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Journal Articles

Peel-and-Stick Sensors Powered by Directed Radio-Frequency Energy

David Eric Schwartz, Clinton J. Smith, Joseph Lee, Shakthi Priya Gowri, George Daniel, Christopher Lalau-Keraly, Quentin Baudenon, J. R. M. Saavedra

J. Electron. Packag. June 2018, 140(2): 020904.

Paper No: EP-17-1108

DOI: https://doi.org/10.1115/1.4039138

Published Online: May 9, 2018

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Topics: Sensors

Journal Articles

Enhanced Heat Transfer Using Microporous Copper Inverse Opals

Hyoungsoon Lee, Tanmoy Maitra, James Palko, Daeyoung Kong, Chi Zhang, Michael T. Barako, Yoonjin Won, Mehdi Asheghi, Kenneth E. Goodson

J. Electron. Packag. June 2018, 140(2): 020906.

Paper No: EP-18-1003

DOI: https://doi.org/10.1115/1.4040088

Published Online: May 9, 2018

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Topics: Copper, Critical heat flux, Heat transfer, Pool boiling, Boiling, Heat transfer coefficients, Bubbles

Journal Articles

Estimation of Effective Thermal and Mechanical Properties of Particulate Thermal Interface Materials by a Random Network Model

Pavan Kumar Vaitheeswaran, Ganesh Subbarayan

J. Electron. Packag. June 2018, 140(2): 020901.

Paper No: EP-17-1092

DOI: https://doi.org/10.1115/1.4039136

Published Online: May 9, 2018

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Topics: Elastic moduli, Network models, Particulate matter, Stiffness, Fillers (Materials), Particle size, Mechanical properties

Journal Articles

Failure Analysis of Direct Liquid Cooling System in Data Centers

Sami Alkharabsheh, Udaya L. N. Puvvadi, Bharath Ramakrishnan, Kanad Ghose, Bahgat Sammakia

J. Electron. Packag. June 2018, 140(2): 020902.

Paper No: EP-17-1094

DOI: https://doi.org/10.1115/1.4039137

Published Online: May 9, 2018

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Topics: Cooling systems, Data centers, Failure, Temperature, Cooling, Flow (Dynamics), Coolants

Journal Articles

Prediction and Mitigation of Vertical Cracking in High-Temperature Transient Liquid Phase Sintered Joints by Thermomechanical Simulation

Hannes Greve, S. Ali Moeini, Patrick McCluskey, Shailesh Joshi

J. Electron. Packag. June 2018, 140(2): 020903.

Paper No: EP-17-1100

DOI: https://doi.org/10.1115/1.4039265

Published Online: May 9, 2018

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Journal Articles

Vibration-Induced Failures in Automotive Electronics: Knowledge-Based Qualification Perspective

Karumbu Meyyappan, Milena Vujosevic, Qifeng Wu, Pramod Malatkar, Charles Hill, Ryan Parrott

J. Electron. Packag. June 2018, 140(2): 020905.

Paper No: EP-17-1083

DOI: https://doi.org/10.1115/1.4039301

Published Online: May 9, 2018

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Topics: Damage, Electronics, Engineering standards, Failure, Failure mechanisms, Reliability, Solder joints, Vibration, Transportation systems, Fatigue

Journal Articles

Challenges in Three-Dimensional Printing of High-Conductivity Copper

Tahany I. El-Wardany, Ying She, Vijay N. Jagdale, Jacquelynn K. Garofano, Joe J. Liou, Wayde R. Schmidt

J. Electron. Packag. June 2018, 140(2): 020907.

Paper No: EP-17-1104

DOI: https://doi.org/10.1115/1.4039974

Published Online: May 9, 2018

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Topics: Copper, Copper powders, Lasers, Porosity, Electrical conductivity, Additive manufacturing, Density, Modeling, Thermal conductivity

Journal Articles

Inverse Conduction Heat Transfer and Kriging Interpolation Applied to Temperature Sensor Location in Microchips

David Gonzalez Cuadrado, Amy Marconnet, Guillermo Paniagua

J. Electron. Packag. March 2018, 140(1): 010905.

Paper No: EP-17-1099

DOI: https://doi.org/10.1115/1.4039026

Published Online: March 2, 2018

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Topics: Heat conduction, Heat flux, Heat transfer, Integrated circuits, Interpolation, Optimization, Sensors, Temperature, Temperature sensors, Genetic algorithms

