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Keywords: crack-edge stress field analysis
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Journal Articles
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2000, 122(4): 301–305.
Published Online: December 1, 2000
... circuit packaging plastic packaging integrated circuit reliability failure analysis thermal stress cracking crack-edge stress field analysis delamination finite element analysis 4 A typical model of the corner contact geometry ( a ) and its mesh ( b ) for the FR4/epoxy intersection, i.e...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2000, 122(3): 267–273.
Published Online: September 1, 2000
... and Electronic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Associate Technical Editor: B. Michel. thin films multilayers internal stresses fracture mechanics stress-strain relations crack-edge stress field analysis Many engineering devices are constructed...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2000, 122(4): 306–310.
Published Online: June 20, 2000
... mechanics circuit reliability printed circuits plastic deformation thermal stress cracking crack-edge stress field analysis delamination soldering finite element analysis The last decade witnessed an explosive growth in the research and development efforts devoted to solder bumped flip chips...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2000, 122(4): 317–322.
Published Online: August 9, 1999
... cutting of various kinds of amorphous solids, e.g., glasses, is of great importance in processing of optical materials where the presence of defects with a size of the order of a wavelength of light is unacceptable. integrated circuit technology thermal stress cracking crack-edge stress field...