... received March 23, 2017; final manuscript received October 6, 2017; published online March 2, 2018. Assoc. Editor: Kaushik Mysore. 23 03 2017 06 10 2017 CSP Reliability Solder Wafer-level chip scale packaging (WLCSP) is one of the fast-growing segments in back-end...

... ACKAGING . Manuscript received March 9, 2017; final manuscript received September 21, 2017; published online October 25, 2017. Assoc. Editor: Kaushik Mysore. 09 03 2017 21 09 2017 3D packaging CSP Flip chip High density interconnects Power packaging Wirebond In general...

... OF E LECTRONIC P ACKAGING . Manuscript received December 25, 2016; final manuscript received February 28, 2017; published online June 14, 2017. Assoc. Editor: Satish Chaparala. 25 12 2016 28 02 2017 3D packaging CSP Electronic Flexible circuits MEMS Micro vias PWB...

...Sharan Kallolimath; Jiang Jenny Zhou Board-level physical test performance of CSP/BGA packages need in depth characterization of loading parameters and material behavioral properties. In recent years, many calibration methods were adopted by the researchers and industries to improvise solder joint...

... 21 05 2016 22 05 2016 3D packaging CSP Failure analysis High density interconnects SMT List of JEP Reviewers Alekhya Addagatla David Hutt Kaustubh Nagarkar Dereje Agonafer Toru Ikeda Luu T. Nguyen S. Ravi Annapragada Toshitaka Ishizaki Mark...

... of chips with hotspot heat flux of 1000 W cm −2 and background heat flux of 43 W cm −2 . Redmond and Kumar [ 10 ] optimized the thermoelectric material thickness for the hot spot and background heat fluxes of 1000 W cm −2 and 14.5 W cm −2 , respectively. 3D packaging CSP Thermal analysis...