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Journal Articles

Module-Level Thermal Interface Material Degradation in HALT

Joshua Tompkins, Alicia Medina Garcia, David Huitink, Haitao Liao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011106.
Paper No: EP-22-1021
https://doi.org/10.1115/1.4056030
Published Online: November 23, 2022
View Article titled, Module-Level Thermal Interface Material Degradation in HALT
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Topics: Cycles, Life testing, Stress, Temperature, Testing, Thermal resistance, Vibration, Electronics, Reliability, Heating
Includes: Supplementary data
Journal Articles

Mechanical Design of Electronic Systems

John H. L. Pang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. March 2010, 132(1): 016501.
https://doi.org/10.1115/1.4000755
Published Online: March 19, 2010
View Article titled, Mechanical Design of Electronic Systems
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Topics: Circuits, Design, Design engineering, Electronic systems, Reliability, Testing, Integrated circuits, Circuit design, Integrated circuit packaging, Life testing
Journal Articles

Prognostics Assessment of Aluminum Support Structure on a Printed Circuit Board

Sony Mathew, Diganta Das, Michael Osterman, Michael Pecht, Robin Ferebee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 339–345.
https://doi.org/10.1115/1.2351897
Published Online: January 8, 2006
View Article titled, Prognostics Assessment of Aluminum Support Structure on a Printed Circuit Board
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Topics: Aluminum, Damage, Life testing, Shock (Mechanics), Stress, Vibration, Testing, Printed circuit boards, Cycles, Failure
Journal Articles

Could Shock Tests Adequately Mimic Drop Test Conditions?

E. Suhir, ASME Fellow
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 170–177.
https://doi.org/10.1115/1.1487356
Published Online: July 26, 2002
View Article titled, Could Shock Tests Adequately Mimic Drop Test Conditions?
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Topics: Dynamic response, Impulse (Physics), Shock (Mechanics), Vibration, Stress, Life testing, Deflection
Journal Articles

Accelerated Life Testing (ALT) in Microelectronics and Photonics: Its Role, Attributes, Challenges, Pitfalls, and Interaction With Qualification Tests

E. Suhir
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. September 2002, 124(3): 281–291.
https://doi.org/10.1115/1.1486470
Published Online: July 26, 2002
View Article titled, Accelerated Life Testing (ALT) in Microelectronics and Photonics: Its Role, Attributes, Challenges, Pitfalls, and Interaction With Qualification Tests
Open the PDF for Accelerated Life Testing (ALT) in Microelectronics and Photonics: Its Role, Attributes, Challenges, Pitfalls, and Interaction With Qualification Tests in another window
Topics: Failure, Failure mechanisms, Lasers, Life testing, Probability, Reliability, Stress, Temperature, Design, Microelectronic devices
Journal Articles

Hygro-Mechanical Durability of Underfilled Flip-Chip-on-Board (FCOB) Interconnects

J. H. Okura, A. Dasgupta, J. F. J. M. Caers
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 184–187.
https://doi.org/10.1115/1.1477193
Published Online: July 26, 2002
View Article titled, Hygro-Mechanical Durability of Underfilled Flip-Chip-on-Board (FCOB) Interconnects
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Topics: Durability, Intermetallic compounds, Stress, Finite element analysis, Life testing, Solder joints, Failure, Temperature
Journal Articles

Reliability of Postmolded IC Packages

L. T. Nguyen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1993, 115(4): 346–355.
https://doi.org/10.1115/1.2909343
Published Online: December 1, 1993
View Article titled, Reliability of Postmolded IC Packages
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Topics: Reliability, Molding, Stress, Adhesion, Water, Corrosion, Metals, Corners (Structural elements), Cracking (Materials), Damage