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Journal Articles

Study on the Microstructure Evolution and Mechanical Properties of Cu/Cu 41 Sn 11 /Cu Solder Joint During High-Temperature Aging

Gangli Yang, Xiaoyan Li, Xu Han, Hu Zhang, Linjie Wen, Shanshan Li

J. Electron. Packag. September 2023, 145(3): 031001.

Paper No: EP-22-1057

DOI: https://doi.org/10.1115/1.4056329

Published Online: December 9, 2022

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Topics: Mechanical properties, Solder joints, Tin, High temperature, Shear strength

Journal Articles

Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis

Xin Wei, Mohamed El Amine Belhadi, Sa'd Hamasha, Ali Alahmer, Rong Zhao, Bart Prorok, A. R. Nazmus Sakib

J. Electron. Packag. June 2023, 145(2): 021007.

Paper No: EP-22-1044

DOI: https://doi.org/10.1115/1.4055318

Published Online: September 28, 2022

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Topics: Alloys, Fatigue, Shear (Mechanics), Shear strength, Solders, Tin, Stress, Solder joints, Fatigue testing, Fatigue life

Journal Articles

Accelerated Solder Interconnect Testing Under Electromigratory and Mechanical Strain Conditions

Mahsa Montazeri, Whit M. Vinson, David R. Huitink

J. Electron. Packag. June 2023, 145(2): 021002.

Paper No: EP-22-1037

DOI: https://doi.org/10.1115/1.4055024

Published Online: August 8, 2022

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Topics: Electrodiffusion, Failure, Solder joints, Solders, Stress, Temperature, Tension, Testing, Current density, Tin

Journal Articles

Fracture Behavior and Reliability of Low-Silver Lead-Free Solder Joints

Ved Prakash Sharma, Naresh Varma Datla

J. Electron. Packag. December 2022, 144(4): 041016.

Paper No: EP-21-1159

DOI: https://doi.org/10.1115/1.4054096

Published Online: March 31, 2022

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Topics: Fracture (Materials), Fracture (Process), Intermetallic compounds, Solder joints, Solders, Tin, Reliability, Fractography, Lead-free solders, Failure

Journal Articles

Research on Reliability of Ni/Sn/Cu(Ni) Copper Pillar Bump Under Thermoelectric Loading

Junjie Dai, Yuexin Zhang, Zhankun Li, Mingming Chen, Yuhua Guo, Zhekun Fan, Junhui Li

J. Electron. Packag. September 2022, 144(3): 031014.

Paper No: EP-21-1121

DOI: https://doi.org/10.1115/1.4053889

Published Online: March 8, 2022

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Topics: Columns (Structural), Copper, Current density, Flip-chip devices, Solder joints, Solders, Temperature, Tin, Joules, Reliability

Journal Articles

Optimized Design of Various Ag Decorated Sn-xAg-Cu 0.7 Solder Bump on Cycling Fatigue Reliability for Wafer-Level Chip Scale Packaging

H. T. Lee, C. Y. Ho, C. C. Lee

J. Electron. Packag. December 2022, 144(4): 041001.

Paper No: EP-21-1043

DOI: https://doi.org/10.1115/1.4052075

Published Online: October 6, 2021

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Topics: Fatigue, Solders, Tin, Displacement, Fracture (Materials), Intermetallic compounds, Packaging, Reliability, Temperature

Journal Articles

Microstructure and Properties of Nb Nanoparticles Reinforced Sn–0.7Cu Solder Alloy

Zheng Liu, Li Yang, Yifeng Xiong, Huiming Gao

J. Electron. Packag. March 2022, 144(1): 011002.

Paper No: EP-20-1077

DOI: https://doi.org/10.1115/1.4051025

Published Online: August 6, 2021

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Topics: Alloys, Composite materials, Nanoparticles, Solders, Tin, Tensile strength

Journal Articles

Low-Temperature Bonding of Cu Through Self-Propagating Reaction Under Various Temperatures and Pressures

Wenbo Zhu, Xiaoting Wang, Mingyu Li

J. Electron. Packag. June 2020, 142(2): 021006.

Paper No: EP-19-1070

DOI: https://doi.org/10.1115/1.4046341

Published Online: March 9, 2020

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Topics: Bonding, Temperature, Temperature profiles, Tin, Solders, Low temperature, Pressure, Shear strength, Heat, Melting

