1-14 of 14
Keywords: eutectic alloys
Close
Follow your search
Access your saved searches in your account

Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031009.
Published Online: September 23, 2011
... was found to describe the observed behavior with much higher fidelity than the common Johnson–Cook model. 14 09 2010 13 05 2011 23 09 2011 deformation eutectic alloys lead alloys solders tensile strength tin alloys This work of authorship was prepared as an account...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041001.
Published Online: November 19, 2010
.... Therefore, the solderable surfaces must allow the molten solder to wet and spread within the available time ( 4 5 ). The conventional solder is a eutectic or near-eutectic alloy of tin and lead. The use of lead in solders gives a number of benefits. It is relatively inexpensive and abundantly available...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 120–128.
Published Online: October 4, 2006
... lead alloys tin alloys plasticity eutectic alloys indentation elastic deformation plastic deformation hardness testing integrated circuit packaging 16 06 2005 04 10 2006 2007 American Society of Mechanical Engineers ...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 195–204.
Published Online: June 23, 2006
... analyses for the life assessment for electronic packages and assemblies. In this study, the rate-dependent deformation and fatigue fracture behavior of Sn 3.8 Ag 0.7 Cu Pb -free alloy and Sn – Pb eutectic alloy was investigated with thin-walled specimens using a biaxial servo-controlled tension–torsion...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 246–250.
Published Online: November 29, 2005
... topography surface morphology adhesion solders scanning electron microscopy X-ray chemical analysis atomic force microscopy focused ion beam technology eutectic alloys lead alloys tin alloys aluminium 03 04 2005 29 11 2005 2006 American Society of Mechanical Engineers ...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 202–207.
Published Online: November 24, 2005
...-chip devices assembling solders voids (solid) eutectic alloys copper alloys tin alloys lead alloys silver alloys Solder alloy are commonly used for bonding computer chips to carriers and packages. The reliability of solder joints has become more critical, as electronic components...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 331–338.
Published Online: September 29, 2005
... eutectic alloys As demands on the performance of computers, communication systems, and optoelectronic products rapidly increase, electronic packaging technology continues to move toward small scale, high density, fast heat dissipation, etc. Hence, advanced electronic packaging technology...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 147–156.
Published Online: September 14, 2004
... Processing and Manufacturing Division Grant 9812686, University of Arizona, Tucson, AZ ). Limitations on the range of validity of the elastoplastic and the Perzyna elastoviscoplastic formulations are discussed. 13 10 2003 14 09 2004 tin alloys lead alloys eutectic alloys solders...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 208–212.
Published Online: July 8, 2004
... of the specified aging treatments. The figure clearly shows that the flow strength of the alloy decreases as the room temperature aging time increases to 9 days. However, there is no obvious difference in flow strength between the 1 day and 9 days at 180 ° C samples. The PbSn eutectic alloy therefore...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2002, 124(2): 91–96.
Published Online: May 2, 2002
.... , 1979 , “ Deformation of Pb-Sn Eutectic Alloys at Relatively High Strain Rates ,” Acta Metall. , 27 , pp. 731 – 737 . Mei , Z. , Morris , J. W. , Shine , M. C. , and Summers , T. S. E. , 1991 , “ Effects of Cooling Rate on Mechanical Properties of Near-eutectic Tin-Lead Solder...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2001, 123(1): 74–78.
Published Online: June 29, 2000
... 29 June 2000 tin alloys lead alloys eutectic alloys soldering fatigue plastic deformation finite element analysis Tin (Sn)–lead (Pb) alloys with near eutectic compositions have been widely used as soldering materials in the package of semiconductor and communication devices...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2001, 123(3): 278–283.
Published Online: October 20, 1999
... for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received by the EPPD October 20, 1999. Associate Editor: S. M. Heinrich. 20 October 1999 tin alloys lead alloys soldering creep viscoplasticity grain size free energy finite element analysis eutectic alloys The Pb...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2000, 122(1): 48–54.
Published Online: September 3, 1999
... . This problem has become more important during the last decade with the switch to surface mount techniques from through-hole assembly, where some strain accommodation from leads is no longer available. thermomechanical treatment fatigue testing thermal stresses soldering eutectic alloys tin...