Journal Articles

Lead-Free Alternatives for Interconnects in High-Temperature Electronics

Sandeep Mallampati, Liang Yin, David Shaddock, Harry Schoeller, Junghyun Cho

J. Electron. Packag. March 2018, 140(1): 010906.

Paper No: EP-17-1101

DOI: https://doi.org/10.1115/1.4039027

Published Online: March 2, 2018

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Topics: Alloys, Electronics, High temperature, Solders, Temperature, Testing, Thermal conductivity, Failure, Melting, Tensile testing

Journal Articles

Role of a Liquid Accumulator in a Passive Two-Phase Liquid Cooling System for Electronics: Experimental Analysis

Nicolas Lamaison, Raffaele L. Amalfi, Todd Salamon, Jackson B. Marcinichen, John R. Thome

J. Electron. Packag. March 2018, 140(1): 010901.

Paper No: EP-17-1085

DOI: https://doi.org/10.1115/1.4039091

Published Online: March 2, 2018

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Topics: Condensers (steam plant), Flow (Dynamics), Heat, Secondary cells, Stress, Temperature, Subcooling, Cooling systems, Refrigerants, Electronics

Journal Articles

Thermal Metamaterials for Heat Flow Control in Electronics

Ercan M. Dede, Feng Zhou, Paul Schmalenberg, Tsuyoshi Nomura

J. Electron. Packag. March 2018, 140(1): 010904.

Paper No: EP-17-1093

DOI: https://doi.org/10.1115/1.4039020

Published Online: March 2, 2018

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Topics: Composite materials, Design, Electronics, Flow control, Heat, Heat flux, Metamaterials, Printed circuit boards, Temperature, Anisotropy

Journal Articles

Impact of Tile Design on the Thermal Performance of Open and Enclosed Aisles

Sadegh Khalili, Mohammad I. Tradat, Kourosh Nemati, Mark Seymour, Bahgat Sammakia

J. Electron. Packag. March 2018, 140(1): 010907.

Paper No: EP-17-1109

DOI: https://doi.org/10.1115/1.4039028

Published Online: March 2, 2018

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Topics: Air flow, Design, Leakage, Tiles, Temperature, Computational fluid dynamics, Simulation, Flow (Dynamics), Pressure

Journal Articles

Application-Driven Reliability Research of Next Generation for Automotive Electronics: Challenges and Approaches

Sven Rzepka, Alexander Otto, Dietmar Vogel, Rainer Dudek

J. Electron. Packag. March 2018, 140(1): 010903.

Paper No: EP-17-1090

DOI: https://doi.org/10.1115/1.4039333

Published Online: March 2, 2018

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Topics: Electronics, Failure, Reliability, Stress, Temperature, Failure mechanisms, Cycles, Safety, Failure analysis, Simulation

Journal Articles

Experimentally Validated Computational Fluid Dynamics Model for Data Center With Active Tiles

Jayati Athavale, Yogendra Joshi, Minami Yoda

J. Electron. Packag. March 2018, 140(1): 010902.

Paper No: EP-17-1087

DOI: https://doi.org/10.1115/1.4039025

Published Online: March 2, 2018

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Topics: Tiles, Data centers, Flow (Dynamics), Temperature

Journal Articles

Experimental and Numerical Investigation of Interdie Thermal Resistance in Three-Dimensional Integrated Circuits

Leila Choobineh, Jared Jones, Ankur Jain

J. Electron. Packag. June 2017, 139(2): 020908.

Paper No: EP-16-1140

DOI: https://doi.org/10.1115/1.4036404

Published Online: June 12, 2017

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Topics: Integrated circuits, Sensors, Temperature, Thermal resistance, Thermal analysis

Journal Articles

Three-Dimensional Printed Dielectric Substrates for Radio Frequency Applications

Vana Snigdha Tummala, Ahsan Mian, Nowrin H. Chamok, Dhruva Poduval, Mohammod Ali, Jallisa Clifford, Prasun Majumdar

J. Electron. Packag. June 2017, 139(2): 020904.

Paper No: EP-16-1137

DOI: https://doi.org/10.1115/1.4036384

Published Online: June 12, 2017

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Topics: Additive manufacturing, Density, Dimensions, X-rays, Resonance, Microscopy, Manufacturing, Porosity, Design

