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Journal Articles

Demonstration of a Compliant Microspring Array as a Thermal Interface Material for Pluggable Optoelectronic Transceiver Modules

Jin Cui, Liang Pan, Justin A. Weibel

J. Electron. Packag. September 2020, 142(3): 031114.

Paper No: EP-19-1110

DOI: https://doi.org/10.1115/1.4047356

Published Online: June 8, 2020

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Topics: Heat sinks, Polymers, Surface roughness, Pressure, Thermal conductivity, Thermal resistance

Journal Articles

Evaluation of Bending Strength of Window Glass Substrate With Considerations of Uni- and Bi-Axial Loading and Free Edge Stresses

M. Y. Tsai, H. J. Chen, J. H. Yeh

J. Electron. Packag. December 2019, 141(4): 041007.

Paper No: EP-19-1034

DOI: https://doi.org/10.1115/1.4044961

Published Online: October 18, 2019

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Topics: Bending strength, Boundary-value problems, Displacement, Glass, Stress, Failure mechanisms, Surface roughness

Journal Articles

Experimental Study on Thermal Contact Resistance Improvement for Optical Fiber by Using Low-Melting Temperature Alloy

Wen-Xiao Chu, Hao-Yu Lin, Chi-Chuan Wang

J. Electron. Packag. March 2020, 142(1): 014502.

Paper No: EP-19-1039

DOI: https://doi.org/10.1115/1.4044774

Published Online: September 24, 2019

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Topics: Contact resistance, Melting, Optical fiber, Temperature, Pressure, Alloys, Stress, Heating, Surface roughness, Heat sinks

Journal Articles

Relationship Between the Intermetallic Compounds Growth and the Microcracking Behavior of Lead-Free Solder Joints

Tong An, Fei Qin

J. Electron. Packag. March 2016, 138(1): 011002.

Paper No: EP-15-1079

DOI: https://doi.org/10.1115/1.4032349

Published Online: March 10, 2016

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Topics: Failure mechanisms, Solder joints, Solders, Surface roughness, Lead-free solders, Intermetallic compounds, Tensile strength, Microcracks, Tin

Journal Articles

A Multiphysics Finite Element Model of a 35A Automotive Connector Including Multiscale Rough Surface Contact

Santosh V. Angadi, Robert L. Jackson, Song-yul Choe, George T. Flowers, Bong-Yi Lee, Liang Zhong

J. Electron. Packag. March 2012, 134(1): 011001.

DOI: https://doi.org/10.1115/1.4005955

Published Online: March 19, 2012

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Topics: Cables, Contact resistance, Finite element model, Heating, Surface roughness, Temperature, Joules, Current density, Stress, Flow (Dynamics)

Journal Articles

Surface Topographical Characterization of Gold Aluminide Compound for Thermosonic Ball Bonding

M. F. Rosle, S. Abdullah, M. A. A. Hamid, A. R. Daud, A. Jalar, Z. Kornain

J. Electron. Packag. December 2010, 132(4): 041014.

DOI: https://doi.org/10.1115/1.4002728

Published Online: December 9, 2010

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Topics: Bonding, Surface roughness

Journal Articles

Determination of Spread Activation Energy and Assessment of Wetting Behavior of Solders on Metallic Substrates

K. N. Prabhu, G. Kumar

J. Electron. Packag. December 2010, 132(4): 041001.

DOI: https://doi.org/10.1115/1.4002899

Published Online: November 19, 2010

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Topics: Solders, Surface roughness, Tin, Wetting, Relaxation (Physics)

Journal Articles

Test Methods for Silicon Die Strength

M. Y. Tsai, C. H. Chen, C. S. Lin

J. Electron. Packag. December 2006, 128(4): 419–426.

DOI: https://doi.org/10.1115/1.2351907

Published Online: February 6, 2006

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Topics: Silicon, Stress, Semiconductor wafers, Failure, Surface roughness, Deflection, Finite element analysis

