...] Wan , J. W. , Zhang , W. J. , and Bergstrom , D. J. , 2007 , “ A Theoretical Analysis of the Concept of Critical Clearance Toward a Design Methodology for the Flip-Chip Package ,” ASME J. Electron. Packaging Trans. ASME , 129 ( 4 ), pp. 473 – 478 . 10.1115/1.2804098 [4...

... the FEM modeling of fluid flow problem such as the underfill flow in encapsulation process [ 53 ]. e-mail:  aizatabas@usm.my 16 01 2021 22 03 2021 06 08 2021 electronic packaging flip-chip package's reliability underfill encapsulation void occurrent Recent rapid...

... , May 31–June 3 , pp. 1992 – 1998 . 10.1109/ECTC.2011.5898790 [5] Roshanghias , A. , Krivec , M. , Bardong , J. , Abram , A. , and Binder , A. , 2016 , “ Printed SAW Transponder Package for Rapid Prototyping of Electronic Packages ,” Sixth IEEE Electronic...

... mechanical and thermal properties, which could satisfy the demand of electronic packaging. China Postdoctoral Science Foundation (Grant No. 2018M630852; Funder ID: 10.13039/501100002858). Fundamental Research Funds for Central Universities (Grant No. 2016JCTD112; Funder ID: 10.13039/501100002338...

... with Cr/Au. Array of 50 × 50 Cu–Ag composite flip-chip columns on a Si chip is bonded to Cu substrates at 260 °C, compatible with the solder reflow temperature used in electronic packaging industries. In contrast to solder joints used in electronic industries, the Cu–Ag joints in principle do not contain...

... interconnect solid-state bonding electronic packaging Si chips Cu substrates At present, nearly all large-scale integrated circuit (IC) chips are packaged with flip-chip technology. This means that the chip is flipped over and the active (front) side is connected to the package using a large number...

...) are able to correspond to profiles found in XRD database, showing that 304SS has face-centered cubic crystal lattice. The Ni strike technique is used as surface treatment to make 304SS bondable to other metals, such as silver (Ag), copper (Cu), and gold (Au), commonly used in electronic packaging. Cross...

... bonding solid-state bonding process electronic packaging integrated circuits In the flip-chip technology, interconnects are made from the active (front) surface of chips to package substrates. The interconnect joints provide mechanical support, electrical connections, and heat conduction...

...Rohit Dev Gupta; Vinayak Eswaran Compact thermal models (CTMs) are simplified multi-nodal thermal resistor network representations of the detailed material and geometric structure of the electronic package. CTMs predict the thermal response of the package, in various environments, to within...

... Model for Lead-Free Solder ,” ASME J. Electron. Packag. 1043-7398 10.1115/1.2160514 , 128 ( 1 ), pp. 71 – 81 . Pierce , D. M. , Sheppard , S. D. , Fossum , A. F. , Vianco , P. T. , and Neilsen , M. K. , 2006 , “ Development of the Damage State Variable for a Unified...

... . Cotterell , B. , Chen , Z. , Han , J. B. , and Tan , N. X. , 2003 , “ The Strength of the Silicon Die in Flip-Chip Assemblies ,” ASME J. Electron. Packag. 1043-7398 10.1115/1.1535934 , 125 , pp. 114 – 119 . McLellan , N. , Fan , N. , Liu , S. , Lau , K...

... the modulus of the interconnection materials, reducing the span of the PCB, or using either a very thin or a very thick PCB. 05 11 2004 30 03 2005 impact testing printed circuit testing stress-strain relations reliability electronic packaging drop impact finite element parametric...

... and interconnection stress PCB bending moment versus interconnection stress Parameters for the FE analysis of board assembly The stress experienced by the joints that interconnect the electronic packages to the board during a board-level drop impact is primarily attributed...

... ) loading angle 90 deg 01 10 2003 26 05 2004 tin alloys lead alloys silver alloys copper alloys solders ball grid arrays printed circuit testing fatigue testing deformation soldering Electronic Packaging Ball Grid Array (BGA) Solder Joints Low Cycle Fatigue...