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Journal Articles

Special Section on InterPACK2021

Jin Yang, Przemyslaw Gromala, Sukwon Choi, Damena Agonafer, Patrick McCluskey

J. Electron. Packag. March 2023, 145(1): 010301.

Paper No: EP-22-1094

DOI: https://doi.org/10.1115/1.4056558

Published Online: January 11, 2023

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Topics: Additive manufacturing, Artificial intelligence, Data centers, Electronic packaging, Electronics, Engineering teachers, Integrated circuit packaging, Integrated circuits, Microelectromechanical systems, Microelectronic devices

Journal Articles

Detection of Unusual Thermal Activities in a Semiconductor Chip Using Backside Infrared Thermal Imaging

Swapnil S. Salvi, Ankur Jain

J. Electron. Packag. June 2021, 143(2): 020901.

Paper No: EP-20-1058

DOI: https://doi.org/10.1115/1.4049291

Published Online: February 22, 2021

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Topics: Algorithms, Circuits, Hardware, Heating, Image processing, Imaging, Resistors, Semiconductors (Materials), Temperature, Integrated circuits

Journal Articles

Compact Transient Thermal Model of Microfluidically Cooled Three-Dimensional Stacked Chips With Pin-Fin Enhanced Microgap

Yuanchen Hu, Md Obaidul Hossen, Zhimin Wan, Muhannad S. Bakir, Yogendra Joshi

J. Electron. Packag. September 2021, 143(3): 031007.

Paper No: EP-20-1045

DOI: https://doi.org/10.1115/1.4049814

Published Online: February 19, 2021

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Topics: Computational fluid dynamics, Cooling, Integrated circuits, Leakage, Simulation, Temperature, Transients (Dynamics), Fins, Steady state, Heat

Journal Articles

Minimizing Temperature Nonuniformity by Optimal Arrangement of Hotspots in Vertically Stacked Three-Dimensional Integrated Circuits

Srikanth Rangarajan, Yaser Hadad, Leila Choobineh, Bahgat Sammakia

J. Electron. Packag. December 2020, 142(4): 041109.

Paper No: EP-19-1123

DOI: https://doi.org/10.1115/1.4047471

Published Online: June 29, 2020

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Topics: Genetic algorithms, Heat, Optimization, Temperature, Artificial neural networks, Heat transfer, Integrated circuits, Algorithms, Boundary-value problems

Journal Articles

Detection of Sealant Delamination in Integrated Circuit Package Using Nondestructive Evaluation

Guoyi Li, Hyunseong Lee, Aditi Chattopadhyay, Rajesh Kumar Neerukatti, Kuang C. Liu

J. Electron. Packag. March 2021, 143(1): 011002.

Paper No: EP-19-1077

DOI: https://doi.org/10.1115/1.4047228

Published Online: June 4, 2020

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Topics: Delamination, Inspection, Sealants, Signals, Waves, Nondestructive evaluation, Excitation, Integrated circuits

Journal Articles

Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA) With Through Silicon Via and Copper Pillar Bonding Approach

Leila Choobineh, Robert Carrol, Carlos Gutierrez, Robert Geer

J. Electron. Packag. September 2020, 142(3): 031106.

Paper No: EP-19-1098

DOI: https://doi.org/10.1115/1.4046848

Published Online: April 24, 2020

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Topics: Bonding, Columns (Structural), Copper, Design, Gates (Closures), Manufacturing, Modeling, Semiconductor wafers, Silicon, Tiles

Journal Articles

Reduced Order Modeling of Transient Heat Transfer in Microchip Interconnects

Arman Nokhosteen, M. Soltani, Banafsheh Barabadi

J. Electron. Packag. March 2019, 141(1): 011002.

Paper No: EP-18-1029

DOI: https://doi.org/10.1115/1.4041666

Published Online: February 25, 2019

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Topics: Boundary-value problems, Heat, Integrated circuits, Microelectronic devices, Modeling, Principal component analysis, Simulation, Temperature, Temperature distribution, Temperature profiles

Journal Articles

Inverse Conduction Heat Transfer and Kriging Interpolation Applied to Temperature Sensor Location in Microchips

