...Fei Chong Ng; Mohamad Aizat Abas Recent advances in the micro-electronics industry have increased the demand for smaller and more compact package devices with higher performance. This paper presents an analytical multiparametric design optimization approach for the miniaturization of flip-chip...

...Xingjun Yao; Weijie Jiang; Jiahui Yang; Junjie Fang; Wenjun Zhang This paper presents a new approach to formulating an analytical model for the underfill process in flip-chip packaging to predict the flow front and the filling time. The new approach is based on the concept of surface energy along...

... the FEM modeling of fluid flow problem such as the underfill flow in encapsulation process [ 53 ]. e-mail:  aizatabas@usm.my 16 01 2021 22 03 2021 06 08 2021 electronic packaging flip-chip package's reliability underfill encapsulation void occurrent Recent rapid...

...Fei Chong Ng; Aizat Abas; M. Z. Abdullah This paper presents a new analytical filling time model to predict the flow of non-Newtonian underfill fluid during flip-chip encapsulation process. The current model is formulated based on the regional segregation approach, instead of the conventional...

...Pin J. Wang; Chin C. Lee Silver flip-chip joints between silicon (Si) chips and copper (Cu) substrates were fabricated using a solid-state bonding process without any solder and without flux. The bonding process was performed at 250 ° C , compatible with typical reflow temperature for lead-free...

...Yi-Shao Lai; Ying-Ta Chiu; Chiu-Wen Lee Designed experiments were conducted in this paper to study the effect of Au/Ni/Cu or Cu substrate pad metallization on the electromigration reliability of 96.5Sn–3Ag–0.5Cu flip-chip solder joints with Ti/Ni(V)/Cu under bump metallurgy (UBM) under a current...

...Yi-Shao Lai; Ying-Ta Chiu This work presents electromigration reliability and patterns of Sn–3Ag–0.5Cu and Sn – 3 Ag – 1.5 Cu ∕ Sn – 3 Ag – 0.5 Cu composite flip-chip solder joints with Ti ∕ Ni ( V ) ∕ Cu under bump metallurgy (UBM), bonded on Au ∕ Ni ∕ Cu substrate pads. The solder joints were...

...Yi-Shao Lai; Chiu-Wen Lee; Chin-Li Kao The high-temperature operation life test (HTOL) was conducted in this paper to study electromigration phenomena of solder interconnects in a flip-chip package assembly. We examined the fatigue reliability and morphological patterns of three solder compositions...

...) solders flip-chip devices high-temperature electronics flip-chip bump/UBM BGA lead-free solder reliability test In packages, defects are mostly found in solder joints. To meet the requirement of environment protection, the related research and development of the lead-free solder become...

...Bulu Xu; Xia Cai; Weidong Huang; Zhaonian Cheng Fracture mechanics approaches have been used to study reliability problems in electronic packages, in particular, adhesion related failure in flip chip assembly. It was verified in this work that the J-integral with a special flat rectangular contour...

...J.-B. Han Fracture mechanics is applied to flip-chip BGA design to avert die cracking from its backside. Fracture mechanics is integrated with the finite element analysis (FEA) and design of virtual experiments (virtual DOE) to analyze the effects of location and length of a die crack...