...Richard C. Jaeger; Jeffrey C. Suhling; Jun Chen The conjecture discussed in our previous paper [Jaeger, R. C., Motalab, M., Hussain, S., and Suhling, J. C., 2014, “Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors,” ASME J. Electron. Packag., 136 (4), p. 041014; Jaeger, R. C...

...Ž. Staliulionis; H. Conseil-Gudla; S. Mohanty; M. Jabbari; R. Ambat; J. H. Hattel The aim of this paper is to model moisture ingress into a closed electronic enclosure under isothermal and non-isothermal conditions. As a consequence, an in-house code for moisture transport is developed using...

... Circuit Symposium ( CSICS ), Monterey, CA, Oct. 13–16, pp. 1 – 5 . 10.1109/CSICS.2013.6659222 [3] Bar-Cohen , A. , and Geisler , K. J. L. , 2011 , “ Cooling the Electronic Brain: Stacking Processing Chips Can Make for More Compact Computers. But it Will Take Advances in Microfluidics...

... joint. The Auger electron spectroscopy (AES) surface and depth profile techniques identified surface and through-thickness contaminants in the Au metallization layer. In one case, the AES analysis identified background levels of carbon (C) contamination on the surface; however, the depth profile...

.... The flow rate range is 0.6–15 GPM with ±1% accuracy. The PCV assembly consists of a two-way valve of Powermite 599 Series type plus an MT Series SSC electronic valve actuator. The PCV is chosen such that the valve is normally closed and fail open to ensure that the PCV will not halt the flow of the primary...

...Sandeep Mallampati; Liang Yin; David Shaddock; Harry Schoeller; Junghyun Cho Predominant high melting point solders for high-temperature and harsh environment electronics (operating temperatures from 200 to 250 °C) are Pb-based systems, which are being subjected to RoHS regulations because...

...Nicolas Lamaison; Raffaele L. Amalfi; Todd Salamon; Jackson B. Marcinichen; John R. Thome Gravity-driven two-phase liquid cooling systems using flow boiling within microscale evaporators are becoming a game-changing solution for electronics cooling. The optimization of the system's filling ratio...

...Sven Rzepka; Alexander Otto; Dietmar Vogel; Rainer Dudek The revolutionary changes in automotive industry toward fully connected automated electrical vehicles necessitate developments in automotive electronics at unprecedented speed. Signal, control, and power electronics will heterogeneously...

...Richard C. Jaeger; Mohammad Motalab; Safina Hussain; Jeffrey C. Suhling 16 10 2017 11 12 2017 Electronic Sensors Fig. 1 Analysis by superposition: ( a ) diagonal current excitation; ( b ) and ( c ) equivalent circuits for superposition Unfortunately...

...Ercan M. Dede; Feng Zhou; Paul Schmalenberg; Tsuyoshi Nomura Rapid advancement of modern electronics has pushed the limits of traditional thermal management techniques. Novel approaches to the manipulation of the flow of heat in electronic systems have potential to open new design spaces. Here...

... Electronic Systems (ES2). References [1] Patel , C. D. , Bash , C. E. , Sharma , R. K. , Beitelmal , A. , and Friedrich , R. J. , 2003 , “ Smart Cooling of Data Centers ,” ASME Paper No. IPACK-35059. 10.1115/IPACK2003-35059 [2] Bash , C. E. , Patel , C. D...

... an array of consolidated larger fans is superior to traditional chassis fans. 1 Corresponding author. Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received February 16, 2017; final manuscript received...

... is investigated. Each rack-level setup has distinct advantages. Selecting between configurations would necessitate a compromise between efficiency, redundancy, and cost. 1 Corresponding author. Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the J OURNAL OF E...

... technology (IT) hardware and implementation of oil cooling is also included. 1 Corresponding author. Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received February 16, 2017; final manuscript received...

...Rajiv L. Iyer; Daryl L. Santos Over the past ten years, there has been an exponential growth in innovations and designs to offer cutting edge electronic devices that are smaller, faster, with advanced features built in. The existence of smartphones, wearable devices, tablets, etc., is the evidence...

.... , and Schlottig , G. , 2016 , “ Benchmarking Study on the Thermal Management Landscape for Three-Dimensional Integrated Circuits: From Back-Side to Volumetric Heat Removal ,” ASME J. Electron. Packag. , 138 ( 1 ), p. 010911 . 10.1115/1.4032492 [3] Kosar , A. , Mishra , C. , and Peles , Y...

...Kaysar Rahim; Ahsan Mian The packaging of electronic and microelectromechanical systems (MEMS) devices is an important part of the overall manufacturing process as it ensures mechanical robustness as well as required electrical/electromechanical functionalities. The packaging integration process...

...Yuyan Gao; Huanyu Cheng Specific function or application in electronics often requires assembly of heterogeneous materials in a single system. Schemes to achieve such goals are of critical importance for applications ranging from the study in basic cell biology to multifunctional electronics...

... at temperatures up to 260 °C, which is the typical maximum temperature experienced by electronic packages during solder reflow. For the epoxy underfills tested in this study, the DCB samples failed cohesively within the underfill at room temperature but started failing adhesively at temperatures near 150 °C...

... energy by allowing IT equipment to operate outside the currently recommended and allowable ASHRAE envelopes and outside the ISA severity level G1. 1 Corresponding author. Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the J OURNAL OF E LECTRONIC P...