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Keywords: circuit reliability
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Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021007.
Published Online: May 8, 2008
...) Difference (%) 124.64 120.81 − 3.07 124.17 0.377 Free boundary condition 30 03 2007 10 09 2007 08 05 2008 circuit reliability circuit simulation elastic moduli printed circuit design printed circuit testing solders PCB FE simulation...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2007, 129(1): 105–108.
Published Online: June 6, 2006
... vibrations and occasionally severe drop impacts to the electronic packages within. Reliability of these packages under monotonic or repetitive mechanical loads therefore stands for another indispensable concern. board-level drop test WLCSP reliability JEDEC chip scale packaging circuit...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 98–103.
Published Online: March 14, 2003
... interconnects. Decreasing the thickness of the chip also increases its flexibility, as illustrated in Fig. 1 . Thinner packages also require new expertise, specifically, in the analysis of stresses and reliability of ultra-thin flip-chip applications. ball grid arrays chip scale packaging circuit...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2003, 125(1): 157–161.
Published Online: March 14, 2003
..., 2002. Associate Editor: Y.-H. Pao. 19 March 2002 14 03 2003 plastic packaging assembling circuit reliability failure analysis ball grid arrays surface mount technology reflow soldering printed circuit manufacture wetting thermal stability inspection PBGAs provide...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 374–378.
Published Online: December 12, 2002
... interconnections circuit reliability scanning electron microscopy failure (mechanical) Surface mount technology (SMT) continues to be significantly important to the electronics manufacturing industry. Currently, SMT mainly uses lead-tin as soldering material. When components and assemblies soldered...
Journal Articles
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. December 2002, 124(4): 385–390.
Published Online: December 12, 2002
... Division October 12, 2001. Associate Editor: Y.-H. Pao. 12 October 2001 12 12 2002 soldering lead alloys tin alloys fatigue cracks ageing cooling granular structure crystal microstructure casting packaging fatigue testing circuit reliability As solder joints...
Journal Articles
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. September 2002, 124(3): 240–245.
Published Online: July 26, 2002
... with ultra-fine pitch technology. flip-chip devices adhesives fine-pitch technology conducting polymers circuit reliability environmental testing contact resistance electric resistance measurement filled polymers 27 July 1999 26 07 2002 Contributed by the Electronic...
Journal Articles
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. September 2002, 124(3): 254–259.
Published Online: July 26, 2002
... . Manuscript received by the EPPD December 7, 2000. Associate Editor: S. M. Heinrich. 07 December 2000 26 07 2002 fatigue circuit reliability printed circuit manufacture packaging production testing fracture Thin Films Flexible Printed Circuitry (FPC) High Cycle Fatigue...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 2002, 124(2): 135–137.
Published Online: May 2, 2002
... circuit reliability soldering 29 December 2000 31 May 2001 02 05 2002 Contributed by the Electronic and Photonic Packaging Division of THE AMERICAN SOCIETY OF MECHANICAL ENGINEERS . Manuscript received by the Electronic and Photonic Packaging Division December 29, 2000; revised...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2002, 124(2): 85–90.
Published Online: May 2, 2002
... into consideration. 6 Activation energy as a function of applied normalized shear stress for different temperatures tin alloys lead alloys soldering creep circuit reliability printed circuits ball grid arrays Sn-Pb eutectic solders are commonly used in electronic packaging as both...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2002, 124(1): 45–53.
Published Online: January 1, 2001
... thermal analysis wave soldering printed circuit manufacture stress analysis cooling circuit reliability Integrity of plated through holes (PTHs), as shown in Fig. 1 , has become one of the primary printed wiring board (PWB) reliability concerns either during the component assembly process...
Journal Articles
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. June 2001, 123(2): 141–146.
Published Online: October 10, 2000
... structures. The bandwidth of the stiffness matrix can be somewhat large in a NFEM mesh because of the nesting scheme. Hence in this study, a reverse Cuthill-Mckee (George et al. 9 ) algorithm is implemented to optimize the bandwidth, and further reduce the computational time. packaging circuit...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2001, 123(2): 120–126.
Published Online: July 21, 2000
... September 1999 21 July 2000 thermal management (packaging) plastic packaging forced convection thermal resistance circuit reliability Forced Convection Electronic Cooling Thermal Resistance Aerodynamic Influence Factors Plastic Quad Flat Pack (PQFP) Upstream Flow Disturbance...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2000, 122(4): 306–310.
Published Online: June 20, 2000
... mechanics circuit reliability printed circuits plastic deformation thermal stress cracking crack-edge stress field analysis delamination soldering finite element analysis The last decade witnessed an explosive growth in the research and development efforts devoted to solder bumped flip chips...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2000, 122(4): 294–300.
Published Online: May 15, 2000
... 15 May 2000 plastic packaging flip-chip devices micromechanics circuit reliability shear deformation thermal stresses light interferometry Surface Laminar Circuit Flip Chip Underfill Microscopic Moire´ Interferometry Photosensitive Dielectric Layer Solder Resist Mask Metal...
Journal Articles
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. March 2001, 123(1): 83–87.
Published Online: April 10, 2000
.... Contributed by the Electrical and Electronic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Revised manuscript received by the EEPD April 10, 2000. Associate Editor: B. Courtois. 10 April 2000 plastic packaging circuit reliability flip-chip devices heat sinks...
Journal Articles