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Keywords: applied pressure
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Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2020, 142(2): 021006.
Paper No: EP-19-1070
Published Online: March 9, 2020
... continuous bonding interfaces. e-mail: zhuwenbo@hit.edu.cn 24 06 2019 02 12 2019 09 03 2020 self-propagating reactive soldering preheating temperature applied pressure shear strength fracture mode temperature profile The current trends in electronics are focused...
