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Keywords: Ag content
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041016.
Paper No: EP-21-1159
Published Online: March 31, 2022
..., significantly larger plastic zone size and thinner intermetallic compound layer resulted in significantly higher G ci for Sn-0.7Cu solder joint. 1 Corresponding author. e-mail: datla@mech.iitd.ac.in 11 11 2021 10 03 2022 31 03 2022 Ag content critical energy release rate ( G c...