David Gonzalez Cuadrado, Amy Marconnet, Guillermo Paniagua

J. Electron. Packag. March 2018, 140(1): 010905.

Paper No: EP-17-1099

DOI: https://doi.org/10.1115/1.4039026

Published Online: March 2, 2018

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Topics: Heat conduction, Heat flux, Heat transfer, Integrated circuits, Interpolation, Optimization, Sensors, Temperature, Temperature sensors, Genetic algorithms

Journal Articles

Experimental and Numerical Investigation of Interdie Thermal Resistance in Three-Dimensional Integrated Circuits

Leila Choobineh, Jared Jones, Ankur Jain

J. Electron. Packag. June 2017, 139(2): 020908.

Paper No: EP-16-1140

DOI: https://doi.org/10.1115/1.4036404

Published Online: June 12, 2017

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Topics: Integrated circuits, Sensors, Temperature, Thermal resistance, Thermal analysis

Journal Articles

Three-Dimensional Integrated Circuit With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications

Xuchen Zhang, Xuefei Han, Thomas E. Sarvey, Craig E. Green, Peter A. Kottke, Andrei G. Fedorov, Yogendra Joshi, Muhannad S. Bakir

J. Electron. Packag. March 2016, 138(1): 010910.

Paper No: EP-15-1107

DOI: https://doi.org/10.1115/1.4032496

Published Online: March 10, 2016

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Topics: Cooling, Design, Fins, Flow (Dynamics), Heat flux, Heat sinks, Heat transfer coefficients, Microfluidics, Temperature, Testing

Journal Articles

Effect of Intermetallic Compounds on the Thermomechanical Fatigue Life of Three-Dimensional Integrated Circuit Package Microsolder Bumps: Finite Element Analysis and Study

Soud Farhan Choudhury, Leila Ladani

J. Electron. Packag. December 2015, 137(4): 041003.

Paper No: EP-14-1099

DOI: https://doi.org/10.1115/1.4031523

Published Online: September 25, 2015

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Topics: Cycles, Fatigue life, Finite element analysis, Solders, Stress, Thermomechanics, Geometry, Reliability, Integrated circuits, Intermetallic compounds

Journal Articles

Overview and Outlook of Three-Dimensional Integrated Circuit Packaging, Three-Dimensional Si Integration, and Three-Dimensional Integrated Circuit Integration

John H. Lau

J. Electron. Packag. December 2014, 136(4): 040801.

Paper No: EP-14-1068

DOI: https://doi.org/10.1115/1.4028629

Published Online: October 15, 2014

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Topics: Integrated circuit packaging, Manufacturing, Semiconductor wafers, Supply chains, Wire bonding, Packaging, Integrated circuits, Bonding

Journal Articles

A Review of Recent Advances in Thermal Management in Three Dimensional Chip Stacks in Electronic Systems

Vikram Venkatadri, Bahgat Sammakia, Krishnaswami Srihari, Daryl Santos

J. Electron. Packag. December 2011, 133(4): 041011.

DOI: https://doi.org/10.1115/1.4005298

Published Online: December 9, 2011

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Topics: Thermal management, Cooling, Silicon, Circuits, Integrated circuits, Heat

Journal Articles

Impact of Printed Circuit Board Via and Micro-Via Structures on Component Thermal Performances

Valentin Bissuel, Michel Brizoux, Arnaud Grivon, Eric Monier-Vinard, Fabrice Pires

J. Electron. Packag. September 2011, 133(3): 031013.

DOI: https://doi.org/10.1115/1.4004830

Published Online: September 30, 2011

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Topics: Boundary-value problems, Cooling, Density, Design, Genetic algorithms, Heat, Junctions, Modeling, Printed circuit boards, Temperature

Journal Articles

Embedded Three-Dimensional Hybrid Integrated Circuit Integration System-in-Package With Through-Silicon Vias for Opto-Electronic Interconnects in Organic Substrates/Printed Circuit Boards

John H. Lau, M. S. Zhang, S. W. Ricky Lee

J. Electron. Packag. September 2011, 133(3): 031010.

DOI: https://doi.org/10.1115/1.4004861

Published Online: September 26, 2011

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Topics: Design, Polymers, System-in-package, Waveguides, Simulation, Printed circuit boards, Optical interconnections, Integrated circuits, Engineering simulation, Heat

Journal Articles

Thermal Investigations of Integrated Circuits and Systems, THERMINIC'09

Marta Rencz

J. Electron. Packag. March 2011, 133(1): 010301.

DOI: https://doi.org/10.1115/1.3565444

Published Online: March 10, 2011

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Topics: Cooling, Electronic packaging, Heat transfer, Integrated circuits, Microchannel flow

