1-8 of 8
Phonons
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Thermal Spreading Resistance of Surface Adjacent Localized Heating-Induced Size Effects in Semiconductors

Amir Abdolhosseinzadeh, Nazli Donmezer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041108.
Paper No: EP-24-1026
https://doi.org/10.1115/1.4065945
Published Online: July 26, 2024
View Article titled, Thermal Spreading Resistance of Surface Adjacent Localized Heating-Induced Size Effects in Semiconductors
Open the PDF for Thermal Spreading Resistance of Surface Adjacent Localized Heating-Induced Size Effects in Semiconductors in another window
Topics: Heat, Heating, Phonons, Temperature
Journal Articles

Hybrid Monte Carlo-Diffusion Studies of Modeling Self-Heating in Ballistic-Diffusive Regime for Gallium Nitride HEMTs

Han-Ling Li, Yang Shen, Yu-Chao Hua, S. L. Sobolev, Bing-Yang Cao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011203.
Paper No: EP-22-1007
https://doi.org/10.1115/1.4054698
Published Online: July 13, 2022
View Article titled, Hybrid Monte Carlo-Diffusion Studies of Modeling Self-Heating in Ballistic-Diffusive Regime for Gallium Nitride HEMTs
Open the PDF for Hybrid Monte Carlo-Diffusion Studies of Modeling Self-Heating in Ballistic-Diffusive Regime for Gallium Nitride HEMTs in another window
Topics: Diffusion (Physics), Gallium nitride, Heat, Heating, Modeling, Phonons, Simulation, Temperature, Heat conduction, Junctions
Journal Articles

Applications and Impacts of Nanoscale Thermal Transport in Electronics Packaging

Ronald J. Warzoha, Adam A. Wilson, Brian F. Donovan, Nazli Donmezer, Ashutosh Giri, Patrick E. Hopkins, Sukwon Choi, Darshan Pahinkar, Jingjing Shi, Samuel Graham, Zhiting Tian, Laura Ruppalt
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. June 2021, 143(2): 020804.
Paper No: EP-20-1070
https://doi.org/10.1115/1.4049293
Published Online: February 22, 2021
View Article titled, Applications and Impacts of Nanoscale Thermal Transport in Electronics Packaging
Open the PDF for Applications and Impacts of Nanoscale Thermal Transport in Electronics Packaging in another window
Topics: Electronics, Gallium nitride, Heat, Nanoscale phenomena, Phonons, Temperature, Thermal conductivity, Electromagnetic scattering, Energy gap, Diamonds
Journal Articles

The Doping Dependence of the Thermal Conductivity of Bulk Gallium Nitride Substrates

Yiwen Song, James Spencer Lundh, Weijie Wang, Jacob H. Leach, Devon Eichfeld, Anusha Krishnan, Carlos Perez, Dong Ji, Trent Borman, Kevin Ferri, Jon-Paul Maria, Srabanti Chowdhury, Jae-Hyun Ryou, Brian M. Foley, Sukwon Choi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041112.
Paper No: EP-20-1014
https://doi.org/10.1115/1.4047578
Published Online: July 10, 2020
View Article titled, The Doping Dependence of the Thermal Conductivity of Bulk Gallium Nitride Substrates
Open the PDF for The Doping Dependence of the Thermal Conductivity of Bulk Gallium Nitride Substrates in another window
Topics: Gallium nitride, Thermal conductivity, Phonons, Raman spectroscopy, Steady state, Thermoreflectance
Journal Articles

A Finite Difference Lattice Boltzmann Method to Simulate Multidimensional Subcontinuum Heat Conduction

Cheng Chen, James Geer, Bahgat Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2016, 138(4): 041008.
Paper No: EP-16-1053
https://doi.org/10.1115/1.4034856
Published Online: October 20, 2016
View Article titled, A Finite Difference Lattice Boltzmann Method to Simulate Multidimensional Subcontinuum Heat Conduction
Open the PDF for A Finite Difference Lattice Boltzmann Method to Simulate Multidimensional Subcontinuum Heat Conduction in another window
Topics: Diffusion (Physics), Heat conduction, Lattice Boltzmann methods, Phonons, Silicon, Temperature, Thermal conductivity, Density, Heat, Equilibrium (Physics)
Journal Articles

Thermal Phenomena in Nanoscale Transistors

Eric Pop, Kenneth E. Goodson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2006, 128(2): 102–108.
https://doi.org/10.1115/1.2188950
Published Online: December 14, 2006
View Article titled, Thermal Phenomena in Nanoscale Transistors
Open the PDF for Thermal Phenomena in Nanoscale Transistors in another window
Topics: Phonons, Silicon, Transistors, Heat, Nanoscale phenomena, Electrons, Nanowires
Journal Articles

Lattice Boltzmann Modeling of Subcontinuum Energy Transport in Crystalline and Amorphous Microelectronic Devices

Rodrigo Escobar, Brian Smith, Cristina Amon
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2006, 128(2): 115–124.
https://doi.org/10.1115/1.2188951
Published Online: January 19, 2006
View Article titled, Lattice Boltzmann Modeling of Subcontinuum Energy Transport in Crystalline and Amorphous Microelectronic Devices
Open the PDF for Lattice Boltzmann Modeling of Subcontinuum Energy Transport in Crystalline and Amorphous Microelectronic Devices in another window
Topics: Phonons, Silicon, Temperature, Thermal conductivity, Thin films, Lattice Boltzmann methods, Mean free path, Microelectronic devices, Electrical conductivity
Journal Articles

Nanoscale Thermal Phenomena in Tunnel Junctions for Spintronics Applications

Yongho “Sungtaek” Ju
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2006, 128(2): 109–114.
https://doi.org/10.1115/1.2165215
Published Online: December 5, 2005
View Article titled, Nanoscale Thermal Phenomena in Tunnel Junctions for Spintronics Applications
Open the PDF for Nanoscale Thermal Phenomena in Tunnel Junctions for Spintronics Applications in another window
Topics: Electrodes, Heat, Junctions, Thermal resistance, Tunnels, Spintronics, Electrons, Heat conduction, Tunnel construction, Phonons