... was found to describe the observed behavior with much higher fidelity than the common Johnson–Cook model. 14 09 2010 13 05 2011 23 09 2011 deformation eutectic alloys lead alloys solders tensile strength tin alloys This work of authorship was prepared as an account...

... during solder spreading Arrhenius plot for the spreading of the Sn–37Pb solder 01 02 2010 03 10 2010 19 11 2010 19 11 2010 eutectic alloys interface phenomena lead alloys silver alloys solders surface roughness tin alloys wetting zinc alloys wetting...

... . 16 06 2005 04 10 2006 solders lead alloys tin alloys plasticity eutectic alloys indentation elastic deformation plastic deformation hardness testing integrated circuit packaging Length scale, nanoindentation, strain gradient plasticity, size effects It has been...

... analyses for the life assessment for electronic packages and assemblies. In this study, the rate-dependent deformation and fatigue fracture behavior of Sn 3.8 Ag 0.7 Cu Pb -free alloy and Sn – Pb eutectic alloy was investigated with thin-walled specimens using a biaxial servo-controlled tension–torsion...

... topography surface morphology adhesion solders scanning electron microscopy X-ray chemical analysis atomic force microscopy focused ion beam technology eutectic alloys lead alloys tin alloys aluminium 03 04 2005 29 11 2005 2006 American Society of Mechanical Engineers ...

... and electrically ( 1 ). flip-chip devices assembling solders voids (solid) eutectic alloys copper alloys tin alloys lead alloys silver alloys 13 09 2004 24 11 2005 2006 American Society of Mechanical Engineers ...

... of the various approaches are mutually consistent. 29 12 2004 29 09 2005 flip-chip devices reflow soldering solders surface tension eutectic alloys The cross section of the specimen Throughout the following cases except as specified, the radii of the upper and lower pads...

... simplifications have been used for modeling plastic and creep strains under HISS/DSC. 13 10 2003 14 09 2004 tin alloys lead alloys eutectic alloys solders electronics packaging viscoelasticity viscoplasticity Recent trends in electronic packaging underscore the need...

... aged at 180 ° C beyond one day the Sn3.9Ag0.6Cu alloy age-hardened, the hardening correlated with the dispersion of Ag 3 Sn particles into tin-rich crystals which previously had not contained intermetallic precipitates. tin alloys silver alloys copper alloys eutectic alloys ageing crystal...

... are obtained between the experimental and simulated results. To whom correspondence should be addressed. e-mail: msyi@ntu.edu.sg Grivas , D. , Murty , K. L. , and Morris , J. W. , 1979 , “ Deformation of Pb-Sn Eutectic Alloys at Relatively High Strain Rates ,” Acta Metall...

... alloys eutectic alloys soldering fatigue plastic deformation finite element analysis Tin (Sn)–lead (Pb) alloys with near eutectic compositions have been widely used as soldering materials in the package of semiconductor and communication devices. Although they possess good manufacturability...

...X. Q. Shi,; W. Zhou,; H. L. J. Pang, and; Z. P. Wang [S1043-7398(00)01601-7] eutectic alloys soldering thermomechanical treatment stress-strain relations mechanical properties The authors mistakenly stated that the paper “On Constitutive Response of 63/37 Pn/Sb Eutectic Solder...

... developed a model that incorporates the grain or phase size as an internal state variable that evolves during numerical simulation. The model has been applied to simulate thermomechanical fatigue behavior in solder joints. The Pb-Sn eutectic alloy acts as both electrical and mechanical connection...

... Induced Plastic Deformation in Solder Joints—Part Two: Accumulated Deformation in Through Hole Joints ,” IEEE Trans. Compon., Hybrids, Manuf. Technol. , 14 , pp. 824 – 832 . thermomechanical treatment fatigue testing thermal stresses soldering eutectic alloys tin alloys bismuth alloys...