... LECTRONIC P ACKAGING . Manuscript received January 15, 2018; final manuscript received May 9, 2018; published online June 26, 2018. Assoc. Editor: Toru Ikeda. 15 01 2018 09 05 2018 Failure analysis MEMS Microsystems Physics of failure Reliability Sensors...

...Aaron Knobloch; Chris Kapusta; Jason Karp; Yuri Plotnikov; Jason B. Siegel; Anna G. Stefanopoulou This paper details the fabrication and testing of a combined temperature and expansion sensor to improve state of charge (SOC) and state of health (SOH) estimation for Li-ion batteries. These sensors...

... or reproduce the published form of this work, or allow others to do so, for United States Government purposes. 16 02 2018 21 02 2018 3D packaging Battery technology Harsh environment High density interconnects Microsystems Optoelectronics Power packaging Sensors SOC Wafer level...

...David Eric Schwartz; Clinton J. Smith; Joseph Lee; Shakthi Priya Gowri; George Daniel; Christopher Lalau-Keraly; Quentin Baudenon; J. R. M. Saavedra PARC, a Xerox Company, is developing a low-cost system of peel-and-stick wireless sensors that will enable widespread building environmental sensor...

...Richard C. Jaeger; Mohammad Motalab; Safina Hussain; Jeffrey C. Suhling 16 10 2017 11 12 2017 Electronic Sensors Fig. 1 Analysis by superposition: ( a ) diagonal current excitation; ( b ) and ( c ) equivalent circuits for superposition Unfortunately...

... electronics microwave organic electronics sensors SOP We discuss here the use of inkjet printing technology as an attractive alternative for the fabrication of radio frequency (RF) electronics. Inkjet printing is compared to widely-used traditional methods such as wet etching and mechanical milling...