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Journal Articles

Improving Ambient Contrast Ratio and Color Uniformity of Mini Full Color Light-Emitting Diodes Using an SiO 2 /Graphite Bilayered Packaging Structure

Zong-Tao Li, Jun-Hao Wu, Zhi-yao Ren, Yao-xing Song, Jia-Sheng Li
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2022, 144(1): 011010.
Paper No: EP-20-1129
DOI: https://doi.org/10.1115/1.4050202
Published Online: August 6, 2021
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Topics: Electromagnetic scattering, Graphite, Light-emitting diodes, Nanoparticles, Packaging, Radiation (Physics)
Journal Articles

Design, Fabrication, and Testing of a Novel Design for Flexible Light-Emitting Diode Signage Modules

Ram C. Adhikari, Dawood S. Beyragh, Majid Pahlevani
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2021, 143(3): 031008.
Paper No: EP-20-1100
DOI: https://doi.org/10.1115/1.4049577
Published Online: February 19, 2021
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Topics: Deflection, Design, Finite element analysis, Light-emitting diodes, Manufacturing, Stress, Testing, Simulation, Finite element model, Engineering prototypes
Journal Articles

Scattering Nanoparticles-Induced Reflection Effect for Enhancing Optical Efficiency of Inverted Quantum Dots-Light-Emitting Diodes Combined With the Centrifugation Technique

Zong-Tao Li, Jia-Yong Liang, Jia-Sheng Li, Jie-Xin Li, Yong Tang
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2021, 143(2): 021002.
Paper No: EP-20-1041
DOI: https://doi.org/10.1115/1.4048034
Published Online: August 27, 2020
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Topics: Boron, Electromagnetic scattering, Light-emitting diodes, Nanoparticles, Radiation scattering, Reflection, Scattering (Physics), Quantum dots, Packaging, Geometry
Journal Articles

An Investigation Into the Optothermal Behavior of a High Power Red Light Emitting Diode: Impact of an Optical Path

Ahmet Mete Muslu, Burak Ozluk, Mehmet Arik
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2021, 143(1): 011007.
Paper No: EP-19-1020
DOI: https://doi.org/10.1115/1.4047381
Published Online: June 23, 2020
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Topics: Domes (Structural elements), Heat, Junctions, Light-emitting diodes, Temperature, Currents, Imaging, Temperature measurement
Journal Articles

Nearly Efficiency-Droop-Free AlGaN-Based Deep-Ultraviolet Light-Emitting Diode Without Electron-Blocking Layer

Hongfeng Jia, Huabin Yu, Zhongjie Ren, Chong Xing, Zhongling Liu, Yang Kang, Haiding Sun
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031115.
Paper No: EP-20-1017
DOI: https://doi.org/10.1115/1.4047286
Published Online: June 8, 2020
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Topics: Electrons, Light-emitting diodes, Leakage
Journal Articles

Thermal Analysis and Optimization of Light-Emitting Diodes Filament Lamp

Jie Liu, Jinglong Zou, Sheng Liu
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2021, 143(1): 011003.
Paper No: EP-19-1078
DOI: https://doi.org/10.1115/1.4046762
Published Online: June 4, 2020
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Topics: Energy dissipation, Heat, Light-emitting diodes, Optimization, Phosphors, Temperature, Junctions, Natural convection, Thermal analysis, Fins
Journal Articles

Characterization of the Interdependence Between the Light Output and Self-Heating of Gallium Nitride Light-Emitting Diodes

Bikramjit Chatterjee, James Spencer Lundh, Daniel Shoemaker, Tae Kyoung Kim, Hoyeon Kim, Noel C. Giebnik, Joon Seop Kwak, Jaehee Cho, Sukwon Choi
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031111.
Paper No: EP-20-1015
DOI: https://doi.org/10.1115/1.4047015
Published Online: May 13, 2020
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Topics: Gallium nitride, Heating, Light-emitting diodes, Nanoparticles, Temperature, Temperature measurement, Microscopy
Journal Articles

