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Keywords: flip-chip
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041009.
Paper No: EP-21-1137
Published Online: December 1, 2021
...Fei Chong Ng; Mohamad Aizat Abas Recent advances in the micro-electronics industry have increased the demand for smaller and more compact package devices with higher performance. This paper presents an analytical multiparametric design optimization approach for the miniaturization of flip-chip...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. March 2022, 144(1): 010803.
Paper No: EP-21-1007
Published Online: August 6, 2021
... variation of flip-chip underfill process that is attached on the top of a rotating disk was proposed to enhance the capillary underfill flow and thus decrease the filling time. [ 15 ] • Capillary 2008 • Capillary • FDM numerical simulation • Flow visualization • New numerical simulation approach...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Design Innovations
J. Electron. Packag. September 2010, 132(3): 035001.
Published Online: September 30, 2010
...Pin J. Wang; Chin C. Lee Silver flip-chip joints between silicon (Si) chips and copper (Cu) substrates were fabricated using a solid-state bonding process without any solder and without flux. The bonding process was performed at 250 ° C , compatible with typical reflow temperature for lead-free...
Journal Articles
Journal Articles
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 446–451.
Published Online: January 13, 2005
...) solders flip-chip devices high-temperature electronics flip-chip bump/UBM BGA lead-free solder reliability test In packages, defects are mostly found in solder joints. To meet the requirement of environment protection, the related research and development of the lead-free solder become...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2001, 123(1): 58–63.
Published Online: October 29, 1999
...J.-B. Han Fracture mechanics is applied to flip-chip BGA design to avert die cracking from its backside. Fracture mechanics is integrated with the finite element analysis (FEA) and design of virtual experiments (virtual DOE) to analyze the effects of location and length of a die crack...