Journal Articles

Heat Transfer in Liquid–Liquid Taylor Flow in Miniscale Curved Tubing for Constant Wall Temperature

Wesam Adrugi, Yuri Muzychka, Kevin Pope

J. Electron. Packag. June 2017, 139(2): 020909.

Paper No: EP-16-1141

DOI: https://doi.org/10.1115/1.4036405

Published Online: June 12, 2017

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Topics: Flow (Dynamics), Heat transfer, Tubing, Water, Wall temperature

Journal Articles

Carrier Mobility Shift in Advanced Silicon Nodes Due to Chip-Package Interaction

Valeriy Sukharev, Jun-Ho Choy, Armen Kteyan, Henrik Hovsepyan, Mark Nakamoto, Wei Zhao, Riko Radojcic, Uwe Muehle, Ehrenfried Zschech

J. Electron. Packag. June 2017, 139(2): 020906.

Paper No: EP-16-1138

DOI: https://doi.org/10.1115/1.4036402

Published Online: June 12, 2017

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Topics: Simulation, Stress, Transistors, Flow (Dynamics), Design, Silicon

Journal Articles

Thermal Performance of a Light Emitting Diode Light Engine for a Multipurpose Automotive Exterior Lighting System With Competing Board Technologies

Umut Zeynep Uras, Mehmet Arık, Enes Tamdoğan

J. Electron. Packag. June 2017, 139(2): 020907.

Paper No: EP-16-1139

DOI: https://doi.org/10.1115/1.4036403

Published Online: June 12, 2017

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Topics: Engines, Light-emitting diodes, Temperature, Lumber, Flat heat pipes, Electronics, Thermal conductivity, Temperature distribution, Vapors

Journal Articles

Effect of the Crystallinity on the Electromigration Resistance of Electroplated Copper Thin-Film Interconnections

Takeru Kato, Ken Suzuki, Hideo Miura

J. Electron. Packag. June 2017, 139(2): 020911.

Paper No: EP-16-1144

DOI: https://doi.org/10.1115/1.4036442

Published Online: June 12, 2017

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Topics: Atoms, Copper, Current density, Diffusion (Physics), Electrodiffusion, Grain boundaries, Reliability, Temperature, Thin films, Heating

Journal citation

NARROW

Peel-and-Stick Sensors Powered by Directed Radio-Frequency Energy

Enhanced Heat Transfer Using Microporous Copper Inverse Opals

Estimation of Effective Thermal and Mechanical Properties of Particulate Thermal Interface Materials by a Random Network Model

Failure Analysis of Direct Liquid Cooling System in Data Centers

Prediction and Mitigation of Vertical Cracking in High-Temperature Transient Liquid Phase Sintered Joints by Thermomechanical Simulation

Vibration-Induced Failures in Automotive Electronics: Knowledge-Based Qualification Perspective

Challenges in Three-Dimensional Printing of High-Conductivity Copper

Inverse Conduction Heat Transfer and Kriging Interpolation Applied to Temperature Sensor Location in Microchips

Lead-Free Alternatives for Interconnects in High-Temperature Electronics

Role of a Liquid Accumulator in a Passive Two-Phase Liquid Cooling System for Electronics: Experimental Analysis

Thermal Metamaterials for Heat Flow Control in Electronics

Impact of Tile Design on the Thermal Performance of Open and Enclosed Aisles

Application-Driven Reliability Research of Next Generation for Automotive Electronics: Challenges and Approaches

Experimentally Validated Computational Fluid Dynamics Model for Data Center With Active Tiles

Experimental and Numerical Investigation of Interdie Thermal Resistance in Three-Dimensional Integrated Circuits

Three-Dimensional Printed Dielectric Substrates for Radio Frequency Applications

Heat Transfer in Liquid–Liquid Taylor Flow in Miniscale Curved Tubing for Constant Wall Temperature

Carrier Mobility Shift in Advanced Silicon Nodes Due to Chip-Package Interaction

Thermal Performance of a Light Emitting Diode Light Engine for a Multipurpose Automotive Exterior Lighting System With Competing Board Technologies

Effect of the Crystallinity on the Electromigration Resistance of Electroplated Copper Thin-Film Interconnections

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