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Keywords: electric-thermal-force multi-field coupling
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031014.
Paper No: EP-21-1121
Published Online: March 8, 2022
... of China 10.13039/501100001809 51975594 National Natural Science Foundation of China 10.13039/501100001809 U20A6004 microelectronics packaging flip chip reliability electric-thermal-force multi-field coupling high current density thermal interface material 11 07 2021 13...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031007.
Paper No: EP-21-1039
Published Online: September 15, 2021
... packaging flip chip reliability electric-thermal-force multi-field coupling high current density thermal interface material National Natural Science Foundation of China 10.13039/501100001809 51975594 During the operation of the electronic device, heat is generated due...