Journal Articles

Investigation of Elevated Temperature Mechanical Properties of Intermetallic Compounds in the Cu–Sn System Using Nanoindentation

Zuozhu Yin, Fenglian Sun, Mengjiao Guo

J. Electron. Packag. June 2020, 142(2): 021004.

Paper No: EP-18-1042

DOI: https://doi.org/10.1115/1.4045980

Published Online: February 4, 2020

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Topics: Elastic moduli, Intermetallic compounds, Temperature, Tin, Nanoindentation

Journal Articles

Novel Transient Liquid Phase Bonding for High-Temperature Automotive Power Electronics Systems

Yanghe Liu, Shailesh N. Joshi, Ercan M. Dede

J. Electron. Packag. March 2020, 142(1): 011003.

Paper No: EP-19-1014

DOI: https://doi.org/10.1115/1.4044476

Published Online: September 19, 2019

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Topics: Bonding, Electronics, High temperature, Manufacturing, Stress, Tension-leg platforms, Thermal stresses, Tin, Transients (Dynamics), Temperature

Journal Articles

Reactive Joining of Thermally and Mechanically Sensitive Materials

Bastian Rheingans, Roman Furrer, Jürg Neuenschwander, Irina Spies, Axel Schumacher, Stephan Knappmann, Lars P. H. Jeurgens, Jolanta Janczak-Rusch

J. Electron. Packag. December 2018, 140(4): 041006.

Paper No: EP-18-1016

DOI: https://doi.org/10.1115/1.4040978

Published Online: September 10, 2018

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Topics: Borosilicate glasses, Joining, Solders, Soldering, Tin, Aluminum, Heat, Temperature, Glass, Thermal shock

Journal Articles

Interfacial Compounds Characteristic and Its Reliability Effects on SAC305 Microjoints in Flip Chip Assemblies

Ye Tian, Ning Ren, Xiaoxia Jian, Tie Geng, Yiping Wu

J. Electron. Packag. September 2018, 140(3): 031007.

Paper No: EP-18-1009

DOI: https://doi.org/10.1115/1.4040298

Published Online: June 11, 2018

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Topics: Flip-chip assemblies, Reliability, Soldering, Tin, Solders, Finite element analysis, Fracture (Materials), Intermetallic compounds

Journal Articles

Gold-Tin Solder Wetting Behavior for Package Lid Seals

Paul T. Vianco, Alice C. Kilgo, Bonnie M. McKenzie

J. Electron. Packag. June 2018, 140(2): 021003.

Paper No: EP-17-1115

DOI: https://doi.org/10.1115/1.4039749

Published Online: May 9, 2018

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Topics: Solders, Tin, Ceramics, Wetting, Contamination, Solder joints

Journal Articles

Ripening Growth Kinetics of Cu 6 Sn 5 Grains in Sn-3.0Ag-0.5Cu- x TiO 2 /Cu Solder Joints During the Reflow Process

Y. Tang, S. M. Luo, G. Y. Li, Z. Yang, C. J. Hou

J. Electron. Packag. March 2018, 140(1): 011003.

Paper No: EP-17-1089

DOI: https://doi.org/10.1115/1.4038861

Published Online: March 2, 2018

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Topics: Solder joints, Tin, Solders, Nanoparticles

Journal Articles

Modified Constitutive Creep Laws With Micromechanical Modeling of Pb-Free Solder Alloys

Joel Thambi, Andreas Schiessl, Manuela Waltz, Klaus-Dieter Lang, Ulrich Tetzlaff

J. Electron. Packag. September 2017, 139(3): 031002.

Paper No: EP-16-1064

DOI: https://doi.org/10.1115/1.4035850

Published Online: June 14, 2017

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Topics: Alloys, Creep, Stress, Temperature, Tin, Modeling

Journal Articles

Growth Kinetics of Intermetallic Compounds Between Sn and Fe Liquid–Solid Reaction Couples

Shou-Jen Hsu, Chin C. Lee

J. Electron. Packag. December 2016, 138(4): 041006.

Paper No: EP-16-1095

DOI: https://doi.org/10.1115/1.4034842

Published Online: October 10, 2016

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Topics: Annealing, Intermetallic compounds, Solders, Temperature, Tin, Diffusion (Physics), Carbon, Steel

