... in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received October 22, 2017; final manuscript received June 3, 2018; published online July 2, 2018. Assoc. Editor: Satish Chaparala. 22 10 2017 03 06 2018 Flexible circuits Power packaging Reliability Wirebond Silicon...

... the next generation of electronics packaging [ 16 , 18 – 20 ]. It is, however, very difficult to comprehend the UB mechanisms because of the short time required for bonding. 3D packaging CSP Flip chip High density interconnects Power packaging Wirebond 09 03 2017 21 09 2017...

... Wirebond Driven by the demand for smarter and faster portable electronic products, the advanced semiconductor packaging technology is targeting to integrate multiple and heterogeneous dies or chips. There are many types of three-dimensional (3D) stacking configurations and interconnection...

... Wirebond From a fundamental jetting principle standpoint, the piston size, nozzle size, and nozzle material are recognized as influential hardware parameters that impact the performance of jetting. To understand the significance of each of the hardware parameters, the research refers back to some...

... ACKAGING . Manuscript received September 19, 2014; final manuscript received August 25, 2015; published online October 1, 2015. Assoc. Editor: Jeffrey C. Suhling. 19 09 2014 25 08 2015 BGA Wirebond The semiconductor packaging industry is constantly heading toward small...

... of this investigation. Also, the state-of-the-art, challenge, and trend of 3D integration will be presented and examined. Furthermore, supply chain readiness for high volume manufacturing (HVM) of TSVs is discussed. 3D packaging Micro vias Microsystems Underfill Wirebond The Electronics Industry has...