. September 2009, 131(3): 034502.

DOI: https://doi.org/10.1115/1.3153582

Published Online: July 14, 2009

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Topics: Copper, Diffusion (Physics), Silicon, Silicon nitride ceramics, Tungsten, Annealing, High temperature, Metals, Temperature, Electron spectroscopy

Journal citation

NARROW

Manuscript

Numerical Study of Two-Stage Temperature Control Strategy for High Temperature Stability of Satellite-Borne Fiber Optic Gyroscope

Study on the Microstructure Evolution and Mechanical Properties of Cu/Cu 41 Sn 11 /Cu Solder Joint During High-Temperature Aging

Solderability and Reliability of Sintered Nano-Ag Bond Pads of Printed Re-Distribution Layer

High Temperature Degradation Modes Observed in Gallium Nitride-Based Hall-Effect Sensors

Microstructural Evolution of Viscoelastic Properties of Underfills Under Sustained High Temperature Operation

High Strain Rate Mechanical Properties of SAC-Q Solder for Extreme Temperatures After Exposure to Isothermal Aging Up to 90 Days

Fatigue Testing of Copper Nanoparticle-Based Joints and Bonds

Application of Alumina-Based Ceramic Paste for High-Temperature Electronics Packaging

Influence of Carbon Nanoparticles Additives on Nanosilver Joints in LTJT Technology

Effects of High-Temperature Storage on the Glass Transition Temperature of Epoxy Molding Compound

High Temperature Performance Evaluation and Life Prediction for Titanium Modified Silicone Used in Light-Emitting Diodes Chip Scale Packages

Impact of Aging on Mechanical Properties of Thermally Conductive Gap Fillers

Novel Transient Liquid Phase Bonding for High-Temperature Automotive Power Electronics Systems

Review of Thermal Packaging Technologies for Automotive Power Electronics for Traction Purposes

Lead-Free Alternatives for Interconnects in High-Temperature Electronics

High-Temperature Interfacial Adhesion Strength Measurement in Electronic Packaging Using the Double Cantilever Beam Method

The Strength of High-Temperature Ag–In Joints Produced Between Copper by Fluxless Low-Temperature Processes

Reliability Assessment and Activation Energy Study of Au and Pd-Coated Cu Wires Post High Temperature Aging in Nanoscale Semiconductor Packaging

Effects of the Thermocompression Bonding on the Microstructure and Contact Resistance for the Ultrafine Pitch Chip-on-Glass Packaging With Nonconductive Film

Tungsten Carbide as a Diffusion Barrier on Silicon Nitride Active- Metal-Brazed Substrates for Silicon Carbide Power Devices

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