Systematical and Numerical Investigations on InGaN-Based Green Light-Emitting Diodes: Si-Doped Quantum Barriers, Engineered p-Electron Blocking Layer and AlGaN/GaN Structured p-Type Region

Tie Li, Guan-Long Cao, Hong-Juan Xie, Jing-Qin Wang, Zi-Hui Zhang
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031108.
Paper No: EP-19-1132
DOI: https://doi.org/10.1115/1.4046934
Published Online: May 4, 2020
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Topics: Electric fields, Electrons, Gallium nitride, Indium gallium nitride, Light-emitting diodes, Polarization (Electricity), Polarization (Light), Polarization (Waves), Quantum wells, Leakage
Journal Articles

Rapid Anneal-Free Welding of Cu Nanowires Network by Ultraviolet Light Irradiation for Transparent Electrodes in Optoelectronic Applications

Jun Wang, Yang Zhao, Han Chen, Yan Tang, Guozhen Liu, Renli Liang, Jiangnan Dai, Changqing Chen, Junyong Kang, Duanjun Cai
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031102.
Paper No: EP-19-1120
DOI: https://doi.org/10.1115/1.4046764
Published Online: April 17, 2020
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Topics: Electrodes, Irradiation (Radiation exposure), Nanowires, Transparency, Ultraviolet radiation, Light-emitting diodes, Welding
Journal Articles

The Optical Properties of Dual-Wavelength In x Ga 1−x N/GaN Nanorods for Wide-Spectrum Light-Emitting Diodes

Jie Zhao, Xuecheng Wei, Dongdong Liang, Qiang Hu, Jianchang Yan, Junxi Wang, Tongbo Wei
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031104.
Paper No: EP-19-1135
DOI: https://doi.org/10.1115/1.4046766
Published Online: April 17, 2020
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Topics: Gallium nitride, Light-emitting diodes, Nanorods, Wavelength, Emissions, Temperature
Journal Articles

Study on Reabsorption Properties of Quantum Dot Color Convertors for Light-Emitting Diode Packaging

Jia-Sheng Li, Yong Tang, Zong-Tao Li, Wen-Quan Kang, Xin-Rui Ding, Bin-Hai Yu
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2019, 141(4): 041006.
Paper No: EP-18-1071
DOI: https://doi.org/10.1115/1.4044475
Published Online: September 19, 2019
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Topics: Light-emitting diodes, Quantum dots, Packaging, Absorption, Light sources
Journal Articles

Progress and Perspective of Near-Ultraviolet and Deep-Ultraviolet Light-Emitting Diode Packaging Technologies

Yang Peng, Renli Liang, Yun Mou, Jiangnan Dai, Mingxiang Chen, Xiaobing Luo
Journal: Journal of Electronic Packaging
Article Type: Review Articles
J. Electron. Packag. December 2019, 141(4): 040804.
Paper No: EP-18-1089
DOI: https://doi.org/10.1115/1.4044624
Published Online: September 19, 2019
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Topics: Light-emitting diodes, Packaging, Ultraviolet radiation
Journal Articles

Special Issue on InterPACK 2018

Ercan M. Dede, Lauren Boteler, Changqing Chen, Przemyslaw Jakub Gromala, Benjamin Leever, Wei Li
Journal: Journal of Electronic Packaging
Article Type: Guest Editorial
J. Electron. Packag. September 2019, 141(3): 030301.
Paper No: EP-19-1036
DOI: https://doi.org/10.1115/1.4043484
Published Online: May 8, 2019
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Topics: Electronic packaging, Electronics, Microelectromechanical systems, Design, Internet of things, Condition monitoring, Data centers, Electric vehicles, Energy conversion, Engineering teachers
Journal Articles

Reduced Working Temperature of Quantum Dots-Light-Emitting Diodes Optimized by Quantum Dots at Silica-on-Chip Structure

