Skip Nav Destination
Close Modal
Update search
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
NARROW
Format
Article Type
Subject Area
Topics
Date
Availability
1-3 of 3
Keywords: biographies
Close
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Sort by
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Foreword
J. Electron. Packag. December 2004, 126(4): 409.
Published Online: January 24, 2005
... of the ASME JOURNAL OF ELECTRONICS PACKAGING honors Richard’s outstanding leadership, contributions, and service. 24 01 2005 thermal management (packaging) thermal engineering heat sinks biographies Richard has also received an IBM Outstanding Innovation Award for a heat sink...
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Foreword
J. Electron. Packag. June 2003, 125(2): 165–168.
Published Online: June 10, 2003
... 10 06 2003 biographies packaging thermal resistance heat transfer Michael Yovanovich was born in Montreal, Quebec. After three years in northern Quebec, his family moved to and settled in St. Catharines, Ontario, about 15 miles from the US border. Michael received...
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Article
J. Electron. Packag. March 2000, 122(1): 1–2.
Published Online: March 1, 2000
... distinguished scientific career, but also as a tribute to a truly wonderful person. We all wish him continued good health and many more productive years ahead. biographies research and development management electronic engineering Dr. William T. Chen stands out as the one of the few...