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Journal Articles

Mixed Convection of Impinging Air Cooling Over Heat Sink in Telecom System Application

Siddharth Bhopte, Musa S. Alshuqairi, Dereje Agonafer, Fellow ASME, Gamal Refai-Ahmed, Fellow ASME

J. Electron. Packag. December 2004, 126(4): 519–523.

DOI: https://doi.org/10.1115/1.1827267

Published Online: January 24, 2005

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Topics: Heat sinks, Mixed convection, Reynolds number, Nozzles, Cooling, Computer simulation, Heat, Flow (Dynamics), Rayleigh number

Journal Articles

Effect of Underfill Entrapment on the Reliability of Flip-Chip Solder Joint

Y. C. Chan, M. O. Alam, K. C. Hung, H. Lu, C. Bailey

J. Electron. Packag. December 2004, 126(4): 541–545.

DOI: https://doi.org/10.1115/1.1756590

Published Online: January 24, 2005

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Topics: Bonding, Flip-chip, Flip-chip devices, Flow (Dynamics), Reliability, Solder joints, Solders, Modeling

Journal Articles

An Analytical Study of the Optimized Performance of an Impingement Heat Sink

S. B. Sathe, B. G. Sammakia

J. Electron. Packag. December 2004, 126(4): 528–534.

DOI: https://doi.org/10.1115/1.1827269

Published Online: January 24, 2005

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Topics: Design, Flow (Dynamics), Heat sinks, Pressure drop, Computation, Heat transfer, Fins

Journal Articles

Chimney Effect on Natural Air Cooling of Electronic Equipment Under Inclination

Yoji Kitamura, Masaru Ishizuka

J. Electron. Packag. December 2004, 126(4): 423–428.

DOI: https://doi.org/10.1115/1.1827256

Published Online: January 24, 2005

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Topics: Cooling, Electronic equipment, Temperature, Natural convection, Flow (Dynamics), Computer simulation

Journal Articles

Evaluation of Thermal Enhancements to Flip-Chip-Plastic Ball Grid Array Packages

K. Ramakrishna, Fellow ASME,, T.-Y. Tom Lee, Mem. ASME,

J. Electron. Packag. December 2004, 126(4): 449–456.

DOI: https://doi.org/10.1115/1.1827260

Published Online: January 24, 2005

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Topics: Flat heat pipes, Forced convection, Mixed convection, Natural convection, Printed circuit boards, Thermal conductivity, Thermal resistance, Heat transfer, Copper, Junctions

Journal Articles

Thermal Model of a Thinned-Die Cooling System

N. Boiadjieva, P. Koev

J. Electron. Packag. December 2004, 126(4): 435–439.

DOI: https://doi.org/10.1115/1.1826079

Published Online: January 24, 2005

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Topics: Air flow, Cooling systems, Flat heat pipes, Flow (Dynamics), Heat exchangers, Temperature, Cooling, Heat, Silicon

Journal Articles

Design of Cooling Systems for Electronic Equipment Using Both Experimental and Numerical Inputs

Tunc Icoz, Yogesh Jaluria

J. Electron. Packag. December 2004, 126(4): 465–471.

DOI: https://doi.org/10.1115/1.1827262

Published Online: January 24, 2005

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Topics: Computer simulation, Cooling systems, Design, Electronic equipment, Flow (Dynamics), Heat, Temperature, Turbulence, Cooling, Heat transfer

Journal Articles

h adiabatic and u max ′

Robert J. Moffat

J. Electron. Packag. December 2004, 126(4): 501–509.

DOI: https://doi.org/10.1115/1.1827265

Published Online: January 24, 2005

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Topics: Computational fluid dynamics, Flow (Dynamics), Heat transfer, Temperature, Turbulence, Heat transfer coefficients, Heat conduction, Heating, Coolants, Computer cooling

Journal Articles

Optimal Design for PPF Heat Sinks in Electronics Cooling Applications

Han-Ting Chen, Jenn-Tsong Horng, Po-Li Chen, Ying-Huei Hung

J. Electron. Packag. December 2004, 126(4): 410–422.

DOI: https://doi.org/10.1115/1.1826078

Published Online: January 24, 2005

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Topics: Design, Heat sinks, Optimization

Journal Articles

Methodology for an Integrated (Electrical/Mechanical) Design of PWBA

Wonkee Ahn, Dereje Agonafer, Fellow ASME, Shlomo Novotny, Fellow ASME

J. Electron. Packag. December 2004, 126(4): 524–527.

DOI: https://doi.org/10.1115/1.1827268

Published Online: January 24, 2005

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Topics: Design, Mechanical computer-aided design, Printed circuit boards, Manufacturing

Journal Articles

Dynamic Reduced Electrothermal Model for Integrated Power Electronics Modules (IPEM)

M. Herna´ndez-Mora, J. E. Gonza´lez, M. Ve´lez-Reyes, J. M. Ortiz-Rodrı´guez, Y. Pang, E. Scott

J. Electron. Packag. December 2004, 126(4): 477–490.

DOI: https://doi.org/10.1115/1.1827264

Published Online: January 24, 2005

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Topics: Capacitance, Electronics, Heat transfer, Simulation, Temperature, Thermal analysis, Transients (Dynamics), Computer software, Heat, Design

Journal Articles

Experimental and Numerical Thermal Transient Behavior of Chips in a Liquid Channel During Loss of Pumping Power

C. P. Tso, K. W. Tou, H. Bhowmik

J. Electron. Packag. December 2004, 126(4): 546–553.

DOI: https://doi.org/10.1115/1.1827270

Published Online: January 24, 2005

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Topics: Natural convection, Steady state, Transients (Dynamics), Heat, Temperature, Flow (Dynamics), Coolants, Water, Heat transfer, Pumps

