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Journal Articles

A Comparative Numerical Analysis of Cold Plates for Thermal Management of Chips With Hotspots

Mahdi Farahikia, Ping-Chuan Wang, Louis Reyes, Matthew Krumholtz
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2024, 146(3): 034501.
Paper No: EP-23-1066
https://doi.org/10.1115/1.4064523
Published Online: February 7, 2024
View Article titled, A Comparative Numerical Analysis of Cold Plates for Thermal Management of Chips With Hotspots
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Topics: Coolants, Fins, Numerical analysis, Plates (structures), Pumps, Temperature, Temperature distribution, Thermal management, Thermal resistance, Flow (Dynamics)
Journal Articles

Thermal-Hydraulic Performance and Optimization of Tube Ellipticity in a Plate Fin-And-Tube Heat Exchanger

Hua Zhu, Zhuo Yang, Tariq Amin Khan, Wei Li, Zhijian Sun, Jincai Du, Zhengjiang Zhang, Jianxin Zhou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031008.
Paper No: EP-18-1108
https://doi.org/10.1115/1.4043482
Published Online: May 17, 2019
View Article titled, Thermal-Hydraulic Performance and Optimization of Tube Ellipticity in a Plate Fin-And-Tube Heat Exchanger
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Topics: Artificial neural networks, Computational fluid dynamics, Computer simulation, Flow (Dynamics), Heat exchangers, Heat transfer, Optimization, Friction, Reynolds number, Genetic algorithms
Journal Articles

Influence of Glass Transition Temperature of Underfill on the Stress Behavior and Reliability of Microjoints Within a Chip Stacking Architecture

Jing-Yao Chang, Shin-Yi Huang, Chang-Chun Lee, Tung-Han Chuang, Tao-Chih Chang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2015, 137(3): 031007.
Paper No: EP-14-1083
https://doi.org/10.1115/1.4030392
Published Online: September 1, 2015
View Article titled, Influence of Glass Transition Temperature of Underfill on the Stress Behavior and Reliability of Microjoints Within a Chip Stacking Architecture
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Topics: Cycles, Glass transition, Reliability, Solders, Stress, Temperature, Numerical analysis, Failure, Tin, Failure mechanisms
Journal Articles

Optimization of a Hybrid Double-Side Jet Impingement Cooling System for High-Power Light Emitting Diodes

Sun-Min Kim, Kwang-Yong Kim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2014, 136(1): 011010.
Paper No: EP-13-1054
https://doi.org/10.1115/1.4026536
Published Online: February 14, 2014
View Article titled, Optimization of a Hybrid Double-Side Jet Impingement Cooling System for High-Power Light Emitting Diodes
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Topics: Cooling, Cooling systems, Design, Impingement cooling, Light-emitting diodes, Optimization, Temperature, Numerical analysis, Flow (Dynamics), Pressure
Journal Articles

Influence of Intermetallic Characteristics on the Solder Joint Strength of Halogen-Free Printed Circuit Board Assembly

Hung-Jen Chang, Jung-Hua Chou, Tao-Chih Chang, Chau-Jie Zhan, Min-Hsiung Hon, Chi-Shiung Hsi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021004.
https://doi.org/10.1115/1.4003989
Published Online: June 23, 2011
View Article titled, Influence of Intermetallic Characteristics on the Solder Joint Strength of Halogen-Free Printed Circuit Board Assembly
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Topics: Alloys, Ball-Grid-Array packaging, Intermetallic compounds, Lead-free solders, Solder joints, Solders, Tin, Fracture (Materials), Finishes, Printed circuit board assemblies
Journal Articles

Development of Analytical Model to a Temperature Distribution of a First Level Package With a Nonuniformly Powered Die

Abhijit Kaisare, Dereje Agonafer, A. Haji-Sheikh, Greg Chrysler, Ravi Mahajan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011005.
https://doi.org/10.1115/1.3068303
Published Online: February 12, 2009
View Article titled, Development of Analytical Model to a Temperature Distribution of a First Level Package With a Nonuniformly Powered Die
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Topics: Heat flux, Temperature, Temperature distribution, Computer simulation, Heat, Junctions, Heat sinks, Numerical analysis, Design, Optimization
Journal Articles

A Numerical Analysis of the Thermal Performance of Single Sided and Back-to-Back Tape Ball Grid Array Packages

Sandeep S. Tonapi, Sanjeev B. Sathe, Bahgat G. Sammakia, K. Srihari
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 305–310.
https://doi.org/10.1115/1.2351891
Published Online: February 10, 2006
View Article titled, A Numerical Analysis of the Thermal Performance of Single Sided and Back-to-Back Tape Ball Grid Array Packages
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Topics: Air flow, Ball-Grid-Array packages, Energy dissipation, Forced convection, Heat, Heat transfer, Numerical analysis, Temperature, Junctions, Temperature distribution
Journal Articles

Experiment and Numerical Analysis of the Residual Stresses in Underfill Resins for Flip Chip Package Applications

Man-Lung Sham, Jang-Kyo Kim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 47–51.
https://doi.org/10.1115/1.1849232
Published Online: March 21, 2005
View Article titled, Experiment and Numerical Analysis of the Residual Stresses in Underfill Resins for Flip Chip Package Applications
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Topics: Residual stresses, Resins, Strips, Numerical analysis, Temperature, Finite element analysis, Stress
Journal Articles

Thermal Performance Optimization of Radio Frequency Packages for Wireless Communication

