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Keywords: Failure analysis
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041012.
Paper No: EP-21-1136
Published Online: January 28, 2022
...-u.ac.jp 09 09 2021 21 12 2021 28 01 2022 conductive inks reliability flexible circuit direct write failure analysis Japan Society for the Promotion of Science 10.13039/501100001691 19K04084 In recent years, printed electronics (PEs) have attracted...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031107.
Paper No: EP-19-1129
Published Online: April 24, 2020
..., a failure analysis of Ag nanoparticle ink lines were assessed using current loading tests and microscopic observations to discuss the damage mechanism and evaluate electrical reliability under high-density current. Atomic transport due to EM was observed at 60 kA/cm 2 current loading, and relatively large...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041004.
Paper No: EP-17-1062
Published Online: August 20, 2018
... gives more consistent failure times. Failure analysis for the tested devices shows the primary failure mode is “input” trace crack first, followed by fatigue through the solder for complete failure. A finite element (FE) model, correlated with experimental modal analysis, is shown to accurately estimate...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031008.
Paper No: EP-18-1004
Published Online: June 26, 2018
... by the Electronic and Photonic Packaging Division of ASME for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received January 15, 2018; final manuscript received May 9, 2018; published online June 26, 2018. Assoc. Editor: Toru Ikeda. 15 01 2018 09 05 2018 Failure analysis...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031007.
Paper No: EP-18-1009
Published Online: June 11, 2018
... failure of solder joints under stress conditions [ 5 – 7 ]. Area array COB Failure analysis Flip chip Reliability Solder 28 01 2018 12 05 2018 Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the J OURNAL OF E LECTRONIC P ACKAGING...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031005.
Paper No: EP-17-1107
Published Online: May 21, 2018
... manuscript received April 27, 2018; published online May 21, 2018. Assoc. Editor: Toru Ikeda. 12 10 2017 27 04 2018 Failure analysis Harsh environment Reliability Solder The fatigue failure of solder joints in printed circuit boards is one of the limiting factors...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 021003.
Paper No: EP-17-1115
Published Online: May 9, 2018
... Level Au-Sn Bonds ,” Microelectron. Reliab. , 64 , pp. 676 – 680 . 10.1016/j.microrel.2016.07.013 Electronic Failure analysis Harsh environment Ceramic packages are selected for microprocessors and similar components that support high-reliability electronics systems because...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010906.
Paper No: EP-17-1101
Published Online: March 2, 2018
... LECTRONIC P ACKAGING . Manuscript received September 28, 2017; final manuscript received January 4, 2018; published online March 2, 2018. Assoc. Editor: Sreekant Narumanchi. 28 09 2017 04 01 2018 Composite materials DCA Electronic Failure analysis Harsh environment Physics...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010903.
Paper No: EP-17-1090
Published Online: March 2, 2018
... Electronic Failure analysis Harsh environment Physics of failure Reliability The rapidly growing application fields in mobility, i.e., electromobility and automated driving (AD), and fully connected vehicles, not only trigger the development of a new generation of electronic systems...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010902.
Paper No: EP-17-1087
Published Online: March 2, 2018
... without overcooling the entire data center. Dynamic local cooling can be achieved by placing actuators to control cooling air delivery as close to the IT equipment as possible. Electronic Failure analysis Thermal analysis 18 09 2017 29 11 2017 Contributed by the Electronic...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031004.
Paper No: EP-16-1110
Published Online: June 14, 2017
..., all the test vehicles with fine pitch interconnects had fails at the aluminum/passivation layer interface at varied number of cycles ranging from 200 cycles to 1000 cycles. The extent of damage seen from cross-sectional failure analysis was qualitatively assessed based on visual inspection...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031002.
Paper No: EP-16-1064
Published Online: June 14, 2017
... OURNAL OF E LECTRONIC P ACKAGING . Manuscript received May 18, 2016; final manuscript received January 3, 2017; published online June 14, 2017. Assoc. Editor: Toru Ikeda. 18 05 2016 03 01 2017 Failure analysis Harsh environment Microsystems Physics of failure Reliability SMT...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. June 2017, 139(2): 020301.
Paper No: EP-17-1032
Published Online: June 12, 2017
...Justin A. Weibel; S. Ravi Annapragada 22 03 2017 31 03 2017 3D packaging Backplanes Chip stacking Failure analysis Flexible circuits Nanotechnolgy Reliability Solder Thermal analysis Underfill Wafer level packaging ASME's International Mechanical Engineering...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2017, 139(2): 020905.
Paper No: EP-16-1147
Published Online: April 28, 2017
... [11] Hocheng , H. , and Chen , C. M. , 2014 , “ Design, Fabrication and Failure Analysis of Stretchable Electrical Routing ,” Sensors , 14 ( 7 ), pp. 11855 – 11877 . 10.3390/s140711855 [12] Yuan , J. H. , Pharr , M. M. , Feng , X. X. , Rogers , J. A. , and Huang...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2017, 139(1): 011001.
Paper No: EP-16-1073
Published Online: November 10, 2016
... and silicon CMOS, so as to benefit from the afore described advantages offered by such an arrangement. Chip stacking Failure analysis Harsh environment Micro vias SOC Thermal analysis 14 06 2016 25 10 2016 Contributed by the Electronic and Photonic Packaging Division of ASME...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2016, 138(3): 031006.
Paper No: EP-15-1054
Published Online: June 28, 2016
... Chip stacking Failure analysis The three-dimensional integrated circuit (3D IC) is an emerging technology that integrates multiple circuits vertically into a single chip [ 1 , 2 ]. The benefits of a 3D IC based on TSVs include improved packing density, reduced power consumption, wider...
Journal Articles
Publisher: ASME
Article Type: Editorial
J. Electron. Packag. September 2016, 138(3): 038001.
Paper No: EP-16-1065
Published Online: June 6, 2016
... 21 05 2016 22 05 2016 3D packaging CSP Failure analysis High density interconnects SMT List of JEP Reviewers Alekhya Addagatla David Hutt Kaustubh Nagarkar Dereje Agonafer Toru Ikeda Luu T. Nguyen S. Ravi Annapragada Toshitaka Ishizaki Mark...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2016, 138(2): 021001.
Paper No: EP-15-1109
Published Online: March 23, 2016
... 15, 2016; published online March 23, 2016. Assoc. Editor: Yi-Shao Lai. 07 10 2015 15 02 2016 Failure analysis Power packaging Reliability Interconnection materials in electric devices undergo cyclic stress caused by a mismatch of thermal expansion coefficients...