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Keywords: flip-chip
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Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041009.
Paper No: EP-21-1137
Published Online: December 1, 2021
...Fei Chong Ng; Mohamad Aizat Abas Recent advances in the micro-electronics industry have increased the demand for smaller and more compact package devices with higher performance. This paper presents an analytical multiparametric design optimization approach for the miniaturization of flip-chip...
Journal Articles
Journal Articles
Article Type: Review Articles
J. Electron. Packag. March 2022, 144(1): 010803.
Paper No: EP-21-1007
Published Online: August 6, 2021
... the FEM modeling of fluid flow problem such as the underfill flow in encapsulation process [ 53 ]. e-mail:  aizatabas@usm.my 16 01 2021 22 03 2021 06 08 2021 electronic packaging flip-chip package's reliability underfill encapsulation void occurrent Recent rapid...
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Journal Articles
Article Type: Design Innovations
J. Electron. Packag. September 2010, 132(3): 035001.
Published Online: September 30, 2010
...Pin J. Wang; Chin C. Lee Silver flip-chip joints between silicon (Si) chips and copper (Cu) substrates were fabricated using a solid-state bonding process without any solder and without flux. The bonding process was performed at 250 ° C , compatible with typical reflow temperature for lead-free...
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Article Type: Technical Papers
J. Electron. Packag. March 2001, 123(1): 58–63.
Published Online: October 29, 1999
...J.-B. Han Fracture mechanics is applied to flip-chip BGA design to avert die cracking from its backside. Fracture mechanics is integrated with the finite element analysis (FEA) and design of virtual experiments (virtual DOE) to analyze the effects of location and length of a die crack...