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Journal Articles

A Time Frequency Domain Based Approach for Ball Grid Array Solder Joint Fatigue Analysis Using Global Local Modeling Technique

Sushil Doranga, Dongji Xie, Jeffrey Lee, Andy Zhang, Xue Shi, Valeriy Khaldarov

J. Electron. Packag. September 2023, 145(3): 031007.

Paper No: EP-22-1070

DOI: https://doi.org/10.1115/1.4056886

Published Online: March 7, 2023

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Topics: Excitation, Fatigue life, Fatigue testing, Finite element analysis, Finite element model, Modeling, Resonance, Simulation, Solder joints, Stress

Journal Articles

Module-Level Thermal Interface Material Degradation in HALT

Joshua Tompkins, Alicia Medina Garcia, David Huitink, Haitao Liao

J. Electron. Packag. March 2023, 145(1): 011106.

Paper No: EP-22-1021

DOI: https://doi.org/10.1115/1.4056030

Published Online: November 23, 2022

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Topics: Cycles, Life testing, Stress, Temperature, Testing, Thermal resistance, Vibration, Electronics, Reliability, Heating

Includes: Supplementary data

Journal Articles

Accelerated Solder Interconnect Testing Under Electromigratory and Mechanical Strain Conditions

Mahsa Montazeri, Whit M. Vinson, David R. Huitink

J. Electron. Packag. June 2023, 145(2): 021002.

Paper No: EP-22-1037

DOI: https://doi.org/10.1115/1.4055024

Published Online: August 8, 2022

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Topics: Electrodiffusion, Failure, Solder joints, Solders, Stress, Temperature, Tension, Testing, Current density, Tin

Journal Articles

Viscoelastic Influence on the Board Level Assessment of Wafer Level Packages Under Drop Impact and Under Thermal Cycling

Abel Misrak, Rabin Bhandari, Dereje Agonafer

J. Electron. Packag. March 2023, 145(1): 011204.

Paper No: EP-21-1110

DOI: https://doi.org/10.1115/1.4054784

Published Online: August 3, 2022

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Topics: Glass transition, Reliability, Semiconductor wafers, Storage, Stress, Temperature, Testing, Viscoelasticity, Solders, Failure

Journal Articles

Prediction of Board Level Pad Cratering Strength With the Predefined Failure Criteria From Joint Level Testing

Qiming Zhang, S. W. Ricky Lee

J. Electron. Packag. December 2022, 144(4): 041010.

Paper No: EP-21-1030

DOI: https://doi.org/10.1115/1.4053309

Published Online: January 28, 2022

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Topics: Failure, Shear (Mechanics), Testing, Finite element analysis

Journal Articles

Evaluating the Reliability of Passive Server Components for Single-Phase Immersion Cooling

Jimil M. Shah, Keerthivasan Padmanaban, Hrishabh Singh, Surya Duraisamy Asokan, Satyam Saini, Dereje Agonafer

J. Electron. Packag. June 2022, 144(2): 021109.

Paper No: EP-21-1016

DOI: https://doi.org/10.1115/1.4052536

Published Online: October 14, 2021

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Topics: Cables, Cooling, Cycles, Fluids, Mineral oil, Printed circuit boards, Reliability, Temperature, Capacitance, Optical cables

Journal Articles

High Strain Rate Mechanical Properties of SAC-Q Solder for Extreme Temperatures After Exposure to Isothermal Aging Up to 90 Days

Pradeep Lall, Vishal Mehta, Jeff Suhling, Ken Blecker

J. Electron. Packag. June 2022, 144(2): 021108.

Paper No: EP-21-1060

DOI: https://doi.org/10.1115/1.4052073

Published Online: October 6, 2021

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Topics: Elastic moduli, Mechanical properties, Solders, Stress, Stress-strain curves, Temperature, Tensile strength, Testing, Operating temperature, High temperature

Journal Articles

Design, Fabrication, and Testing of a Novel Design for Flexible Light-Emitting Diode Signage Modules

Ram C. Adhikari, Dawood S. Beyragh, Majid Pahlevani

J. Electron. Packag. September 2021, 143(3): 031008.

Paper No: EP-20-1100

DOI: https://doi.org/10.1115/1.4049577

Published Online: February 19, 2021

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Topics: Deflection, Design, Finite element analysis, Light-emitting diodes, Manufacturing, Stress, Testing, Simulation, Finite element model, Engineering prototypes

