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Keywords: Chip stacking
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Journal Articles
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. June 2022, 144(2): 020801.
Paper No: EP-21-1008
Published Online: September 24, 2021
... a business platform to propel continuous innovation and performance improvement extending to surveillance, medical, and automotive industries. This overview briefs the general camera module and the crucial technology elements of chip stacking architectures and advanced interconnect technologies. This study...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041002.
Paper No: EP-18-1007
Published Online: August 3, 2018
... is scalable and has the same guiding value for multichip stacks with different functions and constraints. A setup of four-chip stack is used to demonstrate the feasibility of this optimization and a large TSV area saving is achieved by this method. References [1] Shen , W. , Lin , Y. , Chen...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010905.
Paper No: EP-17-1099
Published Online: March 2, 2018
.... 27 09 2017 28 12 2017 3D packaging Chip stacking Harsh environment Thermal analysis The adequate selection of the temperature sensor locations within a microchip or a rack of microprocessors may allow a reduction in the number of sensors needed to characterize the thermal...
Journal Articles
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. March 2018, 140(1): 010801.
Paper No: EP-17-1076
Published Online: March 2, 2018
... October 28, 2017; published online March 2, 2018. Assoc. Editor: Yi-Shao Lai. 31 08 2017 28 10 2017 3D packaging Bumping Chip stacking The concealed force behind the successful journey from information technology toward internet of things is the rapid progress...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041004.
Paper No: EP-17-1044
Published Online: September 5, 2017
... ACKAGING . Manuscript received April 25, 2017; final manuscript received July 26, 2017; published online September 5, 2017. Assoc. Editor: Yi-Shao Lai. 25 04 2017 26 07 2017 Chip stacking Flip chip Solder-capped Cu pillar bumps are widely used in three-dimensional (3D) chip...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031004.
Paper No: EP-16-1110
Published Online: June 14, 2017
... of ASME for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received October 2, 2016; final manuscript received March 28, 2017; published online June 14, 2017. Assoc. Editor: Kaushik Mysore. 02 10 2016 28 03 2017 3D packaging Area array Chip stacking Failure...
Journal Articles
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. June 2017, 139(2): 020301.
Paper No: EP-17-1032
Published Online: June 12, 2017
...Justin A. Weibel; S. Ravi Annapragada 22 03 2017 31 03 2017 3D packaging Backplanes Chip stacking Failure analysis Flexible circuits Nanotechnolgy Reliability Solder Thermal analysis Underfill Wafer level packaging ASME's International Mechanical Engineering...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2017, 139(2): 020908.
Paper No: EP-16-1140
Published Online: June 12, 2017
... Division of ASME for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received December 16, 2016; final manuscript received March 27, 2017; published online June 12, 2017. Assoc. Editor: Justin A. Weibel. 16 12 2016 27 03 2017 3D packaging Chip stacking Thermal...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2017, 139(1): 011001.
Paper No: EP-16-1073
Published Online: November 10, 2016
... and silicon CMOS, so as to benefit from the afore described advantages offered by such an arrangement. Chip stacking Failure analysis Harsh environment Micro vias SOC Thermal analysis 14 06 2016 25 10 2016 Contributed by the Electronic and Photonic Packaging Division of ASME...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2016, 138(3): 031006.
Paper No: EP-15-1054
Published Online: June 28, 2016
... Chip stacking Failure analysis The three-dimensional integrated circuit (3D IC) is an emerging technology that integrates multiple circuits vertically into a single chip [ 1 , 2 ]. The benefits of a 3D IC based on TSVs include improved packing density, reduced power consumption, wider...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010909.
Paper No: EP-15-1097
Published Online: March 11, 2016
...Michael Fish; Patrick McCluskey; Avram Bar-Cohen As thermal management techniques for three-dimensional (3D) chip stacks and other high-power density electronic packages continue to evolve, interest in the thermal pathways across substrates containing a multitude of conductive vias has increased...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2015, 137(4): 044501.
Paper No: EP-15-1062
Published Online: October 20, 2015
... manuscript received September 30, 2015; published online October 20, 2015. Assoc. Editor: Yi-Shao Lai. 30 06 2015 30 09 2015 3D packaging Chip stacking Microsystems Silicon is the fundamental material in semiconductor industry [ 1 – 4 ]. Mass production of microelectronics...
Journal Articles
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. December 2015, 137(4): 040802.
Paper No: EP-15-1068
Published Online: September 25, 2015
... ACKAGING . Manuscript received July 22, 2015; final manuscript received August 30, 2015; published online September 25, 2015. Assoc. Editor: Mehdi Asheghi. 22 07 2015 30 08 2015 3D packaging Chip stacking Failure analysis Physics of failure Thermal analysis Three...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2009, 131(4): 041007.
Published Online: October 29, 2009
... bumping chip stacking chip on board manufacturing technology finite elements stress analysis micromechanics elastic moduli finite element analysis gold integrated circuit bonding integrated circuit interconnections stress effects ultrasonic bonding 12 07 2008 16 09 2009...