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Keywords: Flip chip
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2021, 143(3): 031005.
Paper No: EP-20-1106
Published Online: January 19, 2021
... Materials Symposium , Stone Mountain, GA , Mar. 3–6, pp. 201 – 209 . 10.1109/ISAPM.2002.990387 [2] Ng , F. C. , Abas , M. A. , and Abdullah , M. Z. , 2019 , “ Filling Efficiency of Flip-Chip Underfill Encapsulation Process ,” Solder. Surf. Mount Technol. , 32 ( 1 ), pp. 10...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041006.
Paper No: EP-18-1016
Published Online: September 10, 2018
..., 2018. Assoc. Editor: Xiaobing Luo. 28 02 2018 20 07 2018 Flip chip MEMS Microsystems Solder The ongoing technical progress, especially in electronics and its miniaturization, continuously poses new challenges for joining technologies. Examples are the joining...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2018, 140(4): 044502.
Paper No: EP-18-1015
Published Online: August 6, 2018
... investigated the thermosonic flip chip bonding of a copper pillar with a tin cap. The effect of bonding force on bonding strength was studied, and an average bonding strength 2500 g (approximately 84.8 MPa) was obtained in 2 s, at an optimized bonding force of 0.11 N per 40 μ m pillar bump, and substrate...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041002.
Paper No: EP-18-1007
Published Online: August 3, 2018
... packaging Chip stacking Electrical design Flip chip Micro vias Reliability Thermal analysis Through-silicon via (TSV)-based three-dimensional (3D) integration presents a path toward reduced delay, reduced power consumption, higher performance, smaller packaging size, and heterogeneous...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 011001.
Paper No: EP-17-1019
Published Online: March 2, 2018
...X. J. Yao; J. J. Fang; Wenjun Zhang The notion of permeability is very important in understanding and modeling the flow behavior of fluids in a special type of porous medium (i.e., the underfill flow in flip-chip packaging). This paper presents a new concept regarding permeability in a porous...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041010.
Paper No: EP-17-1026
Published Online: October 25, 2017
...Yasuo Takahashi; Hiroki Fukuda; Yasuhiro Yoneshima; Hideki Kitamura; Masakatsu Maeda Low-temperature microjoining, such as wire (or ribbon) bonding, tape automated bonding (TAB), and flip chip bonding (FCB), is necessary for electronics packaging. Each type of microjoining takes on various aspects...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041004.
Paper No: EP-17-1044
Published Online: September 5, 2017
...] Kim , S.-C. , and Kim , Y.-H. , 2013 , “ Review paper: Flip Chip Bonding With Anisotropic Conductive Film (ACF) and Nonconductive Adhesive (NCA) ,” Curr. Appl. Phys. , 13 ( Suppl. 2 ), pp. S14 – S25 . 10.1016/j.cap.2013.05.009 [3] Kim , Y. H. , Ma , S. W. , and Kim , Y.-H...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041001.
Paper No: EP-16-1151
Published Online: July 27, 2017
... on glass substrates. Fig. 10 Process flow of panel-level double-side assembly of 3D glass packages Surface acoustic wave filters were first assembled onto the substrates with a flip-chip bonder and mass reflowed at 260 °C. The assemblies were then underfilled by manual dispensing, followed...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031009.
Paper No: EP-17-1012
Published Online: July 14, 2017
... manuscript received May 31, 2017; published online July 14, 2017. Assoc. Editor: Xiulin Ruan. 30 01 2017 31 05 2017 Area array BGA Conductive adhesives Conductive Inks Conformal coatings Electronic Flip chip High density interconnects Microsystems PWB Rework SMT Underfill...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2015, 137(4): 041005.
Paper No: EP-14-1064
Published Online: October 12, 2015
.... The most widely used methods are based on the standards set by Joint Electron Devices Engineering Council (JEDEC) [ 1 ]. Flip chip Wafer level packaging 30 06 2014 16 09 2015 Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the J OURNAL...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2014, 136(1): 011005.
Paper No: EP-12-1068
Published Online: December 31, 2013
... nucleation flip chip fine pitch high I/O density no-flow underfill void formation Flip chip in package (FCIP) technology has been invented to meet the electrical and mechanical requirements of high performance devices in electronics packaging industry. Such capabilities enables it to be widely...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2009, 131(4): 041007.
Published Online: October 29, 2009
.... 239 – 250 . Kang , S. Y. , Williams , P. M. , and Lee , Y. C. , 1995 , “ Modeling and Experimental Studies on Thermosonic Flip-Chip Bonding ,” IEEE Trans. Compon., Packag. Manuf. Technol., Part B 1070-9894 , 18 , pp. 728 – 733 . 10.1109/96.475282 Tan , Q...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031014.
Published Online: July 31, 2009
...Sangil Lee; M. J. Yim; Daniel Baldwin This paper investigates the void formation mechanism induced by chemical interaction between eutectic solder (Sn63/Pb37) wetting and no-flow underfill material curing during flip chip in package assembly. During the process, low weight molecular components...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011013.
Published Online: February 18, 2009
...Jin Yang; I. Charles Ume Microelectronics packaging technology has evolved from through-hole and bulk configurations to surface-mount and small-profile configurations. Surface mount devices, such as flip chip packages, chip scale packages, and ball grid arrays, use solder bump interconnections...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031005.
Published Online: July 30, 2008
...Cheng-fu Chen; Pramod C. Karulkar Underfill is usually modeled as an isotropic medium containing uniformly distributed filler particles. However, filler particles tend to settle (or segregate) and thus alter the mechanical response of the flip chip die attachment package. The integrity of such flip...