1-5 of 5
Torsion
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Empirical High Cycle Fatigue Assessment Model of MEMS Devices

Chia-Cheng Chang, Kuo-Ning Chiang
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011005.
Paper No: EP-19-1027
DOI: https://doi.org/10.1115/1.4044278
Published Online: September 19, 2019
View Article titled, Empirical High Cycle Fatigue Assessment Model of MEMS Devices
Click here to open pdf in another window PDF for Empirical High Cycle Fatigue Assessment Model of MEMS Devices
Topics: Design, Fatigue life, High cycle fatigue, Microelectromechanical systems, Silicon-on-insulator, Simulation, Stress, Torsion, Cycles, Damage
Journal Articles

Debonding in Overmolded Integrated Circuit Packages

S. Hunt, L. A. Carlsson
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. September 1993, 115(3): 249–255.
DOI: https://doi.org/10.1115/1.2909325
Published Online: September 1, 1993
View Article titled, Debonding in Overmolded Integrated Circuit Packages
Click here to open pdf in another window PDF for Debonding in Overmolded Integrated Circuit Packages
Topics: Analytical methods, Bond strength, Electronic packages, Failure, Finite element analysis, Integrated circuits, Printed circuit boards, Shear (Mechanics), Stress, Stress analysis (Engineering)
Journal Articles

Torsion of Elastically Coupled Plates With Applications to Electronic Packaging

P. A. Engel, Yun Ling
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. March 1993, 115(1): 22–27.
DOI: https://doi.org/10.1115/1.2909297
Published Online: March 1, 1993
View Article titled, Torsion of Elastically Coupled Plates With Applications to Electronic Packaging
Click here to open pdf in another window PDF for Torsion of Elastically Coupled Plates With Applications to Electronic Packaging
Topics: Electronic packaging, Plates (structures), Torsion, Circuits, Electronics, Plate theory, Stiffness, Stress
Journal Articles

Approximate Structural Analysis of Circuit Card Systems Subjected to Torsion

P. A. Engel, J. T. Vogelmann
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. June 1992, 114(2): 203–210.
DOI: https://doi.org/10.1115/1.2906419
Published Online: June 1, 1992
View Article titled, Approximate Structural Analysis of Circuit Card Systems Subjected to Torsion
Click here to open pdf in another window PDF for Approximate Structural Analysis of Circuit Card Systems Subjected to Torsion
Topics: Circuits, Structural analysis, Torsion, Corners (Structural elements), Deflection, Finite element analysis, Finite element methods, Stiffness
Journal Articles

An Improved Procedure for the Determination of the Elastic Constants of Component-Lead-Board Assemblies

T. S. Chang, Edward B. Magrab
Journal: Journal of Electronic Packaging
Article Type: Technical Briefs
J. Electron. Packag. December 1991, 113(4): 427–430.
DOI: https://doi.org/10.1115/1.2905432
Published Online: December 1, 1991
View Article titled, An Improved Procedure for the Determination of the Elastic Constants of Component-Lead-Board Assemblies
Click here to open pdf in another window PDF for An Improved Procedure for the Determination of the Elastic Constants of Component-Lead-Board Assemblies
Topics: Elastic constants, Torsion, Computer simulation