Journal Articles

Thermal Performance of Next Generation of Modulated Pump Lasers in Telco Equipment

Gamal Refai-Ahmed, Fellow ASME, Stephanie Trottier

J. Electron. Packag. December 2004, 126(4): 535–540.

DOI: https://doi.org/10.1115/1.1773199

Published Online: January 24, 2005

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Topics: Cycles, Lasers, Pumps, Temperature, Thermal resistance

Journal Articles

Thermal Performance Optimization of Radio Frequency Packages for Wireless Communication

Victor Adrian Chiriac, Tien-Yu Tom Lee, Vern Hause

J. Electron. Packag. December 2004, 126(4): 429–434.

DOI: https://doi.org/10.1115/1.1827257

Published Online: January 24, 2005

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Topics: Heat, Junctions, Optimization, Solders, Temperature, Thermal conductivity, Thermal resistance, Epoxy adhesives, Epoxy resins, Numerical analysis

Journal Articles

Determination of Temperatures and Heat Fluxes on Surfaces and Interfaces of Multidomain Three-Dimensional Electronic Components

Brian H. Dennis, Zhen-xue Han, George S. Dulikravich

J. Electron. Packag. December 2004, 126(4): 457–464.

DOI: https://doi.org/10.1115/1.1827261

Published Online: January 24, 2005

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Topics: Ball-Grid-Array packaging, Boundary-value problems, Errors, Flux (Metallurgy), Heat, Heat conduction, Temperature, Temperature distribution, Finite element analysis, Finite element methods

Journal Articles

A New Role of CFD Simulation in Thermal Design of Compact Electronic Equipment: Application of the Build-up Approach to Thermal Analysis of a Benchmark Model

Wataru Nakayama, Ryuichi Matsuki, Yukari Hacho, Kiyoko Yajima

J. Electron. Packag. December 2004, 126(4): 440–448.

DOI: https://doi.org/10.1115/1.1827259

Published Online: January 24, 2005

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Topics: Computational fluid dynamics, Design, Electronic equipment, Simulation, Thermal analysis, Taguchi methods, Temperature, Thermal resistance

Journal Articles

Cluster of High-Powered Racks Within a Raised-Floor Computer Data Center: Effect of Perforated Tile Flow Distribution on Rack Inlet Air Temperatures

Roger Schmidt, Ethan Cruz

J. Electron. Packag. December 2004, 126(4): 510–518.

DOI: https://doi.org/10.1115/1.1827266

Published Online: January 24, 2005

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Topics: Data centers, Flow (Dynamics), Temperature, Tiles, Computers

Journal Articles

Development of Compact Models for Electronics Cooling: Using the Multigrid Operator to Generate Reduced-Order Description of Devices

Prabhu Sathyamurthy, Manoj Nagulapally, Rajesh Nair

J. Electron. Packag. December 2004, 126(4): 472–476.

DOI: https://doi.org/10.1115/1.1827263

Published Online: January 24, 2005

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Topics: Capacitance, Computer cooling, Heat, Junctions, Linear systems, Simulation, Steady state, Temperature, Topology, Transients (Dynamics)

Journal Articles

Impact of TXV and Compressor in the Stability of a High-End Computer Refrigeration System

Yasin Makwana, Dereje Agonafer, Fellow ASME, Dan Manole

J. Electron. Packag. December 2004, 126(4): 554–559.

DOI: https://doi.org/10.1115/1.1827272

Published Online: January 24, 2005

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Topics: Compressors, Refrigeration, Temperature, Stress, Computers, Stability, Vapors, Valves

Journal Articles

The Challenges of Electronic Cooling: Past, Current and Future

Richard C. Chu

J. Electron. Packag. December 2004, 126(4): 491–500.

DOI: https://doi.org/10.1115/1.1839594

Published Online: January 24, 2005

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Topics: Cooling

Journal citation

NARROW

Mixed Convection of Impinging Air Cooling Over Heat Sink in Telecom System Application

Effect of Underfill Entrapment on the Reliability of Flip-Chip Solder Joint

An Analytical Study of the Optimized Performance of an Impingement Heat Sink

Chimney Effect on Natural Air Cooling of Electronic Equipment Under Inclination

Evaluation of Thermal Enhancements to Flip-Chip-Plastic Ball Grid Array Packages

Thermal Model of a Thinned-Die Cooling System

Design of Cooling Systems for Electronic Equipment Using Both Experimental and Numerical Inputs

h adiabatic and u max ′

Optimal Design for PPF Heat Sinks in Electronics Cooling Applications

Methodology for an Integrated (Electrical/Mechanical) Design of PWBA

Dynamic Reduced Electrothermal Model for Integrated Power Electronics Modules (IPEM)

Experimental and Numerical Thermal Transient Behavior of Chips in a Liquid Channel During Loss of Pumping Power

Thermal Performance of Next Generation of Modulated Pump Lasers in Telco Equipment

Thermal Performance Optimization of Radio Frequency Packages for Wireless Communication

Determination of Temperatures and Heat Fluxes on Surfaces and Interfaces of Multidomain Three-Dimensional Electronic Components

A New Role of CFD Simulation in Thermal Design of Compact Electronic Equipment: Application of the Build-up Approach to Thermal Analysis of a Benchmark Model

Cluster of High-Powered Racks Within a Raised-Floor Computer Data Center: Effect of Perforated Tile Flow Distribution on Rack Inlet Air Temperatures

Development of Compact Models for Electronics Cooling: Using the Multigrid Operator to Generate Reduced-Order Description of Devices

Impact of TXV and Compressor in the Stability of a High-End Computer Refrigeration System

The Challenges of Electronic Cooling: Past, Current and Future

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