Journal Articles

Design and Optimization of Control Strategy to Reduce Pumping Power in Dynamic Liquid Cooling

Rajesh Kasukurthy, Amruthavalli Rachakonda, Dereje Agonafer

J. Electron. Packag. September 2021, 143(3): 031001.

Paper No: EP-20-1016

DOI: https://doi.org/10.1115/1.4049018

Published Online: January 19, 2021

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Topics: Computational fluid dynamics, Coolants, Cooling, Flow (Dynamics), Flow control, Matlab, Optimization, Plates (structures), Temperature, Testing

Journal Articles

Flexure and Twist Test Reliability Assurance of Flexible Electronics

Pradeep Lall, Jinesh Narangaparambil, Ben Leever, Scott Miller

J. Electron. Packag. September 2020, 142(3): 031121.

Paper No: EP-20-1008

DOI: https://doi.org/10.1115/1.4047844

Published Online: August 7, 2020

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Topics: Bending (Stress), Cycles, Failure, Reliability, Sintering, Temperature, Inks, Flexible electronics, Testing, Printing

Journal Articles

An Overview of Thermal and Mechanical Design, Control, and Testing of the World's Most Powerful and Fastest Supercomputer

Anil Yuksel, Vic Mahaney, Chris Marroquin, Shurong Tian, Mark Hoffmeyer, Mark Schultz, Todd Takken

J. Electron. Packag. March 2021, 143(1): 011005.

Paper No: EP-19-1099

DOI: https://doi.org/10.1115/1.4046847

Published Online: June 4, 2020

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Topics: Design, Graphics processing units, Manufacturing, Water, Flow (Dynamics), Testing, Cooling

Journal Articles

Thermomechanical Degradation of Thermal Interface Materials: Accelerated Test Development and Reliability Analysis

Hayden Carlton, Dustin Pense, David Huitink

J. Electron. Packag. September 2020, 142(3): 031112.

Paper No: EP-19-1122

DOI: https://doi.org/10.1115/1.4047099

Published Online: May 21, 2020

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Topics: Temperature, Testing, Thermal resistance, Thermomechanics, Failure, Pumps, Steady state

Journal Articles

Vandal Glass Heat Distribution and the Effect of Glass Gap Adjustments in Outdoor Digital Display Components

Jeho Kim, J. Michael Brown, Yogendra Joshi, Kevin O'Connor, Marcos Diaz, Zhuomin Zhang, Peiyan Yang

J. Electron. Packag. September 2020, 142(3): 031120.

Paper No: EP-19-1127

DOI: https://doi.org/10.1115/1.4046933

Published Online: May 4, 2020

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Topics: Glass, Heat, Manufacturing, Solar energy, Solar radiation, Temperature, Testing, Simulation, Liquid crystals, Computational fluid dynamics

Journal Articles

Predictive Model Development and Validation for Raised Floor Plenum Data Center

Yogesh Fulpagare, Atul Bhargav, Yogendra Joshi

J. Electron. Packag. June 2020, 142(2): 021009.

Paper No: EP-18-1078

DOI: https://doi.org/10.1115/1.4046554

Published Online: March 19, 2020

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Topics: Computational fluid dynamics, Data centers, Temperature, Testing, Transients (Dynamics), Heat, Stress

Journal Articles

Impact of Aging on Mechanical Properties of Thermally Conductive Gap Fillers

Abel Misrak, Tushar Chauhan, Pavan Rajmane, Rabin Bhandari, Dereje Agonafer

J. Electron. Packag. March 2020, 142(1): 011011.

Paper No: EP-19-1064

DOI: https://doi.org/10.1115/1.4045157

Published Online: November 8, 2019

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Topics: Fillers (Materials), Fourier transform infrared spectroscopy, Infrared spectroscopy, Mechanical properties, Stress, Temperature, Testing, Thermomechanics, High temperature, Reliability

Journal Articles

Interconnect Fatigue Failure Parameter Isolation for Power Device Reliability Prediction in Alternative Accelerated Mechanical Cycling Test

Mahsa Montazeri, Cody J. Marbut, David Huitink

J. Electron. Packag. September 2019, 141(3): 031011.

Paper No: EP-18-1099

DOI: https://doi.org/10.1115/1.4043480

Published Online: May 24, 2019

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Topics: Cycles, Damage, Reliability, Shear (Mechanics), Solders, Stress, Temperature, Fatigue life, Failure, Finite element analysis

