... particles. Their thermal conductivity is typically lower than that of thermal greases. They require curing, after which they do not suffer pump-out or similar effects. Alternatives for popular, typically tin-based solders are needed as they have poor high-temperature temperature, high-power packaging...

... in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received October 22, 2017; final manuscript received June 3, 2018; published online July 2, 2018. Assoc. Editor: Satish Chaparala. 22 10 2017 03 06 2018 Flexible circuits Power packaging Reliability Wirebond Silicon...

... OF E LECTRONIC P ACKAGING . Manuscript received September 14, 2017; final manuscript received January 31, 2018; published online May 11, 2018. Assoc. Editor: Baris Dogruoz. 14 09 2017 31 01 2018 3D packaging Dielectrics Microsystems Power packaging Solder Thermal analysis...

... or reproduce the published form of this work, or allow others to do so, for United States Government purposes. 16 02 2018 21 02 2018 3D packaging Battery technology Harsh environment High density interconnects Microsystems Optoelectronics Power packaging Sensors SOC Wafer level...

... Harsh environment Power packaging Solder Power electronic devices are subject to continuously increasing heat dissipation levels because of growing current densities and voltage levels. Simultaneously, power electronic systems are becoming more miniaturized, further increasing dissipation heat...

... to Bi to address some of these shortcomings. Cu is expected to enhance thermal properties of the resultant alloy and Sb is expected to increase the reaction with Cu and Ni metallization. Composite materials DCA Electronic Failure analysis Harsh environment Physics of failure Power...

.... , Parida , P. , Knickerbocker , J. , and Chainer , T. , 2016 , “ Embedded Two-Phase Cooling of Large Three-Dimensional Compatible Chips With Radial Channels ,” ASME J. Electron. Packag. , 138 ( 2 ), p. 021005 . 10.1115/1.4033309 Conductive adhesives Power packaging Reliability...

... the next generation of electronics packaging [ 16 , 18 – 20 ]. It is, however, very difficult to comprehend the UB mechanisms because of the short time required for bonding. 3D packaging CSP Flip chip High density interconnects Power packaging Wirebond 09 03 2017 21 09 2017...

... , S. , and Wang , Z. , 2016 , “ Directional Transport of High-Temperature Janus Droplets Mediated by Structural Topography ,” Nat. Phys. , 12 ( 6 ), pp. 606 – 613 . 10.1038/nphys3643 Flexible circuits FR-4 Polyimide Power packaging PWB Heat pipes have been used...

...K. S. Siow; Y. T. Lin 25 04 2016 13 05 2016 Nanotechnolgy Power packaging Solder The corresponding author is K. S. Siow. Copyright © 2016 by ASME 2016 1043-7398/2016/138(3)/037001/1/ $25.00 ...

... flakes and cyclohexanol [ 6 ]. Conductive adhesives Nanotechnolgy Power packaging Solder 12 01 2016 13 03 2016 Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received January 12...

... Packaging Division of ASME for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received October 7, 2015; final manuscript received February 15, 2016; published online March 23, 2016. Assoc. Editor: Yi-Shao Lai. 07 10 2015 15 02 2016 Failure analysis Power packaging...

... September 25, 2015; final manuscript received January 8, 2016; published online March 10, 2016. Assoc. Editor: Toru Ikeda. 25 09 2015 08 01 2016 3D packaging LGA Power packaging Reliability Thermal analysis We extend the lid-integrated cold-plate cooling solution to organic...

... for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received September 25, 2015; final manuscript received December 8, 2015; published online March 10, 2016. Assoc. Editor: Xiaobing Luo. 25 09 2015 08 12 2015 Power packaging Thermal analysis The combined trend...

... of power; this resistor fails to operate beyond 13.3 W in the absence of fluid circulation. This is, to the best of our knowledge, the best thermal cooling performance ever achieved on multilayer organic substrates. Flexible circuits Organic electronics Power packaging SOP Thermal analysis...

... heat removal rate. With the 25% increased heat transfer option, high heat fluxes up to 250 W/cm 2 (typical for wideband-gap semiconductor applications) are possible by using the subcooled boiling system. Power packaging Thermal analysis The current cooling technology for the power...

... transfer coefficient of 13,100 W/m 2 K and average Nusselt number of 67.7 were measured at an average jet Reynolds number of 14,000. Power packaging Thermal analysis Power electronics such as metal–oxide–semiconductor field-effect transistors (MOSFETs), gate turn-off thyristors (GTOs...