Victor Adrian Chiriac, Tien-Yu Tom Lee, Vern Hause
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 429–434.
https://doi.org/10.1115/1.1827257
Published Online: January 24, 2005
View Article titled, Thermal Performance Optimization of Radio Frequency Packages for Wireless Communication
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Topics: Heat, Junctions, Optimization, Solders, Temperature, Thermal conductivity, Thermal resistance, Epoxy adhesives, Epoxy resins, Numerical analysis
Journal Articles

The Influence of the Thermal Conductivity on the Heat Transfer Performance in a Heat Sink

H. B. Ma, G. P. Peterson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 164–169.
https://doi.org/10.1115/1.1478058
Published Online: July 26, 2002
View Article titled, The Influence of the Thermal Conductivity on the Heat Transfer Performance in a Heat Sink
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Topics: Heat sinks, Heat transfer, Thermal conductivity, Temperature distribution, Cooling, Heat pipes, Numerical analysis
Journal Articles

Phase Structure and Cyclic Deformation in Eutectic Tin-Lead Alloy: A Numerical Analysis

Y.-L. Shen, W. Li, H. E. Fang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2001, 123(1): 74–78.
https://doi.org/10.1115/1.1324673
Published Online: June 29, 2000
View Article titled, Phase Structure and Cyclic Deformation in Eutectic Tin-Lead Alloy: A Numerical Analysis
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Topics: Alloys, Deformation, Shear (Mechanics), Stress, Fatigue, Tin, Damage, Eutectic alloys, Cycles, Modeling
Journal Articles

Conjugate Heat Transfer From a Two-Layer Substrate Model of a Convectively Cooled Circuit Board

S. A. Harman and, K. D. Cole
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 2001, 123(2): 156–158.
https://doi.org/10.1115/1.1348011
Published Online: March 31, 2000
View Article titled, Conjugate Heat Transfer From a Two-Layer Substrate Model of a Convectively Cooled Circuit Board
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Topics: Heat transfer, Printed circuit boards, Temperature, Temperature distribution, Fluids, Cooling, Circuit design, Forced convection, Numerical analysis
Journal Articles

Numerical Analysis of Impinging Air Flow and Heat Transfer in Plate-Fin Type Heat Sinks

Keiji Sasao, Mitsuru Honma, Atsuo Nishihara, Takayuki Atarashi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2001, 123(3): 315–318.
https://doi.org/10.1115/1.1371924
Published Online: October 5, 1999
View Article titled, Numerical Analysis of Impinging Air Flow and Heat Transfer in Plate-Fin Type Heat Sinks
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Topics: Air flow, Flow (Dynamics), Heat sinks, Heat transfer, Numerical analysis, Fins, Pressure drop
Journal Articles

Numerical and Experimental Prediction of Transitional Characteristics of Flow and Heat Transfer in an Array of Heated Blocks

Y. Asako, Y. Yamaguchi, M. Faghri
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1999, 121(3): 202–208.
https://doi.org/10.1115/1.2792685
Published Online: September 1, 1999
View Article titled, Numerical and Experimental Prediction of Transitional Characteristics of Flow and Heat Transfer in an Array of Heated Blocks
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Topics: Flow (Dynamics), Heat transfer, Ducts, Reynolds number, Computation, Flow visualization, Fluid dynamics, Numerical analysis, Plates (structures), Prandtl number
Journal Articles

Electronic Packaging Reflow Shape Prediction for the Solder Mask Defined Ball Grid Array

K.-N. Chiang, W.-L. Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. June 1998, 120(2): 175–178.
https://doi.org/10.1115/1.2792616
Published Online: June 1, 1998
View Article titled, Electronic Packaging Reflow Shape Prediction for the Solder Mask Defined Ball Grid Array
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Topics: Ball-Grid-Array packaging, Electronic packaging, Shapes, Solder masks, Solder joints, Density, Energy conservation, Failure, Fatigue, Gravity (Force)
Journal Articles

Heat Conduction in Concentric Cylinders: An Application to Electronic Packages

Sanjeev Sathe
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1994, 116(3): 230–233.
https://doi.org/10.1115/1.2905690
Published Online: September 1, 1994
View Article titled, Heat Conduction in Concentric Cylinders: An Application to Electronic Packages
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Topics: Cylinders, Electronic packages, Heat conduction, Heat, Thermal conductivity, Aluminum, Copper, Dielectric materials, Dimensions, Electronic equipment
Journal Articles

Heat Transfer Study of Staggered Thin Rectangular Blocks in a Channel Flow

Ching Jen Chen, Ramiro H. Bravo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1991, 113(3): 294–300.
https://doi.org/10.1115/1.2905409
Published Online: September 1, 1991
View Article titled, Heat Transfer Study of Staggered Thin Rectangular Blocks in a Channel Flow
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Topics: Channel flow, Heat transfer, Heat exchangers, Flow (Dynamics), Separation (Technology), Temperature, Computation, Fluid dynamics, Fluids, Numerical analysis
Journal Articles

Determination of Stress Intensity Factors for Interfacial Cracks in Bimaterial Systems

Yi-Hsin Pao, Tsung-Yu Pan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1990, 112(2): 154–161.
https://doi.org/10.1115/1.2904356
Published Online: June 1, 1990
View Article titled, Determination of Stress Intensity Factors for Interfacial Cracks in Bimaterial Systems
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Topics: Fracture (Materials), Stress, Finite element methods, Geometry, Numerical analysis, Shear (Mechanics)