Journal Articles

Reliability Considerations for Oil Immersion-Cooled Data Centers

Jimil M. Shah, Richard Eiland, Pavan Rajmane, Ashwin Siddarth, Dereje Agonafer, Veerendra Mulay

J. Electron. Packag. June 2019, 141(2): 021007.

Paper No: EP-18-1050

DOI: https://doi.org/10.1115/1.4042979

Published Online: April 10, 2019

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Topics: Cooling, Data centers, Mineral oil, Printed circuit boards, Reliability, Temperature, Testing, Capacitors, Viscosity

Journal Articles

Characterization of Hybrid Wicking Structures for Flexible Vapor Chambers

Dylan P. McNally, Ryan Lewis, Y. C. Lee

J. Electron. Packag. March 2019, 141(1): 011005.

Paper No: EP-18-1064

DOI: https://doi.org/10.1115/1.4042255

Published Online: February 25, 2019

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Topics: Columns (Structural), Flow (Dynamics), Permeability, Pressure, Vapors, Testing, Copper, Water

Journal Articles

Assessment of Elastic–Plastic and Electrical Properties of Printed Silver-Based Interconnects for Flexible Electronics

Hsien-Chie Cheng, Ruei-You Hong, Wen-Hwa Chen

J. Electron. Packag. December 2018, 140(4): 041007.

Paper No: EP-18-1041

DOI: https://doi.org/10.1115/1.4041014

Published Online: September 10, 2018

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Topics: Dimensional analysis, Electrical properties, Finite element analysis, Flexible electronics, Inks, Modeling, Plasticity, Silver, Simulation, Stress

Journal Articles

Embedded Two-Phase Cooling of High Flux Electronics Via Press-Fit and Bonded FEEDS Coolers

Raphael K. Mandel, Daniel G. Bae, Michael M. Ohadi

J. Electron. Packag. September 2018, 140(3): 031003.

Paper No: EP-17-1081

DOI: https://doi.org/10.1115/1.4039264

Published Online: May 11, 2018

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Topics: Coolers, Cooling, Electronics, Flow (Dynamics), Fluids, Flux (Metallurgy), Heat, Heat flux, Manifolds, Microchannels

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Journal citation

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Supplemental Material

A Time Frequency Domain Based Approach for Ball Grid Array Solder Joint Fatigue Analysis Using Global Local Modeling Technique

Module-Level Thermal Interface Material Degradation in HALT

Accelerated Solder Interconnect Testing Under Electromigratory and Mechanical Strain Conditions

Viscoelastic Influence on the Board Level Assessment of Wafer Level Packages Under Drop Impact and Under Thermal Cycling

Prediction of Board Level Pad Cratering Strength With the Predefined Failure Criteria From Joint Level Testing

Evaluating the Reliability of Passive Server Components for Single-Phase Immersion Cooling

High Strain Rate Mechanical Properties of SAC-Q Solder for Extreme Temperatures After Exposure to Isothermal Aging Up to 90 Days

Design, Fabrication, and Testing of a Novel Design for Flexible Light-Emitting Diode Signage Modules

Design and Optimization of Control Strategy to Reduce Pumping Power in Dynamic Liquid Cooling

Flexure and Twist Test Reliability Assurance of Flexible Electronics

An Overview of Thermal and Mechanical Design, Control, and Testing of the World's Most Powerful and Fastest Supercomputer

Thermomechanical Degradation of Thermal Interface Materials: Accelerated Test Development and Reliability Analysis

Vandal Glass Heat Distribution and the Effect of Glass Gap Adjustments in Outdoor Digital Display Components

Predictive Model Development and Validation for Raised Floor Plenum Data Center

Impact of Aging on Mechanical Properties of Thermally Conductive Gap Fillers

Interconnect Fatigue Failure Parameter Isolation for Power Device Reliability Prediction in Alternative Accelerated Mechanical Cycling Test

Reliability Considerations for Oil Immersion-Cooled Data Centers

Characterization of Hybrid Wicking Structures for Flexible Vapor Chambers

Assessment of Elastic–Plastic and Electrical Properties of Printed Silver-Based Interconnects for Flexible Electronics

Embedded Two-Phase Cooling of High Flux Electronics Via Press-Fit and Bonded FEEDS Coolers

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