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Journal Articles

Surface Current Improvement of Magnesium-Doped Hexagonal Boron Nitride Monolayer by Additional Nitrogen Gas Flow

Yuejin Wang, Guozhen Liu, Shiqiang Lu, Bin Guo, Hongye Zhang, Fuchun Xu, Xiaohong Chen, Duanjun Cai, Junyong Kang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031103.
Paper No: EP-19-1121
https://doi.org/10.1115/1.4046765
Published Online: April 17, 2020
View Article titled, Surface Current Improvement of Magnesium-Doped Hexagonal Boron Nitride Monolayer by Additional Nitrogen Gas Flow
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Topics: Boron, Gas flow, Magnesium (Metal), Nitrogen, Thermal conductivity, Optoelectronic devices
Journal Articles

Special Section on InterPACK 2017—Part 2

Kaushik Mysore, Sreekant Narumanchi, Ercan Dede, Reza Khiabani
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. June 2018, 140(2): 020301.
Paper No: EP-18-1012
https://doi.org/10.1115/1.4039963
Published Online: May 9, 2018
View Article titled, Special Section on InterPACK 2017—Part 2
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Topics: Batteries, Density, Electronic packaging, Microelectromechanical systems, Optoelectronic devices, Packaging, Semiconductor wafers, Sensors, Reliability
Journal Articles

Influences of Solder Wetting on Self-Alignment Accuracy and Modeling for Optoelectronic Devices Assembly

Ming Kong, Sungeun Jeon, Chiwon Hwang, Y. C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2012, 134(2): 021002.
https://doi.org/10.1115/1.4006513
Published Online: June 11, 2012
View Article titled, Influences of Solder Wetting on Self-Alignment Accuracy and Modeling for Optoelectronic Devices Assembly
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Topics: Manufacturing, Optoelectronic devices, Solders, Wetting, Modeling, Vehicles
Journal Articles

Embedded Three-Dimensional Hybrid Integrated Circuit Integration System-in-Package With Through-Silicon Vias for Opto-Electronic Interconnects in Organic Substrates/Printed Circuit Boards

John H. Lau, M. S. Zhang, S. W. Ricky Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031010.
https://doi.org/10.1115/1.4004861
Published Online: September 26, 2011
View Article titled, Embedded Three-Dimensional Hybrid Integrated Circuit Integration System-in-Package With Through-Silicon Vias for Opto-Electronic Interconnects in Organic Substrates/Printed Circuit Boards
Open the PDF for Embedded Three-Dimensional Hybrid Integrated Circuit Integration System-in-Package With Through-Silicon Vias for Opto-Electronic Interconnects in Organic Substrates/Printed Circuit Boards in another window
Topics: Design, Polymers, System-in-package, Waveguides, Simulation, Printed circuit boards, Optical interconnections, Integrated circuits, Engineering simulation, Heat
Journal Articles

The Nature of Centroidal Locus in Misaligned Flip-Chip Solder Joints

G. Subbarayan, A. Deshpande
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1997, 119(3): 156–162.
https://doi.org/10.1115/1.2792228
Published Online: September 1, 1997
View Article titled, The Nature of Centroidal Locus in Misaligned Flip-Chip Solder Joints
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Topics: Flip-chip, Solder joints, Cross section (Physics), Three-dimensional models, Design, Optoelectronic devices, Shapes