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Journal Articles

Thermal Property Estimation of Thin-Layered Structures by Means of Thermoreflectance Measurement and Network Identification by Deconvolution Algorithm

Daiki Higuma, João Vitor Thomsen Silveira, Byunggi Kim, Masahiro Nomura, Kazuyoshi Fushinobu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041115.
Paper No: EP-24-1015
https://doi.org/10.1115/1.4066086
Published Online: August 17, 2024
View Article titled, Thermal Property Estimation of Thin-Layered Structures by Means of Thermoreflectance Measurement and Network Identification by Deconvolution Algorithm
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Topics: Algorithms, Lasers, Thermal conductivity, Thermal properties, Thermoreflectance, Temperature, Heat, Flow (Dynamics), Thermal resistance, Interfacial thermal resistance
Journal Articles

Concurrent Thermal and Electrical Property Effects of Nano-Enhanced Phase Change Material for High-Voltage Electronics Applications

Ange-Christian Iradukunda, Josh Kasitz, Hayden Carlton, David Huitink, Amol Deshpande, Fang Luo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031109.
Paper No: EP-20-1009
https://doi.org/10.1115/1.4046935
Published Online: May 4, 2020
View Article titled, Concurrent Thermal and Electrical Property Effects of Nano-Enhanced Phase Change Material for High-Voltage Electronics Applications
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Topics: Electrical properties, Electronics, Iron, Nanocomposites, Nanoparticles, Phase change materials, Temperature, Thermal conductivity, Thermal properties, Heat
Journal Articles

Advanced Characterization Techniques and Analysis of Thermal Properties of AlGaN/GaN Multifinger Power HEMTs on SiC Substrate Supported by Three-Dimensional Simulation

Aleš Chvála, Robert Szobolovszký, Jaroslav Kováč, Jr., Martin Florovič, Juraj Marek, Ľuboš Černaj, Daniel Donoval, Jaroslav Kováč, Christian Dua, Sylvain L. Delage, Jean-Claude Jacquet
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031007.
Paper No: EP-18-1093
https://doi.org/10.1115/1.4043477
Published Online: May 17, 2019
View Article titled, Advanced Characterization Techniques and Analysis of Thermal Properties of AlGaN/GaN Multifinger Power HEMTs on SiC Substrate Supported by Three-Dimensional Simulation
Open the PDF for Advanced Characterization Techniques and Analysis of Thermal Properties of AlGaN/GaN Multifinger Power HEMTs on SiC Substrate Supported by Three-Dimensional Simulation in another window
Topics: Gallium nitride, Heat, Simulation, Temperature, Transistors, Temperature distribution, Temperature measurement, Thermal properties, Gates (Closures), Thermal analysis
Journal Articles

Power and Thermal Constraints-Driven Modeling and Optimization for Through Silicon Via-Based Power Distribution Network

Weijun Zhu, Gang Dong, Yintang Yang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041002.
Paper No: EP-18-1007
https://doi.org/10.1115/1.4040670
Published Online: August 3, 2018
View Article titled, Power and Thermal Constraints-Driven Modeling and Optimization for Through Silicon Via-Based Power Distribution Network
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Topics: Density, Design, Heat, Modeling, Optimization, Silicon, Temperature, Simulation, Energy dissipation, Gates (Closures)
Journal Articles

Experimental Characterization of the Vertical and Lateral Heat Transfer in Three-Dimensional Stacked Die Packages

Herman Oprins, Vladimir Cherman, Geert Van der Plas, Joeri De Vos, Eric Beyne
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010902.
Paper No: EP-15-1090
https://doi.org/10.1115/1.4032346
Published Online: March 10, 2016
View Article titled, Experimental Characterization of the Vertical and Lateral Heat Transfer in Three-Dimensional Stacked Die Packages
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Topics: Energy dissipation, Experimental characterization, Heat transfer, Heating, Thermal conductivity, Thermal resistance, Thermal analysis, Cooling, Temperature, Temperature profiles
Journal Articles

