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Keywords: Optoelectronics
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. June 2018, 140(2): 020301.
Paper No: EP-18-1012
Published Online: May 9, 2018
... would also like to acknowledge InterPACK 2017 General Conference Chair Dr. Mehdi Asheghi and JEP Editor Professor Y. C. Lee for their support and cooperation. 3D packaging Battery technology Harsh environment High density interconnects Microsystems Optoelectronics Power packaging Sensors...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031003.
Paper No: EP-16-1108
Published Online: June 14, 2017
... received September 24, 2016; final manuscript received February 13, 2017; published online June 14, 2017. Assoc. Editor: Xiaobing Luo. 24 09 2016 13 02 2017 Optoelectronics Thermal analysis The last few years have seen remarkable progress on phosphor-converted light emitting...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. June 2016, 138(2): 020801.
Paper No: EP-15-1122
Published Online: April 18, 2016
.... , Xiao , J. , Wang , S. , Huang , Y. , and Rogers , J. A. , 2008 , “ A Hemispherical Electronic Eye Camera Based on Compressible Silicon Optoelectronics ,” Nature , 454 ( 7205 ), pp. 748 – 753 . 10.1038/nature07113 [7] Someya , T. , Sekitani , T. , Iba , S. , Kato...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031010.
Published Online: September 26, 2011
...John H. Lau; M. S. Zhang; S. W. Ricky Lee A low-cost (with bare chips) and high (optical, electrical, thermal, and mechanical) performance optoelectronic system embedded into a PCB (printed circuit board) or an organic laminated substrate is designed and described. This system consists of a rigid...
