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J. Electron. Packag.
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    Triply periodic minimal surfaces
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    Journal Articles

    Electrochemical Additive Manufacturing-Based Design of a Heat Sink for Single-Phase Natural Convection Immersion Cooling Application

    Jacob Lamotte-Dawaghreh, Joseph Herring, Sai Abhideep Pundla, Rohit Suthar, Vivek Nair, Pratik Bansode, Gautam Gupta, Dereje Agonafer, Joseph Madril, Tim Ouradnik, Michael Matthews, Ian Winfield
    Journal: Journal of Electronic Packaging
    Publisher: ASME
    Article Type: Research-Article
    J. Electron. Packag. December 2024, 146(4): 041113.
    Paper No: EP-24-1048
    https://doi.org/10.1115/1.4065987
    Published Online: August 9, 2024
    Abstract
    View Article titled, Electrochemical Additive Manufacturing-Based Design of a Heat Sink for Single-Phase Natural Convection Immersion Cooling Application
    Open the PDF for Electrochemical Additive Manufacturing-Based Design of a Heat Sink for Single-Phase Natural Convection Immersion Cooling Application in another window
    Topics: Computational fluid dynamics, Cooling, Design, Heat sinks, Natural convection, Temperature, Triply periodic minimal surfaces, Manufacturing, Porosity
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