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Keywords: ECAM
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Journal Articles
Jacob Lamotte-Dawaghreh, Joseph Herring, Sai Abhideep Pundla, Rohit Suthar, Vivek Nair, Pratik Bansode, Gautam Gupta, Dereje Agonafer, Joseph Madril, Tim Ouradnik, Michael Matthews, Ian Winfield
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041113.
Paper No: EP-24-1048
Published Online: August 9, 2024
... and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems Doubletree by Hilton San Diego Mission. InterPACK2023. 07 03 2024 05 06 2024 09 08 2024 single-phase immersion cooling TPMS heat sink ECAM Data centers are facilities...