Journal Articles

Thermal Behavior of Nominally Flat Silicon-Based Heat Spreaders

Ta-Wei Lin, Ming-Chang Wu, Cheng-Hsien Peng, Po-Li Chen, Ying-Huei Hung

J. Electron. Packag. December 2006, 128(4): 370–379.

DOI: https://doi.org/10.1115/1.2351902

Published Online: December 24, 2005

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Topics: Flat heat pipes, Silicon, Surface roughness, Thermal resistance, Natural convection, Heat transfer, Heat

Journal Articles

Thermal Joint Resistance of Polymer-Metal Rough Interfaces

M. Bahrami, M. M. Yovanovich, E. E. Marotta

J. Electron. Packag. March 2006, 128(1): 23–29.

DOI: https://doi.org/10.1115/1.2159005

Published Online: May 11, 2005

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Topics: Deformation, Metals, Polymers, Surface roughness, Thermal resistance, Temperature, Microhardness

Journal Articles

Effects of Two-Dimensional Roughness in Flow in Microchannels

Xiang-Qi Wang, Christopher Yap, Arun Sadashiv Mujumdar

J. Electron. Packag. September 2005, 127(3): 357–361.

DOI: https://doi.org/10.1115/1.1997164

Published Online: August 5, 2004

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Topics: Poiseuille flow, Surface roughness, Friction, Flow (Dynamics), Microchannels

Journal Articles

Effects of Wafer Cleaning and Annealing on Glass/Silicon Wafer Direct Bonding

Hong-Seok Min, Young-Chang Joo, Oh-Sung Song

J. Electron. Packag. March 2004, 126(1): 120–123.

DOI: https://doi.org/10.1115/1.1649238

Published Online: April 30, 2004

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Topics: Annealing, Bonding, Glass, Semiconductor wafers, Temperature, Surface roughness, Scanning probe microscopy

Journal Articles

Effects of Wafer Thinning Condition on the Roughness, Morphology and Fracture Strength of Silicon Die

Neil McLellan, Nelson Fan, Shilai Liu, Kim Lau, Jingshen Wu

J. Electron. Packag. March 2004, 126(1): 110–114.

DOI: https://doi.org/10.1115/1.1647123

Published Online: April 30, 2004

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Topics: Fracture toughness, Grinding, Semiconductor wafers, Surface roughness, Polishing, Plasma etching

Journal Articles

Thermal Interfacing Techniques for Electronic Equipment—A Perspective

Wataru Nakayama, Arthur E. Bergles

J. Electron. Packag. June 2003, 125(2): 192–199.

DOI: https://doi.org/10.1115/1.1568127

Published Online: June 10, 2003

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Topics: Contact resistance, Cooling, Electrical conductance, Electronic equipment, Flat heat pipes, Flow (Dynamics), Heat, Heat conduction, Heat sinks, Heat transfer

Journal Articles

Interfacial Versus Cohesive Failure on Polymer-Metal Interfaces in Electronic Packaging—Effects of Interface Roughness

Qizhou Yao, Jianmin Qu

J. Electron. Packag. June 2002, 124(2): 127–134.

DOI: https://doi.org/10.1115/1.1459470

Published Online: May 2, 2002

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Topics: Adhesion, Electronic packaging, Failure, Fracture (Materials), Metals, Polymers, Surface roughness, Interface roughness, Aluminum, Fracture mechanics

Journal Articles

Warpage Measurement on Dielectric Rough Surfaces of Microelectronics Devices by Far Infrared Fizeau Interferometry

K. Verma, B. Han, Mem. ASME

J. Electron. Packag. September 2000, 122(3): 227–232.

DOI: https://doi.org/10.1115/1.1286315

Published Online: December 20, 1999

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Topics: Interferometry, Surface roughness, Warping, Microelectronic devices