Journal Articles

Mechanical Design of Electronic Systems

John H. L. Pang

J. Electron. Packag. March 2010, 132(1): 016501.

DOI: https://doi.org/10.1115/1.4000755

Published Online: March 19, 2010

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Topics: Circuits, Design, Design engineering, Electronic systems, Reliability, Testing, Integrated circuits, Circuit design, Integrated circuit packaging, Life testing

Journal Articles

Three-Dimensional Modeling of Mold Filling in Microchip Encapsulation Process With a Matrix-Array Arrangement

M. K. Abdullah, M. Z. Abdullah, M. A. Mujeebu, Horizon Gitano, Z. M. Ariff, R. Razali, K. A. Ahmad

J. Electron. Packag. March 2010, 132(1): 014502.

DOI: https://doi.org/10.1115/1.4000719

Published Online: March 4, 2010

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Topics: Cavities, Computer simulation, Epoxy adhesives, Epoxy resins, Finite difference methods, Flow (Dynamics), Integrated circuits, Molding, Pressure, Simulation

Journal Articles

Microscale and Nanoscale Thermal Characterization Techniques

J. Christofferson, K. Maize, Y. Ezzahri, J. Shabani, X. Wang, A. Shakouri

J. Electron. Packag. December 2008, 130(4): 041101.

DOI: https://doi.org/10.1115/1.2993145

Published Online: November 13, 2008

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Topics: Imaging, Microscale devices, Nanoscale phenomena, Probes, Resolution (Optics), Temperature, Thermal characterization, Thermoreflectance, Wavelength, Atomic force microscopy

Journal Articles

Models of Steady Heat Conduction in Multiple Cylindrical Domains

Anand Desai, James Geer, Bahgat Sammakia

J. Electron. Packag. March 2006, 128(1): 10–17.

DOI: https://doi.org/10.1115/1.2159003

Published Online: May 18, 2005

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Topics: Boundary-value problems, Geometry, Heat, Heat conduction, Heat flux, Heat sinks, Integrated circuits, Temperature, Thermal conductivity, Thermal management

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Journal citation

NARROW

Special Section on InterPACK2021

Detection of Unusual Thermal Activities in a Semiconductor Chip Using Backside Infrared Thermal Imaging

Compact Transient Thermal Model of Microfluidically Cooled Three-Dimensional Stacked Chips With Pin-Fin Enhanced Microgap

Minimizing Temperature Nonuniformity by Optimal Arrangement of Hotspots in Vertically Stacked Three-Dimensional Integrated Circuits

Detection of Sealant Delamination in Integrated Circuit Package Using Nondestructive Evaluation

Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA) With Through Silicon Via and Copper Pillar Bonding Approach

Reduced Order Modeling of Transient Heat Transfer in Microchip Interconnects

Inverse Conduction Heat Transfer and Kriging Interpolation Applied to Temperature Sensor Location in Microchips

Experimental and Numerical Investigation of Interdie Thermal Resistance in Three-Dimensional Integrated Circuits

Three-Dimensional Integrated Circuit With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications

Effect of Intermetallic Compounds on the Thermomechanical Fatigue Life of Three-Dimensional Integrated Circuit Package Microsolder Bumps: Finite Element Analysis and Study

Overview and Outlook of Three-Dimensional Integrated Circuit Packaging, Three-Dimensional Si Integration, and Three-Dimensional Integrated Circuit Integration

A Review of Recent Advances in Thermal Management in Three Dimensional Chip Stacks in Electronic Systems

Impact of Printed Circuit Board Via and Micro-Via Structures on Component Thermal Performances

Embedded Three-Dimensional Hybrid Integrated Circuit Integration System-in-Package With Through-Silicon Vias for Opto-Electronic Interconnects in Organic Substrates/Printed Circuit Boards

Thermal Investigations of Integrated Circuits and Systems, THERMINIC'09

Mechanical Design of Electronic Systems

Three-Dimensional Modeling of Mold Filling in Microchip Encapsulation Process With a Matrix-Array Arrangement

Microscale and Nanoscale Thermal Characterization Techniques

Models of Steady Heat Conduction in Multiple Cylindrical Domains

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