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Journal Articles

Extreme Drop Durability of Sintered Silver Traces Printed With Extrusion and Aerosol Jet Processes

Hisham Abusalma, Hayden Richards, Abhijit Dasgupta, Andres Bujanda, Harvey Tsang, Jian Yu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041119.
Paper No: EP-24-1050
https://doi.org/10.1115/1.4066320
Published Online: September 12, 2024
View Article titled, Extreme Drop Durability of Sintered Silver Traces Printed With Extrusion and Aerosol Jet Processes
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Topics: Aerosols, Cantilevers, Durability, Extruding, Finite element analysis, Silver, Testing, Printing, Shock (Mechanics), Strain gages
Journal Articles

Simultaneous Characterization of Both Coefficients of Thermal Expansion and Thermal Warpages of Flip-Chip Packages With a Cap Using Strain Gauges

Y. W. Wang, M. Y. Tsai, Y. S. Chou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2024, 146(3): 031001.
Paper No: EP-23-1070
https://doi.org/10.1115/1.4064354
Published Online: January 8, 2024
View Article titled, Simultaneous Characterization of Both Coefficients of Thermal Expansion and Thermal Warpages of Flip-Chip Packages With a Cap Using Strain Gauges
Open the PDF for Simultaneous Characterization of Both Coefficients of Thermal Expansion and Thermal Warpages of Flip-Chip Packages With a Cap Using Strain Gauges in another window
Topics: Finite element methods, Flip-chip packages, Gages, Strain gages, Warping
Journal Articles

Experimental SAC305 Shear Stress–Strain Hysteresis Loop Construction Using Hall's One-Dimensional Model Based on Strain Gages Measurements

J.-B. Libot, J. Alexis, O. Dalverny, L. Arnaud, P. Milesi, F. Dulondel
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2019, 141(2): 021002.
Paper No: EP-17-1123
https://doi.org/10.1115/1.4042806
Published Online: March 1, 2019
View Article titled, Experimental SAC305 Shear Stress–Strain Hysteresis Loop Construction Using Hall's One-Dimensional Model Based on Strain Gages Measurements
Open the PDF for Experimental SAC305 Shear Stress–Strain Hysteresis Loop Construction Using Hall's One-Dimensional Model Based on Strain Gages Measurements in another window
Topics: Manufacturing, Shear stress, Solder joints, Solders, Strain gages, Temperature, Thermomechanics, Cycles, Construction, Shear (Mechanics)
Journal Articles

Impact Isolation Through the Use of Compliant Interconnects for Microelectronic Packages

Wei Chen, Anirudh Bhat, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2015, 137(4): 041005.
Paper No: EP-14-1064
https://doi.org/10.1115/1.4031680
Published Online: October 12, 2015
View Article titled, Impact Isolation Through the Use of Compliant Interconnects for Microelectronic Packages
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Topics: Displacement, Manufacturing, Polymers, Simulation, Testing, Accelerometers, Engineering simulation, Strain gages, Finite element analysis, Engineering prototypes
Journal Articles

Strain Transfer Analysis of Integrated Surface Acoustic Wave Sensors

Jochen Hempel, Sohaib Anees, Elena Zukowski, Michael Berndt, Jürgen Wilde, Leonhard M. Reindl
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2014, 136(4): 041002.
Paper No: EP-13-1078
https://doi.org/10.1115/1.4026437
Published Online: September 19, 2014
View Article titled, Strain Transfer Analysis of Integrated Surface Acoustic Wave Sensors
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Topics: Sensors, Simulation, Strain gages, Strain sensors, Stress, Temperature, Cycles, Surface acoustic waves
Journal Articles

Measurement of Transient Dynamic Response of Circuit Boards of a Handheld Device During Drop Using 3D Digital Image Correlation

S. B. Park, Chirag Shah, Jae B. Kwak, Changsoo Jang, Soonwan Chung, James M. Pitarresi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2008, 130(4): 044502.
https://doi.org/10.1115/1.3000097
Published Online: November 17, 2008
View Article titled, Measurement of Transient Dynamic Response of Circuit Boards of a Handheld Device During Drop Using 3D Digital Image Correlation
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Topics: Accelerometers, Deformation, Dynamic response, Printed circuit boards, Strain gages, Transients (Dynamics), Lumber, Displacement
Journal Articles

Industrial Electonics: Devices and Systems, Second Edition

Dale R. Patrick, Stephen W. Fardo, Anthony J. Rafanelli
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. September 2001, 123(3): 319.
https://doi.org/10.1115/1.1387243
Published Online: September 1, 2001
View Article titled, Industrial Electonics: Devices and Systems, Second Edition
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Topics: Engineers, Transistors, Computers, Junctions, Electronics, Electronics engineers, Energy resources, Gates (Closures), Generators, Mechanical engineering
Journal Articles

Evaluation of Elasto-Plastic Interfacial Fracture Parameters in Solder-Copper Bimaterial Using Moire´ Interferometry

H. Krishnamoorthy, H. V. Tippur
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1998, 120(3): 267–274.
https://doi.org/10.1115/1.2792632
Published Online: September 1, 1998
View Article titled, Evaluation of Elasto-Plastic Interfacial Fracture Parameters in Solder-Copper Bimaterial Using Moire´ Interferometry
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Topics: Copper, Fracture (Materials), Fracture (Process), Interferometry, Solders, Deformation, Failure, Fracture toughness, Geometry, Strain gages
Journal Articles

An Experimental/Analytical Study of Strains in Encapsulated Assemblies

T. R. Guess, S. N. Burchett
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1993, 115(3): 298–304.
https://doi.org/10.1115/1.2909332
Published Online: September 1, 1993
View Article titled, An Experimental/Analytical Study of Strains in Encapsulated Assemblies
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Topics: Casting, Epoxy adhesives, Epoxy resins, Finite element analysis, Hardening (Curing), Metals, Strain gages, Stress, Temperature, Thermocouples
Journal Articles

Measurement of Mechanical Behavior of High Lead Lead-Tin Solder Joints Subjected to Thermal Cycling

Yi-Hsin Pao, Scott Badgley, Ratan Govila, Linda Baumgartner, Richard Allor, Ron Cooper
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1992, 114(2): 135–144.
https://doi.org/10.1115/1.2906410
Published Online: June 1, 1992
View Article titled, Measurement of Mechanical Behavior of High Lead Lead-Tin Solder Joints Subjected to Thermal Cycling
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Topics: Mechanical behavior, Solder joints, Fracture (Process), Solders, Stress, Creep, Fatigue, Shear stress, Adhesives, Alloys
Journal Articles

Effects of Configuration on Plastic Package Stresses

L. T. Nguyen, S. A. Gee, W. F. v. d. Bogert
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1991, 113(4): 397–404.
https://doi.org/10.1115/1.2905426
Published Online: December 1, 1991
View Article titled, Effects of Configuration on Plastic Package Stresses
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Topics: Stress, Coating processes, Coatings, Compressive stress, Molding, Finite element analysis, Silicones, Simulation, Strain gages
Journal Articles

Strains in Aluminum-Adhesive-Ceramic Trilayers

P. M. Hall, F. L. Howland, Y. S. Kim, L. H. Herring
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1990, 112(4): 288–302.
https://doi.org/10.1115/1.2904381
Published Online: December 1, 1990
View Article titled, Strains in Aluminum-Adhesive-Ceramic Trilayers
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Topics: Adhesives, Aluminum, Ceramics, Epoxy adhesives, Epoxy resins, Elastic moduli, Temperature, Dimensions, Elastomers, Heat