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Keywords: annealing
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031009.
Paper No: EP-21-1076
Published Online: September 15, 2021
... be strongly enhanced by subsequent work hardening in mild cycling. microjoints heat sinks copper nanoparticles rapid sintering porosity particle size macroscopic strain inelastic deformation impression creep test diffusion creep dislocations annealing coarsening surface diffusion oxidation...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2013, 135(1): 011007.
Paper No: EP-12-1030
Published Online: March 26, 2013
.... annealing CNT conductive silver ink direct write electrical design flexible circuits graphene inkjet-printed electronics low temperature bonding paper-based electronics microwave organic electronics sensors SOP The current era of passive RF electronic circuits depends heavily...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011002.
Published Online: February 11, 2009
... thermal gradient (TG) for 286 h, 712 h, and 1156 h. It was observed that samples subjected to thermal gradient did not develop a Cu 3 Sn intermetallic compound (IMC) layer, and we observed disintegration of Cu 6 Sn 5 IMC. On the other hand, samples subjected to isothermal annealing exhibited IMC growth...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 120–123.
Published Online: April 30, 2004
...Hong-Seok Min; Young-Chang Joo; Oh-Sung Song We studied cleaning and annealing effects in glass/Si direct bonding using 4 inch Pyrex glass and silicon wafers. SPM cleaning (sulfuric-peroxide mixture, H 2 SO 4 : H 2 O 2 = 4 : 1 , 120 ° C ) , RCA cleaning ( NH 4 OH : H 2 O 2 : H 2 O = 1 : 1 : 5 , 80...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2003, 125(1): 153–156.
Published Online: March 14, 2003
... Mount Solder Joints ,” IEEE Trans. Compon., Packag. Manuf. Technol., Part B , 20 , pp. 87 – 93 . So , A. C. K. , Chan , Y. C. , and Lai , J. K. L. , 1997 , “ Aging studies of Cu-Sn intermetallic compounds in annealed surface mount solder joints ,” IEEE Trans. Compon., Packag. Manuf...