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Journal Articles

Evaporative Wicking Phenomena on Nanotextured Surfaces

Duong Vy Le, Quang N. Pham, Jonggyu Lee, Shiwei Zhang, Yoonjin Won
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031013.
Paper No: EP-18-1104
DOI: https://doi.org/10.1115/1.4044373
Published Online: September 19, 2019
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Topics: Copper, Evaporation, Flux (Metallurgy), Heat, Heat flux, Permeability
Journal Articles

Characterization of Hybrid Wicking Structures for Flexible Vapor Chambers

Dylan P. McNally, Ryan Lewis, Y. C. Lee
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2019, 141(1): 011005.
Paper No: EP-18-1064
DOI: https://doi.org/10.1115/1.4042255
Published Online: February 25, 2019
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Topics: Columns (Structural), Flow (Dynamics), Permeability, Pressure, Vapors, Testing, Copper, Water
Journal Articles

A Further Study on the Analytical Model for the Permeability in Flip-Chip Packaging

X. J. Yao, J. J. Fang, Wenjun Zhang
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 011001.
Paper No: EP-17-1019
DOI: https://doi.org/10.1115/1.4038391
Published Online: March 2, 2018
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Topics: Flip-chip, Flow (Dynamics), Permeability, Porous materials, Packaging
Journal Articles

Modeling of Resin Flow in Reinforced Dielectric Prepregs

Pavel Simacek, Suresh G. Advani, Kossi Zonvide, Leonard W. Barrett
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021001.
DOI: https://doi.org/10.1115/1.2837510
Published Online: April 15, 2008
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Topics: Copper, Flow (Dynamics), Pressure, Resins, Printed circuit boards, Permeability, Viscosity, Porosity
Journal Articles

Compact Modeling of Fluid Flow and Heat Transfer in Straight Fin Heat Sinks

Duckjong Kim, Sung Jin Kim
Journal: Journal of Electronic Packaging
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 247–255.
DOI: https://doi.org/10.1115/1.1756149
Published Online: July 8, 2004
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Topics: Flow (Dynamics), Fluid dynamics, Heat sinks, Heat transfer, Modeling, Porous materials, Temperature distribution, Permeability, Pressure drop
Journal Articles

A Model for Underfill Viscous Flow Considering the Resistance Induced by Solder Bumps

Chyi-Lang Lai, Wen-Bin Young
Journal: Journal of Electronic Packaging
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 186–194.
DOI: https://doi.org/10.1115/1.1649244
Published Online: July 8, 2004
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Topics: Flow (Dynamics), Flow simulation, Permeability, Plates (structures), Porous materials, Simulation, Solders, Shapes, Cylinders
Journal Articles

The Green Function and Its Application to Heat Transfer in a Low Permeability Porous Channel

C. Cui, X. Y. Huang, C. Y. Liu
Journal: Journal of Electronic Packaging
Article Type: Technical Papers
J. Electron. Packag. September 2000, 122(3): 274–278.
DOI: https://doi.org/10.1115/1.1287929
Published Online: July 11, 1999
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Topics: Heat, Heat transfer, Permeability, Porous materials, Temperature, Flow (Dynamics), Heat flux, Heat sinks