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Keywords: DCA
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Journal Articles
David Eric Schwartz, Clinton J. Smith, Joseph Lee, Shakthi Priya Gowri, George Daniel, Christopher Lalau-Keraly, Quentin Baudenon, J. R. M. Saavedra
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 020904.
Paper No: EP-17-1108
Published Online: May 9, 2018
... control system. DCA Electrical design Flexible circuits Roll to Roll Manufacturing Sensors 12 10 2017 22 12 2017 Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received October...
Topics:
Sensors
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010906.
Paper No: EP-17-1101
Published Online: March 2, 2018
... to Bi to address some of these shortcomings. Cu is expected to enhance thermal properties of the resultant alloy and Sb is expected to increase the reaction with Cu and Ni metallization. Composite materials DCA Electronic Failure analysis Harsh environment Physics of failure Power...
