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Keywords: fatigue testing
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041010.
Published Online: December 3, 2010
... in the tensile region is different from that in the compressive region is employed for the fatigue test. Different fatigue lives due to different strain rates in the tensile and compression regions originate from the difference of development behaviors of creep strain generated in the cyclic loading. This paper...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011008.
Published Online: February 13, 2009
... , Anaheim, CA, Feb. 21–26. Sandstrom , R. , Osterberg , J. -O. , and Nylen , M. , 1993 , “ Deformation Behavior During Low Cycle Fatigue Testing of 60Sn–40Pb Solder ,” Mater. Sci. Technol. , 9 , pp. 811 – 819 . 0267-0836 Solomon , H. , 1986 , “ Fatigue of 60/40 Solder...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021003.
Published Online: April 15, 2008
... 2007 15 04 2008 copper alloys creep fatigue cracks fatigue testing fracture mechanics integrated circuit interconnections integrated circuit modelling integrated circuit packaging integrated circuit reliability life testing silver alloys solders tin alloys lead-free solder...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 496–503.
Published Online: August 27, 2007
...John H. L. Pang; F. X. Che Isothermal three-point and four-point cyclic bend fatigue test methods have been developed for Sn–Ag–Cu solder joints. Reported bend tests from the literature were conducted at room temperature (25°C) and there is lack of data for lead-free solder joints. In this study...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 427–433.
Published Online: February 13, 2007
... accelerated thermal cycling. 20 09 2006 13 02 2007 ball grid arrays electronics packaging fatigue testing heat treatment integrated circuit reliability light interferometry solders accelerated thermal cycling laser moiré interferometry Microelectronic packaging industry...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 405–411.
Published Online: October 4, 2006
... underfill thicknesses (0.15, 0.3, 0.45, and 0.6 mm ) were used in this characterization study and two samples for each underfill thickness were fabricated. Fatigue test specimen The specimens were subjected to air-to-air thermal shock testing between − 55 ° C and 125...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 9–18.
Published Online: September 21, 2006
... on SFAIL. Sensitivity plot for the SFAIL 23 10 2004 21 09 2006 thermal management (packaging) solders printed circuits thermal expansion fatigue testing reliability finite element analysis circuit optimisation response surface methodology Solder joint...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 179–189.
Published Online: July 5, 2006
... ball grid arrays integrated circuit packaging durability fatigue testing fatigue cracks solders deformation global-local equivalent model submodel fatigue crack initiation HASMAP Moiré interferometry Commercial-off-the-shelf (COTS) electronics are being utilized...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 195–204.
Published Online: June 23, 2006
... stress conditions were imposed to investigate the effects of multiaxial stresses on deformation behavior. The effects of frequency and temperature on cyclic deformation and fatigue facture were investigated for lead-free Sn 3.8 Ag 0.7 Cu and Sn – Pb eutectic solder. Fractography of fatigue tested samples...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 56–62.
Published Online: May 19, 2006
... were examined, correlated, and discussed. flip-chip devices electromigration solders integrated circuit interconnections life testing fatigue testing reliability temperature distribution tin alloys copper alloys silver alloys current density electromigration solder bump flip-chip...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 407–414.
Published Online: December 24, 2004
... specimens were annealed at 373 K for 2 h to stabilize the microstructure of the material before testing. Shape and dimensions of the hollow cylinder specimen tested in millimeters Reversed torsion low cycle fatigue tests were carried out using the four strain waves shown in Fig. 2 . The first...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. December 2002, 124(4): 385–390.
Published Online: December 12, 2002
...Ki-Ju Kang; Seon-Ho Choi; Tae-Sung Bae Fatigue tests were performed using single lap-joint specimens to obtain near-threshold fatigue crack growth data of solder joint under mode-II load. Attention was focused on the effect of high temperature aging and microstructures separately from...
Journal Articles
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. December 2002, 124(4): 403–410.
Published Online: December 12, 2002
... with a commercial finite element code. In addition, isothermal fatigue tests have been performed to obtain the relationship between the number of cycle-to-failure and the strain energy density. Thus, by combining the finite element results and the isothermal fatigue test results, the average thermal-fatigue life...
Journal Articles
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. March 2002, 124(1): 60–66.
Published Online: March 15, 2001
... and Thermal Loading,” Ph.D dissertation, SUNY at Buffalo. Adams, P. J., 1986 “Thermal fatigue of Solder Joints in Micro-Electronic Devices,” MS thesis, Dept. of Mechanical Engineering, MIT. McDowell, D. L., Miller, M. P. and Brooks, D. C., 1994 Fatigue Testing of Electronic Materials , ASTM STP 1153...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2000, 122(1): 48–54.
Published Online: September 3, 1999
... . This problem has become more important during the last decade with the switch to surface mount techniques from through-hole assembly, where some strain accommodation from leads is no longer available. thermomechanical treatment fatigue testing thermal stresses soldering eutectic alloys tin...