... they are stiffer than solder. Therefore, the all-copper-connection was selected in this work to investigate the modeling aspects and simplifications in high density flip-chip connections. finite element analysis flip-chip devices optimisation 28 05 2010 24 08 2011 09 12 2011 09 12...

..., pure Ag joints have superior electrical and thermal properties. 27 01 2011 13 06 2011 30 09 2011 30 09 2011 bonding processes chromium copper electric properties flip-chip devices gold packaging silver soldering thermal expansion silver joints flip-chip...

... inspection by a synchrotron radiation X-ray microtomography system. 11 08 2010 26 03 2011 23 06 2011 23 06 2011 automatic optical inspection computerised tomography crack detection flip-chip devices integrated circuit interconnections integrated circuit reliability...

..., underfill material properties are crucial to package reliability performance ( 1 2 ). amine-based phenolic-based reliability underfill adhesion ball grid arrays flip-chip devices fracture toughness testing plastic packaging reliability thermal expansion Young's modulus 06 08...

... 08 12 2010 chip-on-board packaging Couette flow flip-chip devices interconnections reflow soldering solders viscosity wafer bonding flip chip no flow viscous misalignment self-alignment solder wetting dynamics While next generation flip chip processing holds many...

... experiments. The experimental results prove that the optimal LED has good integral quality, which is above industrial standard. 03 03 2009 19 09 2010 24 11 2010 24 11 2010 bonding processes electronics packaging flip-chip devices light emitting diodes principal component...

... process electronic packaging integrated circuits flip-chip devices integrated circuit bonding 31 08 2009 01 05 2010 30 09 2010 30 09 2010 2010 American Society of Mechanical Engineers ...

... underfilled with one of five different materials after soldering with SnCu, SAC305, and SnPb. adhesion copper alloys flip-chip devices lead alloys reliability solders stress analysis thermal expansion thermal shock tin alloys First, however, a different set of chips was bumped with SnPb...

... of interface delamination between epoxy molding compound and silicon die in the flip chip ball grid array package. 14 02 2009 10 01 2010 19 03 2010 19 03 2010 ball grid arrays delamination finite element analysis flip-chip devices integrated circuit reliability shrinkage...

... 09 2008 11 07 2009 21 10 2009 data communication electronics packaging flip-chip devices light emitting diodes optical fibre networks POF flip-chip LED light coupling efficiency TIR Recent years have witnessed a phenomenal growth in bandwidth demand...

...-chip devices lead mass spectroscopic chemical analysis solders tin flip chip fine pitch high I/O density no-flow underfill void formation gas chromatography-mass spectrum chemical reaction Increasing demand for high performance devices initiated the development of flip chip...

...-chip devices interconnections reliability thermal analysis flip chip package capillary-flow underfill no-flow underfill assembly process warpage reliability The F/C packages used in this paper consisted of silicon chips with Sn-3Ag-0.5Cu solder bumps and conventional polyimide...

... electromigration failure analysis flip-chip devices gold alloys metallisation nickel alloys silver alloys solders substrates tin alloys In a flip-chip package, bonding is established by intermetallic compounds (IMCs) formed between solder and pad metallization. The solder joint is in general...

... for 6.35 × 6.35 × 0.6 mm 3 flip chips and flip chips (“SiMAF;” Siemens AG) with lead-free solder bumps. chip scale packaging electronics packaging flip-chip devices laser beam applications light interferometry solders thermoelasticity ultrasonic applications laser ultrasound flip chip...

.... Flip chip test vehicle 25 07 2005 19 03 2008 17 11 2008 delamination electronics packaging fatigue testing flip-chip devices life testing nanostructured materials passivation reliability silicon compounds thermal shock thermomechanical treatment Underfill...

... ball grid arrays ceramic packaging computational fluid dynamics deformation finite element analysis flip-chip devices integrated circuit interconnections integrated circuit packaging integrated circuit reliability light interferometry plastic packaging thermal expansion thermomechanical...

..., the measured insertion loss is less than 3 dB for frequencies of up to 35 GHz and the return loss is higher than 15 dB for frequencies of up to 29 GHz using CPS flip-chip configuration. 11 12 2007 09 04 2008 17 11 2008 coplanar waveguides flip-chip devices integrated circuit...

... electromigration is responsible for metallization failures that lead to an excessive increase in the resistance of the solder joints. electromigration flip-chip solder joint reliability Sn–Ag–Cu Cu weight content copper alloys electromigration flip-chip devices gold nickel reliability...

... finite element analysis flip-chip devices integrated circuit packaging silver alloys soldering solders tin alloys voids (solid) electromigration Sn-3.0Ag-0.5Cu current crowding interfacial reaction finite element analysis To meet the higher performance and miniaturization...

...-Hall , Englewood Cliffs, NJ . 14 08 2007 07 01 2008 01 08 2008 flip-chip devices inspection modal analysis soldering solders surface mount technology Today’s electronic devices are compact, miniature, and high density, and surface mount technology is used...