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Keywords: Telecommunications
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Editorial
J. Electron. Packag. June 2018, 140(2): 020201.
Paper No: EP-18-1022
Published Online: May 9, 2018
... and Photonic Packaging Division of ASME for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received March 16, 2018; final manuscript received March 16, 2018; published online May 9, 2018. Assoc. Editor: Y.C. Lee. 16 03 2018 16 03 2018 Telecommunications...
Topics:
Telecommunications
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010901.
Paper No: EP-17-1085
Published Online: March 2, 2018
... Electronic Embedded passives Reliability Telecommunications Thermal analysis Air cooling technologies are becoming increasingly challenged to address the heat dissipation rates and heat densities arising in next-generation electronic systems, with acoustic noise, air-cooling capability, and fan...
