..., 2018. Assoc. Editor: Xiaobing Luo. 28 02 2018 20 07 2018 Flip chip MEMS Microsystems Solder The ongoing technical progress, especially in electronics and its miniaturization, continuously poses new challenges for joining technologies. Examples are the joining...

.... As such, the stress had to be larger than in the real case and couple too much calculation noise inside. In the new model, the element-type solution was used to obtain a smooth distribution on the plot and prevent deviation. Failure analysis MEMS Microsystems Physics of failure Reliability Sensors...

... 31, 2018; published online May 11, 2018. Assoc. Editor: Baris Dogruoz. 14 09 2017 31 01 2018 3D packaging Dielectrics Microsystems Power packaging Solder Thermal analysis The rapid increase in heat dissipation of next-generation integrated circuits necessitates...

..., and reliability. These topics are organized across five different tracks: (1) heterogeneous integration—microsystems with diverse functionality, (2) servers of the future, (3) structural and physical health monitoring, (4) energy conversion and storage, and (5) transportation: autonomous and electric vehicles...

... Division of ASME for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received February 12, 2017; final manuscript received October 27, 2017; published online March 2, 2018. Assoc. Editor: Yi-Shao Lai. 12 02 2017 27 10 2017 Flip chip Microsystems Underfill...

... manuscript received May 31, 2017; published online July 14, 2017. Assoc. Editor: Xiulin Ruan. 30 01 2017 31 05 2017 Area array BGA Conductive adhesives Conductive Inks Conformal coatings Electronic Flip chip High density interconnects Microsystems PWB Rework SMT Underfill...

... analysis High density interconnects Microsystems In two-dimensional (2D) packaging, a silicon chip is assembled directly on a higher coefficient of thermal expansion (CTE) ceramic or an organic substrate. Tin-based solder interconnects are typically used to connect the chip to the substrate. Two...

... OURNAL OF E LECTRONIC P ACKAGING . Manuscript received May 18, 2016; final manuscript received January 3, 2017; published online June 14, 2017. Assoc. Editor: Toru Ikeda. 18 05 2016 03 01 2017 Failure analysis Harsh environment Microsystems Physics of failure Reliability SMT...

... environment MEMS Microsystems Nanotechnolgy PWB Reliability SMT The ever increasing portability, miniaturization, and functionality of consumer electronic products have driven the move to thinner printed wiring assemblies (PWAs) and smaller clearances between adjacent components. Accidental drop...

... temperature variation. MEMS Microsystems Thermal analysis 12 08 2016 30 11 2016 Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received August 12, 2016; final manuscript received...

... transfer in multi-microchannel evaporators under such conditions is currently very limited in the open literature. Microsystems Thermal analysis 13 07 2016 15 11 2016 Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the J OURNAL OF E...

... is unlimited. 24 06 2016 04 11 2016 Composite materials Conductive adhesives Microsystems Solder Thermal analysis The performance characteristics of TIMs continue to improve rapidly with the development of novel nanostructured materials and advanced manufacturing processes...

.... Editor: Toru Ikeda. 05 06 2016 13 08 2016 High density interconnects Microsystems Reliability Solder The solder joints used as interconnects in today's electronic packaging continue to get smaller and smaller in size to meet the demand on further miniaturization...

... manuscript received July 21, 2016; published online August 24, 2016. Assoc. Editor: Eric Wong. 16 01 2016 21 07 2016 3D packaging Microsystems Thermal analysis Flow boiling in microscale systems was studied intensively in the past two decades and is still attracting...

... received March 12, 2016; final manuscript received August 1, 2016; published online August 19, 2016. Assoc. Editor: Satish Chaparala. 12 03 2016 01 08 2016 Bio-Research Microsystems The traditional approach to microfluidics is based on monolithic integration of multiple...

... received June 27, 2016; published online July 28, 2016. Assoc. Editor: Pradip Dutta. 16 01 2016 27 06 2016 Microsystems Thermal analysis The rise in energy consumption by data centers over the last few decades has necessitated technological progress in nearly every field...

... online May 19, 2016. Assoc. Editor: Xiaobing Luo. 24 02 2016 01 05 2016 Microsystems Thermal analysis Consistent trends toward achieving higher computing performance have led to the miniaturization and proliferation of a large number of components in an increasingly smaller...

... manuscript received December 31, 2015; published online March 10, 2016. Assoc. Editor: Mehdi Asheghi. 25 09 2015 31 12 2015 Microsystems Thermal analysis Microchannel evaporators are one of the most promising cooling techniques for high-performance electronic devices. These heat...

... packaging Microsystems Thermal analysis Gallium nitride (GaN) HEMTs have received considerable attention over the last decade due to the material characteristics that improve electrical performance [ 1 ]. Thermal management of high radio frequency power devices using GaN HEMT has become...

... Microsystems Nanotechnolgy PWB Reliability SMT Impact loading is commonly seen in portable devices due to accidental drops. Relevant shock accelerations can reach up to tens of thousands of g's (“g” is the gravitational acceleration) [ 1 – 5 ], especially in the presence of secondary impacts...