1-1 of 1
Keywords: capillary underfilling
Close
Sort by
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2025, 147(1): 011001.
Paper No: EP-22-1076
Published Online: April 5, 2024
... difference between the TSAM BGA chips experiments and its simulation counterparts in the range of 0.089–3.65%. 1 Corresponding author. e-mail:  aizatabas@usm.my 20 10 2022 28 02 2024 05 04 2024 ball-grid array underfilling process capillary underfilling neural...