Simultaneous Electrothermal Test Method for Pyroelectric Microsensors

Brian Smith, Cristina Amon
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 504–511.
https://doi.org/10.1115/1.2804101
Published Online: August 19, 2007
View Article titled, Simultaneous Electrothermal Test Method for Pyroelectric Microsensors
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Topics: Heat, Manufacturing, Sensors, Temperature, Thermal conductivity, Thermal diffusion, Thermal properties, Boundary-value problems, Microsensors, Strips
Journal Articles

A Hybrid Thermal Energy Storage Device, Part 1: Design Methodology

Ning Zheng, R. A. Wirtz
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 1–7.
https://doi.org/10.1115/1.1646419
Published Online: April 30, 2004
View Article titled, A Hybrid Thermal Energy Storage Device, Part 1: Design Methodology
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Topics: Design, Engineering prototypes, Heat, Heat sinks, Latent heat, Storage, Temperature, Thermal conductivity, Thermal energy storage, Interfacial thermal resistance
Journal Articles

Orientation Specific Thermal Properties of Polyimide Film

Robert J. Samuels, Nancy E. Mathis
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2001, 123(3): 273–277.
https://doi.org/10.1115/1.1347986
Published Online: March 10, 2000
View Article titled, Orientation Specific Thermal Properties of Polyimide Film
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Topics: Heat, Thermal conductivity, Wire, Polymers, Optical microscopy, Thermal properties
Journal Articles

Application of Stochastic Finite Element Method to Thermal Analysis for Computer Cooling

Shigekazu Kieda, Noriyuki Ashiwake, Takahiro Daikoku, Shizuo Zushi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1993, 115(3): 270–275.
https://doi.org/10.1115/1.2909328
Published Online: September 1, 1993
View Article titled, Application of Stochastic Finite Element Method to Thermal Analysis for Computer Cooling
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Topics: Computer cooling, Finite element methods, Thermal analysis, Computers, Cooling, Heat, Sensitivity analysis, Temperature, Temperature distribution, Thermal properties
Journal Articles

Theoretical and Experimental Investigation of Laser Drilling in a Partially Transparent Medium

T. Nowak, R. J. Pryputniewicz
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1992, 114(1): 71–80.
https://doi.org/10.1115/1.2905444
Published Online: March 1, 1992
View Article titled, Theoretical and Experimental Investigation of Laser Drilling in a Partially Transparent Medium
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Topics: Drilling, Lasers, Transparency, Laser beams, Shapes, Computer simulation, Errors, Experimental analysis, Geometry, Temperature
Journal Articles

Natural Convection From a Column of Flush Heat Sources in a Vertical Channel in Water

Y. Joshi, D. L. Knight
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1990, 112(4): 367–374.
https://doi.org/10.1115/1.2904391
Published Online: December 1, 1990
View Article titled, Natural Convection From a Column of Flush Heat Sources in a Vertical Channel in Water
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Topics: Heat, Natural convection, Water, Heat transfer, Temperature measurement, Accounting, Computation, Flow visualization, Heating, Temperature
Journal Articles

Thermomechanical Behavior of Multilayer Structures in Microelectronics

I. M. Daniel, T.-M. Wang, J. T. Gotro
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1990, 112(1): 11–15.
https://doi.org/10.1115/1.2904332
Published Online: March 1, 1990
View Article titled, Thermomechanical Behavior of Multilayer Structures in Microelectronics
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Topics: Deformation, Epoxy adhesives, Epoxy resins, Glass, Hardening (Curing), Laminates, Lamination, Microelectronic devices, Polymerization, Residual stresses
Journal Articles

Thermally Conductive Ceramics for Electronic Packaging

D. Suryanarayana
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1989, 111(3): 192–198.
https://doi.org/10.1115/1.3226533
Published Online: September 1, 1989
View Article titled, Thermally Conductive Ceramics for Electronic Packaging
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Topics: Ceramics, Electronic packaging, Aluminum, Reliability, Thermal properties