Journal Articles

Effect of Interface Roughness on Fatigue Crack Growth in Sn-Pb Solder Joints

J. K. Shang, Daping Yao

J. Electron. Packag. September 1996, 118(3): 170–173.

DOI: https://doi.org/10.1115/1.2792148

Published Online: September 1, 1996

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Topics: Fatigue cracks, Interface roughness, Solder joints, Tin, Fracture (Materials), Elasticity, Fracture mechanics, Intermetallic compounds, Shear strength, Solders

Journal Articles

Determination of Parameters Affecting Solder Paste Tack Strength as Measured in the IPC Tack Test: A Classical Design of Experiments Approach

Scott Anson, C. Sahay, Linda Head, James Constable

J. Electron. Packag. June 1996, 118(2): 94–100.

DOI: https://doi.org/10.1115/1.2792138

Published Online: June 1, 1996

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Topics: Experimental design, Solders, Probes, Printed circuit boards, Adhesion, Circuits, Drying, Electronics, Ovens, Pressure

Journal Articles

Contact Analysis of Regular Patterned Rough Surfaces in Magnetic Recording

Bharat Bhushan, Xuefeng Tian

J. Electron. Packag. March 1995, 117(1): 26–33.

DOI: https://doi.org/10.1115/1.2792064

Published Online: March 1, 1995

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Topics: Magnetic recording, Surface roughness, Design, Disks, Stress, Magnetic heads, Shapes, Thin films

Journal Articles

Factors Affecting the Adhesion of Fluoropolymer Composites to Commercial Copper Foils

L. J. Jimarez, L. J. Matienzo, A. A. Mehta

J. Electron. Packag. September 1993, 115(3): 256–263.

DOI: https://doi.org/10.1115/1.2909326

Published Online: September 1, 1993

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Topics: Adhesion, Composite materials, Copper foil, Fillers (Materials), Glass, Manufacturing, Lamination, Metals, Microelectronic packaging, Polymers

Journal citation

NARROW

Demonstration of a Compliant Microspring Array as a Thermal Interface Material for Pluggable Optoelectronic Transceiver Modules

Evaluation of Bending Strength of Window Glass Substrate With Considerations of Uni- and Bi-Axial Loading and Free Edge Stresses

Experimental Study on Thermal Contact Resistance Improvement for Optical Fiber by Using Low-Melting Temperature Alloy

Relationship Between the Intermetallic Compounds Growth and the Microcracking Behavior of Lead-Free Solder Joints

A Multiphysics Finite Element Model of a 35A Automotive Connector Including Multiscale Rough Surface Contact

Surface Topographical Characterization of Gold Aluminide Compound for Thermosonic Ball Bonding

Determination of Spread Activation Energy and Assessment of Wetting Behavior of Solders on Metallic Substrates

Test Methods for Silicon Die Strength

Thermal Behavior of Nominally Flat Silicon-Based Heat Spreaders

Thermal Joint Resistance of Polymer-Metal Rough Interfaces

Effects of Two-Dimensional Roughness in Flow in Microchannels

Effects of Wafer Cleaning and Annealing on Glass/Silicon Wafer Direct Bonding

Effects of Wafer Thinning Condition on the Roughness, Morphology and Fracture Strength of Silicon Die

Thermal Interfacing Techniques for Electronic Equipment—A Perspective

Interfacial Versus Cohesive Failure on Polymer-Metal Interfaces in Electronic Packaging—Effects of Interface Roughness

Warpage Measurement on Dielectric Rough Surfaces of Microelectronics Devices by Far Infrared Fizeau Interferometry

Effect of Interface Roughness on Fatigue Crack Growth in Sn-Pb Solder Joints

Determination of Parameters Affecting Solder Paste Tack Strength as Measured in the IPC Tack Test: A Classical Design of Experiments Approach

Contact Analysis of Regular Patterned Rough Surfaces in Magnetic Recording

Factors Affecting the Adhesion of Fluoropolymer Composites to Commercial Copper Foils

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