Journal Articles

Effect of Solder Joint Thickness on Intermetallic Compound Growth Rate of Cu/Sn/Cu Solder Joints During Thermal Aging

Yan Zhu, Fenglian Sun

J. Electron. Packag. December 2016, 138(4): 041005.

Paper No: EP-16-1069

DOI: https://doi.org/10.1115/1.4034819

Published Online: October 10, 2016

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Topics: Solder joints, Solders, Tin, Diluents, Intermetallic compounds

Journal Articles

Creep Constitutive Models Suitable for Solder Alloys in Electronic Assemblies

Subhasis Mukherjee, Mohammed Nuhi, Abhijit Dasgupta, Mohammad Modarres

J. Electron. Packag. September 2016, 138(3): 030801.

Paper No: EP-15-1143

DOI: https://doi.org/10.1115/1.4033375

Published Online: June 8, 2016

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Topics: Creep, Solders, Tin, Constitutive equations

Journal Articles

Relationship Between the Intermetallic Compounds Growth and the Microcracking Behavior of Lead-Free Solder Joints

Tong An, Fei Qin

J. Electron. Packag. March 2016, 138(1): 011002.

Paper No: EP-15-1079

DOI: https://doi.org/10.1115/1.4032349

Published Online: March 10, 2016

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Topics: Failure mechanisms, Solder joints, Solders, Surface roughness, Lead-free solders, Intermetallic compounds, Tensile strength, Microcracks, Tin

Journal Articles

Influence of Glass Transition Temperature of Underfill on the Stress Behavior and Reliability of Microjoints Within a Chip Stacking Architecture

Jing-Yao Chang, Shin-Yi Huang, Chang-Chun Lee, Tung-Han Chuang, Tao-Chih Chang

J. Electron. Packag. September 2015, 137(3): 031007.

Paper No: EP-14-1083

DOI: https://doi.org/10.1115/1.4030392

Published Online: September 1, 2015

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Topics: Cycles, Glass transition, Reliability, Solders, Stress, Temperature, Numerical analysis, Failure, Tin, Failure mechanisms

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Journal citation

NARROW

Study on the Microstructure Evolution and Mechanical Properties of Cu/Cu 41 Sn 11 /Cu Solder Joint During High-Temperature Aging

Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis

Accelerated Solder Interconnect Testing Under Electromigratory and Mechanical Strain Conditions

Fracture Behavior and Reliability of Low-Silver Lead-Free Solder Joints

Research on Reliability of Ni/Sn/Cu(Ni) Copper Pillar Bump Under Thermoelectric Loading

Optimized Design of Various Ag Decorated Sn-xAg-Cu 0.7 Solder Bump on Cycling Fatigue Reliability for Wafer-Level Chip Scale Packaging

Microstructure and Properties of Nb Nanoparticles Reinforced Sn–0.7Cu Solder Alloy

Low-Temperature Bonding of Cu Through Self-Propagating Reaction Under Various Temperatures and Pressures

Investigation of Elevated Temperature Mechanical Properties of Intermetallic Compounds in the Cu–Sn System Using Nanoindentation

Novel Transient Liquid Phase Bonding for High-Temperature Automotive Power Electronics Systems

Reactive Joining of Thermally and Mechanically Sensitive Materials

Interfacial Compounds Characteristic and Its Reliability Effects on SAC305 Microjoints in Flip Chip Assemblies

Gold-Tin Solder Wetting Behavior for Package Lid Seals

Ripening Growth Kinetics of Cu 6 Sn 5 Grains in Sn-3.0Ag-0.5Cu- x TiO 2 /Cu Solder Joints During the Reflow Process

Modified Constitutive Creep Laws With Micromechanical Modeling of Pb-Free Solder Alloys

Growth Kinetics of Intermetallic Compounds Between Sn and Fe Liquid–Solid Reaction Couples

Effect of Solder Joint Thickness on Intermetallic Compound Growth Rate of Cu/Sn/Cu Solder Joints During Thermal Aging

Creep Constitutive Models Suitable for Solder Alloys in Electronic Assemblies

Relationship Between the Intermetallic Compounds Growth and the Microcracking Behavior of Lead-Free Solder Joints

Influence of Glass Transition Temperature of Underfill on the Stress Behavior and Reliability of Microjoints Within a Chip Stacking Architecture

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