Bin Xie, Haochen Liu, Xiao Wei Sun, Xingjian Yu, Ruikang Wu, Kai Wang, Xiaobing Luo
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031001.
Paper No: EP-18-1080
DOI: https://doi.org/10.1115/1.4042981
Published Online: April 10, 2019
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Topics: Heat, Light-emitting diodes, Nanoparticles, Phosphors, Quantum dots, Silicones, Temperature, Shells, Simulation
Journal Articles

Cylindrical Tuber Encapsulant Layer Realization by Patterned Surface for Chip-on-Board Light-Emitting Diodes Packaging

Xingjian Yu, Run Hu, Ruikang Wu, Bin Xie, Xiaoyu Zhang, Xiaobing Luo
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031005.
Paper No: EP-18-1076
DOI: https://doi.org/10.1115/1.4042982
Published Online: April 10, 2019
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Topics: Light-emitting diodes, Particulate matter, Phosphors, Silicones, Packaging, Wetting, Surface energy
Journal Articles

Thermal Management and Characterization of High-Power Wide-Bandgap Semiconductor Electronic and Photonic Devices in Automotive Applications

Seung Kyu Oh, James Spencer Lundh, Shahab Shervin, Bikramjit Chatterjee, Dong Kyu Lee, Sukwon Choi, Joon Seop Kwak, Jae-Hyun Ryou
Journal: Journal of Electronic Packaging
Article Type: Review Articles
J. Electron. Packag. June 2019, 141(2): 020801.
Paper No: EP-18-1026
DOI: https://doi.org/10.1115/1.4041813
Published Online: February 25, 2019
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Topics: Energy gap, Gallium nitride, Light-emitting diodes, Photonic equipment, Semiconductors (Materials), Temperature, Temperature measurement, Thermal management, Thermography, Automotive industry
Journal Articles

Effect of Packaging Architecture on the Optical and Thermal Performances of High-Power Light Emitting Diodes

Thong Kok Law, Fannon Lim, Yun Li, XuePeng Puan, G. K. E. Sng, J. W. Ronnie Teo
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031003.
Paper No: EP-16-1108
DOI: https://doi.org/10.1115/1.4036066
Published Online: June 14, 2017
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Topics: Bonding, Energy dissipation, Heat, Light-emitting diodes, Operating temperature, Packaging, Phosphors, Temperature, Thermal resistance, Light emission
Journal Articles

Thermal Performance of a Light Emitting Diode Light Engine for a Multipurpose Automotive Exterior Lighting System With Competing Board Technologies

Umut Zeynep Uras, Mehmet Arık, Enes Tamdoğan
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2017, 139(2): 020907.
Paper No: EP-16-1139
DOI: https://doi.org/10.1115/1.4036403
Published Online: June 12, 2017
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Topics: Engines, Light-emitting diodes, Temperature, Lumber, Flat heat pipes, Electronics, Thermal conductivity, Temperature distribution, Vapors
Journal Articles

Numerical and Experimental Study on the Transferred Volume in Phosphor Dip-Transfer Coating Process of Light-Emitting Diodes Packaging

Bofeng Shang, Xingjian Yu, Huai Zheng, Bin Xie, Qi Chen, Xiaobing Luo
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2016, 138(2): 021003.
Paper No: EP-15-1057
DOI: https://doi.org/10.1115/1.4033165
Published Online: April 19, 2016
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Topics: Coating processes, Computer simulation, Light-emitting diodes, Phosphors, Coatings, Packaging, Fluids
Journal Articles

Quantum Dots-Converted Light-Emitting Diodes Packaging for Lighting and Display: Status and Perspectives

Bin Xie, Run Hu, Xiaobing Luo
Journal: Journal of Electronic Packaging
Article Type: Review Articles
J. Electron. Packag. June 2016, 138(2): 020803.
Paper No: EP-16-1020
DOI: https://doi.org/10.1115/1.4033143
Published Online: April 19, 2016
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Topics: Light-emitting diodes, Packaging, Polymers